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    JEDEC DRAWING LGA Search Results

    JEDEC DRAWING LGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HMC1126ACEZ Analog Devices 24-LGA Visit Analog Devices Buy
    HMC1126ACEZ-R7 Analog Devices 24-LGA Visit Analog Devices Buy
    ADRF5731BCCZN-R7 Analog Devices 16 lead LGA Visit Analog Devices Buy
    ADRF5721BCCZN-R7 Analog Devices 16 lead LGA Visit Analog Devices Buy
    ADRF5731BCCZN Analog Devices 16 lead LGA Visit Analog Devices Buy

    JEDEC DRAWING LGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TQM969001 PCS Duplexer Applications • • • Coverage enhancement repeaters Femtocells Test Mobiles 3-pin 3.8x3.8mm leadless LGA package Product Features • • • • Functional Block Diagram Small form factor of 3.8 X 3.8 mm Max height of 1.2 mm Max Uplink/Downlink peak power of 38dBm


    Original     		PDF TQM969001 38dBm TQM969001

    1840g

    Abstract: TQM969001
    Text: TQM969001 PCS Duplexer Applications • • • Coverage enhancement repeaters Femtocells Test Mobiles 3-pin 3.8x3.8mm leadless LGA package Product Features • • • • Functional Block Diagram Small form factor of 3.8 X 3.8 mm Max height of 1.2 mm Max Uplink/Downlink peak power of 38dBm


    Original     		PDF TQM969001 38dBm TQM969001 1840g

    TQM9

    Abstract: JESD22-A114 TQM969001 TQM969001EVB Triquint duplexer cavity duplexer
    Text: TQM969001 PCS Duplexer Applications • • • Coverage enhancement repeaters Femtocells Test Mobiles 3-pin 3.8x3.8mm leadless LGA package Product Features • • • • Functional Block Diagram Small form factor of 3.8 X 3.8 mm Max height of 1.2 mm Max Uplink/Downlink peak power of 38dBm


    Original     		PDF TQM969001 38dBm TQM969001 TQM9 JESD22-A114 TQM969001EVB Triquint duplexer cavity duplexer

    cavity duplexer

    Abstract: SiP LGA
    Text: TQM969001 PCS Duplexer Applications • • • Coverage enhancement repeaters Femtocells Test Mobiles 3-pin 3.8x3.8mm leadless LGA package Product Features • • • • Functional Block Diagram Small form factor of 3.8 X 3.8 mm Max height of 1.2 mm Max Uplink/Downlink peak power of 38dBm


    Original     		PDF TQM969001 38dBm TQM969001 cavity duplexer SiP LGA

    Untitled

    Abstract: No abstract text available
    Text: PD-60325 iP2005APbF High Frequency Synchronous Buck Optimized LGA Power Stage Integrated Power Semiconductors, Driver IC, & Passives Features • • • • • • • • • • 40A Multiphase building block No de-rating up to TPCB = 95ºC Optimized for low power loss


    Original     		PDF PD-60325 iP2005APbF

    AN1047

    Abstract: iP2005APbF soa 01 AN1028 AN1029 C3225X5R1C106KT JESD22-A114 JESD22-A115 dc-dc converter 12v to 5v 3a
    Text: PD-60325 iP2005APbF High Frequency Synchronous Buck Optimized LGA Power Stage Integrated Power Semiconductors, Driver IC, & Passives Features • • • • • • • • • • 40A Multiphase building block No de-rating up to TPCB = 95ºC Optimized for low power loss


    Original     		PDF PD-60325 iP2005APbF AN1047 iP2005APbF soa 01 AN1028 AN1029 C3225X5R1C106KT JESD22-A114 JESD22-A115 dc-dc converter 12v to 5v 3a

    12v 30a pwm diagram

    Abstract: AN1028 AN1029 AN1047 JESD22-A114 JESD22-A115
    Text: iP2005CPbF PD-60360 Synchronous Buck Optimized LGA Power Block Features • • • • • • • • • 40A Multiphase building block No derating up to TPCB = 95ºC Optimized for low power loss Bias supply range of 4.5V to 7.0V Operation up to 1.5MHz Bi-directional current flow


    Original     		PDF iP2005CPbF PD-60360 iP2005C 12v 30a pwm diagram AN1028 AN1029 AN1047 JESD22-A114 JESD22-A115

    Untitled

    Abstract: No abstract text available
    Text: iP2005CPbF PD-60360 Synchronous Buck Optimized LGA Power Block Features • • • • • • • • • 40A Multiphase building block No derating up to TPCB = 95ºC Optimized for low power loss Bias supply range of 4.5V to 7.0V Operation up to 1.5MHz Bi-directional current flow


    Original     		PDF iP2005CPbF PD-60360 iP2005C

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		PDF LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow

    Untitled

    Abstract: No abstract text available
    Text: M24512 512 Kbit Serial I²C Bus EEPROM PRODUCT PREVIEW • Two Wire I2C Serial Interface Supports 400 kHz Protocol ■ Single Supply Voltage: – 4.5V to 5.5V for M24512 LGA – 2.5V to 5.5V for M24512-W – 1.8V to 3.6V for M24512-S ■ Write Control Input


    Original     		PDF M24512 M24512-W M24512-S 64Kx8

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		PDF 101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		PDF AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste

    socket lga 1156 pinout

    Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155
    Text: Intel Core i5-600, i3-500 Desktop Processor Series, Intel® Pentium® Desktop Processor 6000 Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines January 2011 Document Number:322912-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


    Original     		PDF i5-600, i3-500 LGA1156 E58389 socket lga 1156 pinout intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    lga1155 pinout

    Abstract: socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155
    Text: Desktop 3rd Generation Intel Core Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines TMSDG January 2013 Document Number: 326767-005


    Original     		PDF LGA1155 UL1439 lga1155 pinout socket lga 1155 pinout socket lga 1156 pinout lga1155 land profile pattern Intel socket 1156 PIN LAYOUT intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram REFLOW lga socket 1155 LGA 1155 PIN diagram REFLOW profile lga socket 1155

    intersil DATE CODE MARKING

    Abstract: intersil DaTE CODE intersil LOT TRACEABILITY MO-153-AB intersil PART MARKING ISL6406MREP ISL6406MREP-TK ISL6406MVEP ISL6406MVEP-TK TB347
    Text: ISL6406MREP, ISL6406MVEP Data Sheet December 18, 2007 Enhanced Product EP Single Synchronous Buck Pulse-Width Modulation (PWM) Controller FN6613.0 Features • Specifications per DSCC VID V62/08610 The ISL6406MREP and ISL6406MVEP are adjustable frequency, synchronous buck switching regulators optimized


    Original     		PDF ISL6406MREP, ISL6406MVEP FN6613 V62/08610 ISL6406MREP ISL6406MVEP intersil DATE CODE MARKING intersil DaTE CODE intersil LOT TRACEABILITY MO-153-AB intersil PART MARKING ISL6406MREP-TK ISL6406MVEP-TK TB347

    intersil DATE CODE MARKING

    Abstract: INTERSIL TRACEABILITY LOT PART MARKING
    Text: ISL6406MR, ISL6406MV Data Sheet November 11, 2011 Enhanced Product EP Single Synchronous Buck Pulse-Width Modulation (PWM) Controller FN6613.1 Features • Specifications per DLA VID V62/08610 The ISL6406MREP and ISL6406MVEP are adjustable frequency, synchronous buck switching regulators optimized


    Original     		PDF ISL6406MR, ISL6406MV FN6613 V62/08610 ISL6406MREP ISL6406MVEP ISL6406MVEP intersil DATE CODE MARKING INTERSIL TRACEABILITY LOT PART MARKING

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


    Original     		PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch

    Kyocera 4-pin ceramic package

    Abstract: X3015P
    Text: X3015P 15A DC-DC POL Data Sheet 3.0V to 6.0V Input • 0.75V to 4.0V Output X3015P First Member of the Family Benefits • One part for different input & output voltage ranges • One part with up to 15A output • Reduces total solution board area • Reduces discrete parts count by 90%


    Original     		PDF X3015P X3015P 330uF/6V 220uF/16V TPSD337M006R0045 CM32X7R106M10AB TPS227K016R0100 HM73-301R5) Kyocera 4-pin ceramic package

    Untitled

    Abstract: No abstract text available
    Text: High Voltage Synchronous Rectified Buck MOSFET Drivers ISL6208, ISL6208B Features The ISL6208 and ISL6208B are high frequency, dual MOSFET drivers, optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. They are


    Original     		PDF ISL6208, ISL6208B ISL6208 ISL6208B MS-012-AA FN9115