bt 13 g
Abstract: 78R33 H-14 ISO-14001 S3CK225 S3FK225 64-QFP-1420F
Text: S3CK225/FK225 CalmRISC 8-Bit CMOS MICROCONTROLLER USER'S MANUAL Revision 1 Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at the time of publication. Samsung assumes no responsibility, however, for possible
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S3CK225/FK225
bt 13 g
78R33
H-14
ISO-14001
S3CK225
S3FK225
64-QFP-1420F
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MP3412
Abstract: SF 150 U11 4K MP3147 4ahffh 81H2 mp546
Text: 21-S3-CK215/FK215-092002 USER'S MANUAL S3CK215/FK215 CalmRISC 8-Bit CMOS Microcontroller Revision 1 S3CK215/FK215 1 PRODUCT OVERVIEW PRODUCT OVERVIEW OVERVIEW The S3CK215/FK215 single-chip CMOS microcontroller is designed for high performance using Samsung's new
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21-S3-CK215/FK215-092002
S3CK215/FK215
S3CK215/FK215
MSEG10
MSEG11
MSEG12
MSEG13
MSEG14
MP3412
SF 150 U11 4K
MP3147
4ahffh
81H2
mp546
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Samsung Tantalum Capacitor
Abstract: BT 816 FM24653 gr21 lcd circuit diagram for samsung H-29 H-35 ISO-14001 S3CB519 calmRISC
Text: 22-S3-CB519-032004 USER'S MANUAL S3CB519 8-Bit CMOS Microcontroller Revision 2 S3CB519 8-BIT CMOS MICROCONTROLLERS USER'S MANUAL Revision 2 Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at the
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22-S3-CB519-032004
S3CB519
PDSEG12
PDSEG11
PDSEG10
0/SEG55
1/SEG54
2/SEG53
3/SEG54
Samsung Tantalum Capacitor
BT 816
FM24653
gr21
lcd circuit diagram for samsung
H-29
H-35
ISO-14001
S3CB519
calmRISC
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SECI RESISTOR 8.2
Abstract: SECI resistor 47k
Text: S3CB519/FB519 1 PRODUCT OVERVIEW PRODUCT OVERVIEW OVERVIEW The S3CB519/FB519 single-chip CMOS microcontroller is designed for high performance using Samsung’s new 8-bit CPU core, CalmRISC. CalmRISC is an 8-bit low power RISC microcontroller. Its basic architecture follows Harvard style, that is, it has
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S3CB519/FB519
S3CB519/FB519
0/SEG55
2/SEG53
4/SEG51
6/SEG49
0/SEG47
2/SEG45
4/SEG43
SECI RESISTOR 8.2
SECI resistor 47k
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APPLE AUTHENTICATION COPROCESSOR 2.0C
Abstract: AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module emmc spi bridge iMX233 Apple Authentication
Text: August, 2010 i.MX2x Portfolio Overview CON-F0960 Shailendra Miglani Senior Field Applications Engineer, Freescale India TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc.,
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CON-F0960
MX233
APPLE AUTHENTICATION COPROCESSOR 2.0C
AR6102
AUTHENTICATION COPROCESSOR 2.0C
emmc roadmap
i.MX53
emmc
nokia x6 camera module
emmc spi bridge
iMX233
Apple Authentication
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Robinson Nugent idh
Abstract: BT 812 BT-224
Text: Robinson Nugent Solderless Backplane Connectors >4 Sided Press-Fit Headers .025" Sq. Post IDH-PK Series • MIL-C-83503, DIN 41651 and BT-224 Compatible • FLEXPRESS compliant pin permits solderless mounting • 4-sided body provides complete pin protection and polarization
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MIL-C-83503,
BT-224
62olts
254fim)
Robinson Nugent idh
BT 812
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ROBINSON NUGENT IDH S4
Abstract: No abstract text available
Text: HEADERS 4 Sided Press-Fit Headers .025" Sq. Post IDH-PK Series MIL-C-83503, DIN 41651 and BT-224 Compatible FLEXPRESS compliant pin permits solderless mounting 4-sided body provides complete pin protection and polarization BACKPLANE Available with ROB EX® betterthan-gold plating
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MIL-C-83503,
BT-224
254fim)
ROBINSON NUGENT IDH S4
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Robinson Nugent idh
Abstract: BT224 BT-224 Robinson Nugent TG30 TR30
Text: HEADERS 4 Sided .025" sq. Post Headers IDH-PK Series MIL-C-83503, DIN 41651 and BT-224 Compatible 4-sided body provides complete pin protection and polarization Available with ROBEX better-than-gold plating For Recommended PC Board Layout See Page 351. Tabulations
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MIL-C-83503,
BT-224
Robinson Nugent idh
BT224
Robinson Nugent
TG30
TR30
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Robinson Nugent idh
Abstract: ROBINSON NUGENT IDH S3 ROBINSON NUGENT EL ROBINSON NUGENT TG Robinson Nugent din socket 16 pin
Text: HEADERS 4 Sided .025" sq. Post Headers IDH-PK Series MIL-C-83503, DIN 41651 and BT-224 Compatible 4-sided body provides complete pin protection and polarization Available with ROBEX better-than-gold plating For Recommended PC Board Layout See Page 351. Tabulations
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MIL-C-83503,
BT-224
Robinson Nugent idh
ROBINSON NUGENT IDH S3
ROBINSON NUGENT EL
ROBINSON NUGENT TG
Robinson Nugent din socket 16 pin
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Untitled
Abstract: No abstract text available
Text: C I R C UI T A S S E M B L Y CORP b'ìE D • 5 1 3 3 7 S A □□□!= □□ SOS « C A C _Uj IDC SOCKET ECONOMY LINE Features CONTACT Mass-terminates with .050 [1.27] center cable Single leaf side wipe contact designed to mate with .025 [0.64] square or round post
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CA-06FID-A
CA-SR06FID
CA-10FID-A
CA-10FID-A-SPT
CA-SR10FID
CA-14FID-A
CA-14FID-A-SPT
CA-SR14FID
CA-16FID-AID-A
CA-SR24FID
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Untitled
Abstract: No abstract text available
Text: C I R C UI T A S S E M B L Y CORP blE » • 2 1 3 3 7 S Ô D D G I R Q I 441 * C A C IDC SOCKET Features Mass-terminates with .050 [1.27] center cable Dual leaf side wipe contact designed to mate with .025 [o.64] square or round post Optional Polarizing Tab,
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UL94V-0
CA-34IDS-B
CA-34IDS-B-SPT
CA-SR34IDS
CA-40IDS-B
CA-40IDS-B-SPT
CA-SR40IDS
CA-50IDS-B
CA-50IDS-B-SPT
CA-SR50IDS
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Untitled
Abstract: No abstract text available
Text: CIR C UI T A S S E M B L Y CORP bTE 1> 2 1 3 3 75 8 OQQlfl'iT Tb3 H C A C IDC SOCKET Features Conforms to MIL-C-83503/7C Mass-terminates with .050 [ 1.27] center cable Single leaf side wipe contact designed to mate with .025 [0.64] square or round post Optional Polarizing Tab,
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MIL-C-83503/7C
UL94V-0
250/i
CA-26IDS2-B
CA-26IDS2-F-SPT
CA-26IDS2-B-SPT
CA-SR26IDS2
CA-34IDS2-F
CA-34IDS2-B
CA-34IDS2-F-SPT
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Untitled
Abstract: No abstract text available
Text: 2 4 PART NO. REVI5IQN5 CA-XXIDH-XX-XXX LTR ORDERING DESCRIPTION DATE APPROVED 10-01-86 J. MCA. SEE ECO 879 12-17-86 A. J . C 5EE ECO 932 07-I7-B7 I .M . D SEE ECO 2281 DL 02-01-95 A .J . E SEE ECO 2534 PH 05-02-96 A .J . F SEE DO 4082 JRL 7-10-00 G SEE DO 4109
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07-I7-B7
-----------------------2/95/EC
9Z61B-Z777
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WE 251
Abstract: semiconductor 4645 H C949
Text: DALLAS SEMICONDUCTOR DS2229 Word-Wide 8 Meg SRAM Stik PIN ASSIGNMENT FEATURES • Organized as a high density 512K x 16 bit Stik o • Fast access time of 85 ns • Unlimited write cycles • Employs popular JEDEC standard 80-position SIMM connector • Full ±10% operating range
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80-position
DS2229
DS2229
608-bit
80-pin
WE 251
semiconductor 4645 H
C949
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM332V104 AT KMM332V104AT Fast Page Mode 1Mx32 DRAM DIMM Low Power, 4K Refresh, 3.3V G EN ERA L DESCRIPTION The Samsung KMM332V104AT is a 1M bit x 32 Dynamic RAM high density memory module. The Samsung KMM332V104AT consists of two CMOS 1Mx16bit DRAMs in 44-pin TSOP-II packages
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KMM332V104AT
1Mx32
KMM332V104AT-L7
KMM332V104AT-L8
KMM332V104
1Mx16bit
44-pin
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE 32 Mega Byte KMM53981OOAKM Fast Page Mode 8Mx39 DRAM SIMM , 2K Refresh , 5V Using 16M DRAM with 300 mil Package GENERAL DESCRIPTION FEATURES The Samsung KMM53981 OOAKM is a 8M bit x 39 Dynamic RAM high density memory module. The • Performance Range'
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KMM53981OOAKM
8Mx39
KMM53981
24-pin
72-pin
KMM5398100AKM
KMM53901
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE 32 Mega Byte KMM5368100A1/A1G Fast Page Mode 8Mx36 DRAM SIMM Module, 5V Using 16M DRAM with 400 mil Package GENERAL DESCRIPTION FEATURES • Performance Range: The Samsung KMM5368100A1 is a 8M bit x 36 Dynamic RAM high density memory module. The
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KMM5368100A1/A1G
8Mx36
KMM5368100A1
24-pin
20-pin
72-pin
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CX-53
Abstract: KM48C2100A cx53 KMM53221 KM48C2100AJ
Text: DRAM MODULE 8 Mega Byte KMM53221OOAU /AUG Fast Page Mode 2Mx32 DRAM SIMM , 2K Refresh, 5 Using 2Mx8 B/W DRAM J GENERAL DESCRIPTION FEATURES The Samsung KMM5322100AU is a 2M bit x 32 Dynamic RAM high density memory module. The Samsung KMM5322100AU consists of four CMOS
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KMM53221OOAU
2Mx32
KMM5322100AU
28-pin
72-pin
CX-53
KM48C2100A
cx53
KMM53221
KM48C2100AJ
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k3525
Abstract: km41c4100
Text: DRAM MODULE 32 Mega Byte KMM5368100AK/AKG Fast Page Mode 8Mx36 DRAM SIMM, 2K Refresh, 5V Using 16M DRAM with 300 mil Package GENERAL DESCRIPTION FEATURES The Samsung KMM5368100AK is a 8M bit x 36 Dynamic RAM high density memory module. The • Performance Range:
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KMM5368100AK/AKG
8Mx36
KMM5368100AK
24-pin
20-pin
72-pin
KMM5368100AK-6
k3525
km41c4100
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE 16 Mega Byte KMM5324000AKV/AKVG Fast Page Mode 4M x32 DRAM SIMM , 4K Refresh , 5V Using 16M DRAM with 300 mil Package . GENERAL DESCRIPTION FEATURES The Samsung KMM5324000AKV is a 4M bit x 32 Dynamic RAM high density memory module. The Samsung KMM5324000AKV consists of eight CMOS
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KMM5324000AKV/AKVG
KMM5324000AKV
24-pin
72-pin
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5362203
Abstract: No abstract text available
Text: DRAM MODULE 8 Mega Byte KMM5362203W/WG Fast Page Mode 2Mx36 DRAM SIMM , 1K Refresh, 5V Using 1Mx16 BAN DRAM and 1Mx4 Quad CAS DRAM G E N E R A L DESCRIPTIO N FEATURES • Performance Range. The Sam sung KM M 5362203W is a 2M bit x 36 D ynam ic RAM high density m em ory m odule The
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KMM5362203W/WG
2Mx36
1Mx16
362203W
72-pin
KMM5322203W
5362203
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jeida 88 pin memory card
Abstract: jeida dram 88 pin
Text: DRAM CARD 8 Mega Byte KMCV5322000 3.3V Operating 2M x 32 / 4M x 16 Fast Page Mode G ENER AL DESCRIPTIO N FEATURES • Performance range : The KMCV5322000 is the industry standard high capacity DRAM memory card and consists o( SAMSUNG'S advanced TSOP 1Mx4 DRAM devices
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KMCV5322000
x32/x16
jeida 88 pin memory card
jeida dram 88 pin
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM332V400AJ/AT KMM332V400AJ/AT Fast Page Mode 4Mx32 DRAM DIMM Low Power, 4K Refresh , 3.3V GENERAL DESCRIPTION FEATURES The S am sung K M M 332V 400A is a 4M bit x • Performance Range: tRAC 60ns 70ns 80ns 32 D ynam ic RAM high density m em ory module.
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KMM332V400AJ/AT
4Mx32
KMM332V400AJ/AT
24-pin
KMM332V400A
KMM332V400nly.
KMM332V400AJ-L
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE 16 Mega Byte KMM5364000AKH Fast Page Mode 4Mx36 DRAM SIMM , 4K Refresh , 5V Using 16M DRAM with 300 mil Package G ENERA L DESCRIPTIO N FEATURES The Samsung KMM5364000AKH is a 4M bit x 36 Dynamic RAM high density memory module. The Samsung KMM5364000AKH consists of nine CMOS
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KMM5364000AKH
4Mx36
24-pin
72-pin
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