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    GSDC165D

    Abstract: GSDC165GD BGA L
    Text: GSDC165D 165-Bump BGA 13 mm x 15 mm Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—165-Bump FPBGA (Package D)


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    PDF GSDC165D 165-Bump Dimensions--165-Bump GSDC165GD GSDC165D GSDC165GD BGA L