lb 123t
Abstract: HLB123T 123T LB123T
Text: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2006.02.20 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits
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HT200402
HLB123T
HLB123T
O-126
183oC
217oC
260oC
10sec
lb 123t
123T
LB123T
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Untitled
Abstract: No abstract text available
Text: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2004.09.30 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits
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Original
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PDF
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HT200402
HLB123T
HLB123T
O-126
183oC
217oC
260oC
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McKenzie
Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
Text: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing
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ASTM-B487-79
Abstract: McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130
Text: Ultra Low Profile DIP Sockets E L E C T R O N I C S MX McKenzie Socket Division Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking ULTRA LOW PROFILE OPTIONS
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Gold/200^
Tin/200ti
ASTM-B487-79
McKenzie socket division pga
b3910
McKenzie socket division
valox 420 salt
McKenzie
7344-A
McKenzie technology sip
157B
C130
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Untitled
Abstract: No abstract text available
Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold
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Gold/10p"
Gold/200
/Tin/200
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Untitled
Abstract: No abstract text available
Text: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell
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Gold/200nâ
Tin/200p"
Gold/200p"
Gold/10M
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McKenzie socket division
Abstract: No abstract text available
Text: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions
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Gold/200
Gold/10
Gold/200n,
Tin/200p"
McKenzie socket division
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QQ-B-750
Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
Text: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force
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Gold/200
Gold/200^
Gold/10
QQ-B-750
alloy 25 BeCu
McKenzie technology sip gold
400B
401B
402B
403B
410B
411B
ASTM-B487-79
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011B
Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
Text: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory
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CONTACT-160B
011B
MIL-P-13949
MIL-STD-109
Brass per QQ-B-626, Alloy 360
McKenzie
IEC-68-2-14
410B
zytel fr50
HT2004
dip molding machine
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BERG strip 40 pin single row
Abstract: E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79
Text: SIP Sockets E L E C T R O N I C S flMK McKenzie Socket Division SHORTER SOLDER TAIL — NO TRIMMING .1 6 5 4 ,1 9 , .265 1 (6.73) .100 .0 2 0 - OUR MOST POPULAR CONTACT .165 (4,19) .230 (5,84) .030 (0,76) .020 — (0,51) (2 .5 4 ) (0.51) f .290 (7.37) .125
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Tin/200M"
Gold/200M"
Gold/10M"
35nts
BERG strip 40 pin single row
E 877 11 94V-0
ASTM-B567
BERG 6 pin dual row
ASTM-B487-79
solder tail sip socket
McKenzie technology sip gold
TEFZEL
McKenzie technology pga
ASTM-A-754-79
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Untitled
Abstract: No abstract text available
Text: Elevated SIP Sockets ELECTRONICS mac M cKenzie S ocket D ivisio n Features • Elevated Sockets allow for greater package density • Allows stacking of PCB • Maximizes airfow • Available in Hi-Temp P P S Insulator material STANDARD TEMPERATURE — UL 94V-0 THERMOPLASTIC
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Untitled
Abstract: No abstract text available
Text: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS
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Gold/200p"
old/200
old/10pâ
old/200p
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mil-m-24519 molding plastics
Abstract: McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL
Text: Open and Closed Frame DIP Sockets E X TR A LO N G S O LD E R TAILS ,i§ .116 2,951 H r1 i U 1 1 , Fj83 (+, 65 x x x . T TYP . . . A ll contact styles ^ a r e available in our Patented PPC Disposable Carrier System. Specify PPC in part number. 1.17 3
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Gold/10p"
Gold/200
n/200
Gold/200fj"
mil-m-24519 molding plastics
McKenzie technology
McKenzie
01-4B
solder tail sip socket
001B
011B
113B
fr4 94v0
TEFZEL
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Untitled
Abstract: No abstract text available
Text: fUKC M cKenzie Socket Division — r .585 ' 14,86 •250 V (6,35) G .180 .018— (0,46) (4.57) TYP Specify Specify Plating/Material Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10p" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003
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McKenzie socket division
Abstract: No abstract text available
Text: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold
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Gold/200
Gold/10p"
Gold/200p"
Gold/10p
McKenzie socket division
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862S
Abstract: FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division
Text: fnKC McKenzie Socket Division — r .460 r .585 I 14,86 •250 (6,35) 1 ,210(11’,68) Plating/Material Specify Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10|j" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003 857S 200|j" Tin/Brass
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018-typ
862S
FR 530 POLYESTER UL
MIL-P-13949
924H
ASTM-B567
McKenzie technology sip
pga socket 867s
867s gold socket
McKenzie socket division
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mckenzie
Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
Text: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS
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CPPDC300C-118-
DC300P-090-FR50
DC600P-118-FR50
mckenzie
valox 420 salt
MIL-P-13949
DC600P-118-FR50
McKenzie socket division pga
zytel fr50
mil-m-24519 molding plastics
McKenzie technology sip
zytel fr 72
ASTM-B487-79
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Untitled
Abstract: No abstract text available
Text: Mal@4 -MaSe DIP Headers E L E C T R O N I C S fflex M cKenzie Socket Division Insulator Options Low Profile Options ,. 020- .050 1.27 I I T (0 .51 ) _ L .335 ,.085, I (2.]6) 1 (8,51) TYP I I £ 1 .104 (2,64) I-.070 (1,78) .299 (7.60) r TTT25 (3.18) .020 '
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TTT25
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st178
Abstract: diode E1110 CK705 ecg semiconductor replacement guide CS1237 ME1120 TE1088 1N942 1N733A Delco DTG-110B transistor
Text: S Y L V A N IA ECG S e m ic o n d u c to r L in eREPLACES OVER 35,000 TYPES introduction The ECG line of semiconductors is designed to minimize replacement parts inventory for the tech nician and yet economically meet replacement needs of the wide variety of entertainment equipment
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Sylvan58MC
09A001-00
66X0003-001
50746A
68X0003
68X0003-001
T-E0137
93B3-3
93B3-4
st178
diode E1110
CK705
ecg semiconductor replacement guide
CS1237
ME1120
TE1088
1N942
1N733A
Delco DTG-110B transistor
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triac zd 607
Abstract: hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p
Text: & SEM ICO N DU CTO R This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Professional service techni cian. The information contained herein is based on an analysis of the published
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thT404
ZV15A
ZY33A
ZT696
ZV15B
ZY33B
ZT697
ZT706
ZV27A
ZY62A
triac zd 607
hep c6004
2sb504
2SC 968 NPN Transistor
sje 607
motorola c6004
diode BY127 specifications
K872
af118
Motorola Semiconductor hep c3806p
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McKenzie
Abstract: 157b n001b McKenzie technology
Text: REV DESCRIPTION ECO. A10. DATE N-001BC INITIAL DRAWING RELEASE 1 /2 0 /9 9 ,020 ,050 THK 030 SCR 157B CQTY, 10 NDTESi 1. CONTACT MATERIAL! □UTER SHELLi BRASS ALLDY 36 0, 1 /2 HARD PER Q Q -B -6 2 6 . INNER CONTACT: BERYLLIUM COPPER, ALLDY 172 PER Q Q -C -5 3 3 .
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N-001BC
HT2004,
247-9B16
McKenzie
157b
n001b
McKenzie technology
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