Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HBGA520 package SOT1088-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x