JESD22-B102-D
Abstract: No abstract text available
Text: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
|
Original
|
CPA1206*
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CPA1206E39R0FS-T10)
JESD22-B102-D
|
PDF
|
IPC-4101
Abstract: No abstract text available
Text: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
|
Original
|
CFA1206E50R0FS
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CFA1206E50R0FS-T10)
IPC-4101
|
PDF
|
60WX2
Abstract: ultravolt AA
Text: TABLE OF CONTENTS SINGLE OUTPUT HIGH VOLTAGE POWER SUPPLIES STANDARD AA Series Reduced-size product line with enhanced features . . . . . . . . . . . . . . . . . . . . . . . . . .4 High-voltage bias from 0 to 62V through 0 to 6kV @ 0 to 4W, 20W & 30W A Series
|
Original
|
|
PDF
|
FCLGA1366
Abstract: L5518 computer processor spec 45NM60 at80602002
Text: Intel Xeon® Processor L5518 8M Cache, 2.13 GHz, 5.86 GT/s Intel® QPI with SPEC Code(s) SLBFW Compare Queue (0) Send Feedback Home Intel® Processors Intel® Xeon® Processor Intel® Xeon® Processor 5500 Series ● Products ● Technology ● Communities●
|
Original
|
L5518
L5518
64-bit
FCLGA1366
computer processor spec
45NM60
at80602002
|
PDF
|
CS82TPCF
Abstract: PBGA376 EG20T SLJ42 CS82TPCF SLH7G
Text: Intel EG20T PCH Menu Language: Communities Find Content What Search English English Product Specs Intel® EG20T PCH Compare Queue 0 Intel® EG20T PCH Add to Compare Additional Information Quick Links Embedded Products formerly Topcliff Download Datasheet
|
Original
|
EG20T
com/products/52501/Intel-EG20T-PCH
CS82TPCF
PBGA376
SLJ42
CS82TPCF SLH7G
|
PDF
|
SAC266
Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.
|
Original
|
J-STD-012
SAC266
SAC405
IPC-6012
BGA Solder Ball compressive force
WLCSP stencil design
IPC-6012A
LATTICE SEMICONDUCTOR Tape and Reel Specification
IPC-4101
IPC-7525
|
PDF
|
FWE6300ESB
Abstract: NHE6300ESB Model 8812 TAG 8837 PMB 8815 E7210 300641-004US ich428 audio power sb 18751 FWE6300
Text: Intel 6300ESB I/O Controller Hub November 2007 Notice: The Intel® 6300ESB I/O Controller Hub may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on
|
Original
|
6300ESB
300641-004US
i7-2630QM/i7-2635QM,
i7-2670QM/i7-2675QM,
i5-2430M/i5-2435M,
i5-2410M/i5-2415M.
14-Nov-2011
FWE6300ESB
NHE6300ESB
Model 8812
TAG 8837
PMB 8815
E7210
300641-004US
ich428
audio power sb 18751
FWE6300
|
PDF
|
BGA1288
Abstract: rPGA-988 circuit diagram laptop motherboard CN80617005745AB arrandale cn80617 i3 laptop MOTHERBOARD pcb CIRCUIT diagram i7-600 Mobile INTEL nehalem CPU arrandale MSR
Text: Intel Core i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series Datasheet — Volume One This is volume 1 of 2. Refer to document 322813 for Volume 2 January 2010 Document Number: 322812-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
|
Original
|
i7-600,
i5-500,
i5-400
i3-300
i7-610E
11-Feb-2011
BGA1288
rPGA-988
circuit diagram laptop motherboard
CN80617005745AB
arrandale
cn80617
i3 laptop MOTHERBOARD pcb CIRCUIT diagram
i7-600 Mobile
INTEL nehalem CPU
arrandale MSR
|
PDF
|
W950
Abstract: W9513 W9502 W9522 W9521 W9506
Text: WINSLOW ADAPTICs Data Sheet – SOP to DIP Generic Adapters These adapters allow the prototyping of SOIC, SOJ, SSOP, TSOP and TSSOP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
|
Original
|
IPC4101A/21
W950
W9513
W9502
W9522
W9521
W9506
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Series 350000-11-RC RoHS/WEEE-Compliant SOIC-to-DIP Adapter FEATURES • A cost-effective means of upgrading to SOIC without changing your PCB layout • Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16] or 0.600 [15.24] centers
|
Original
|
350000-11-RC
IS410
IPC4101A/26
C36000
ASTM-B16-00
MIL-G-45204
AMS-QQ-N-290
20-350000-11-RC
24-350000-11-RC
20-350001-11-RC
|
PDF
|
IPC-ET-652
Abstract: IPC-6012 AMP-174218-2 dnp 011 IPC-SM-840 IPC-D-356 AMP174218-2 IPC 6012 H1188 EVB8700
Text: EVB8700 User Manual Copyright 2007 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed
|
Original
|
EVB8700
1/10W
1/16W
SCH-7054AZ
LAN8700
EVB8700
IPC-ET-652
IPC-6012
AMP-174218-2
dnp 011
IPC-SM-840
IPC-D-356
AMP174218-2
IPC 6012
H1188
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CP02M581.01 Rev D – Page 1 of 3 Product Family: Chip Power Resistor Part Number Series: CPA2512*####FS Construction: • High Purity Alumina ceramic Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations over
|
Original
|
CP02M581
CPA2512*
Sn100,
25ppm/Â
Sn60Pb40
CPA2512E27R0FS-T10)
|
PDF
|
SAE AMS-QQ-N-290
Abstract: AMS-QQ-N-290 FR406 IPC4101A/26 ASTM b16 ASTM B194 C17200 IS410 ASTM-B16-00 C36000
Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.
|
Original
|
FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
C36000
SAE AMS-QQ-N-290
AMS-QQ-N-290
ASTM b16
ASTM B194
C17200
ASTM-B16-00
|
PDF
|
Pentium E5400
Abstract: E5400 motherboard diagram circuit diagram motherboard ms 6323 Intel Pentium E5400 6321ESB X5492 E5400 intel LGA 1150 PIN diagram TMDG LGA 1155 Chipset 216
Text: Quad-Core Intel Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
|
Original
|
|
PDF
|
|
|
945G MOTHERBOARD CIRCUIT diagram
Abstract: Asus PC MOTHERBOARD CIRCUIT MANUAL ASUS P5 MOTHERBOARD CIRCUIT diagram asus f3 intel pentium d 805 Asus P5 Asus MOTHERBOARD CIRCUIT Asus PC MOTHERBOARD CIRCUIT MANUAL a4 82801GB circuit asus MOTHERBOARD pcb CIRCUIT diagram
Text: Intel Pentium® D Processor 800Δ Sequence Datasheet – On 90 nm Process in the 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ February 2006 Document Number: 307506-003 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
|
Original
|
775-land
i7-2630QM/i7-2635QM,
i7-2670QM/i7-2675QM,
i5-2430M/i5-2435M,
i5-2410M/i5-2415M.
22-Sep-2011
945G MOTHERBOARD CIRCUIT diagram
Asus PC MOTHERBOARD CIRCUIT MANUAL
ASUS P5 MOTHERBOARD CIRCUIT diagram
asus f3
intel pentium d 805
Asus P5
Asus MOTHERBOARD CIRCUIT
Asus PC MOTHERBOARD CIRCUIT MANUAL a4
82801GB circuit
asus MOTHERBOARD pcb CIRCUIT diagram
|
PDF
|
82801IUX
Abstract: i524 intel Penryn micro-FCPGA BFR 965 pinout 82801i
Text: Intel Celeron® Processor 500Δ Series Datasheet For Platforms Based on Mobile Intel® 965 Express Chipset Family January 2008 Revision 003 Document Number: 317665-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELÆ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
|
Original
|
i7-2630QM/i7-2635QM,
07-Sep-2011
com/products/37135
i7-2670QM/i7-2675QM,
i5-2430M/i5-2435M,
i5-2410M/i5-2415M.
82801IUX
i524
intel Penryn
micro-FCPGA
BFR 965 pinout
82801i
|
PDF
|
LE80536VC001512
Abstract: MPGA479 ITP700
Text: Intel Celeron® M Processor Datasheet June 2004 Order Number: 300302-003 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
|
Original
|
03-Aug-2010
LE80536VC001512
MPGA479
ITP700
|
PDF
|
X5492
Abstract: E5400 motherboard diagram Pentium E5400 Platform Environment Control Interface Specification intel LGA 1150 PIN diagram LGA 1150 intel X5482 pinless p4 processor E5400 Intel Pentium E5400
Text: Quad-Core Intel Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
|
Original
|
18-Aug-2010
X5492
E5400 motherboard diagram
Pentium E5400
Platform Environment Control Interface Specification
intel LGA 1150 PIN diagram
LGA 1150 intel
X5482
pinless p4 processor
E5400
Intel Pentium E5400
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Intel Core 2 Extreme Processor QX9775Δ Specification Update — on 45 nm Process in the 771-land LGA Package June 2008 Notice: The Intel® Core™2 Extreme processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
|
Original
|
QX9775
771-land
17-Feb-2009
|
PDF
|
LE80536
Abstract: RJ80536 SL8MM 249410 INTEL-CELERON le80538 ich7 82801FBM if k16 160v 170 RH80536
Text: R Mobile Intel Celeron® Processor 0.18µ in BGA2 and Micro-PGA2 Packages at 900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz, Low-voltage 600 MHz, Low-voltage 500 MHz, Low-voltage 400A MHz, and Ultra Low-voltage 600 MHz, Ultra Low-voltage 500 MHz
|
Original
|
i7-2630QM/i7-2635QM,
i7-2670QM/i7-2675QM,
i5-2430M/i5-2435M,
i5-2410M/i5-2415M.
12-Sep-2011
LE80536
RJ80536
SL8MM
249410
INTEL-CELERON
le80538
ich7
82801FBM
if k16 160v 170
RH80536
|
PDF
|
IPC-4101
Abstract: 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101
Text: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
|
Original
|
CPA1206*
Sn100,
25ppm/
Sn60Pb40
effecti00
MIL-STD-1285D)
CPA1206E39R0FS-T10)
IPC-4101
39R0
106G
208H
210F
JESD22-B102D
J-STD-002B
IPC4101
|
PDF
|
ISO STANDARDS SHEET METAL THINNING
Abstract: MIL-STD-883H Ultrasonic Cleaning Transducer IPC-4101-92 MIL-T-27730 SEM 2006 IPC-4101-95 AL wire bond spool color code ultrasonic transducer 150 khz ultrasonic proximity detector report file
Text: MIL-STD-883H * METHOD 2018.5 SCANNING ELECTRON MICROSCOPE SEM INSPECTIONS 1. PURPOSE. This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice. SEM inspection is not required on planar oxide interconnect
|
Original
|
MIL-STD-883H
ISO STANDARDS SHEET METAL THINNING
MIL-STD-883H
Ultrasonic Cleaning Transducer
IPC-4101-92
MIL-T-27730
SEM 2006
IPC-4101-95
AL wire bond spool color code
ultrasonic transducer 150 khz
ultrasonic proximity detector report file
|
PDF
|
POWER33
Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
Text: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related
|
Original
|
AN-9040
Power33
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDM3622,
FDM6296,
FDMC2523P,
IPCA610D
sac 305
IPC-SM-7525A
J-STD-001C
IPC-A-610D
IPC-4101B
FDMC8554
IPC-7525
FDMC2523P
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1109283 Universal PLCC ZIF Test Socket to .100 x .100 PGA Adapter Features: • 84 pin adapter for mounting Aries’ Series 537 Universal PLCC ZIF zero insertion force Sockets with interstitial footprint to .100 x .100 [2.54 x 2.54] PCB layout. Consult Data Sheet Nos. 10008
|
Original
|
FR-406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
C17200
1109283-TL
|
PDF
|