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    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		PDF SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		PDF 101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux