Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    JIG101 Search Results

    JIG101 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MC ATAU - Precision

    Abstract: No abstract text available
    Text: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h


    Original
    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision

    Untitled

    Abstract: No abstract text available
    Text: Skyworks Definition of Lead Pb -Free Products designated as Skyworks Lead (Pb)-Free conform to the regulatory and industry requirements as identified below: • EU RoHS 2 (recast)1 compliant • PFOS2 compliant •R  EACH3 compliant – Below threshold for Candidate List of Substances of Very High Concern for Authorization


    Original
    PDF JIG-1014 011/65/EU 006/122/EC SQ04-0073

    300044

    Abstract: No abstract text available
    Text: LM34919 40V, 600 mA Step Down COT Switching Regulator General Description The LM34919 Step Down Switching Regulator features all of the functions needed to implement a low cost, efficient, buck bias regulator capable of supplying 0.6A to the load. This buck


    Original
    PDF LM34919 300044

    Untitled

    Abstract: No abstract text available
    Text: Skyworks Definition of Green TM Products designated as Skyworks Green™ conform to the regulatory and industry requirements as identified below: • EU RoHS 2 recast 1 compliant • PFOS2 compliant •R  EACH3 compliant – Below threshold for Candidate List of Substances of Very High Concern for Authorization


    Original
    PDF JIG-1014 2011/65/EU 2006/122/EC SQ04-0074

    Untitled

    Abstract: No abstract text available
    Text: ACAC 0612, ACAS 0612 - Professional Vishay Beyschlag 专业薄膜芯片电阻阵列 Professional Thin Film Chip Resistor Array 特性 • 先进的薄膜技术  两对或四个相同阻值的电阻  低至 ±25ppm/K 的 TCR 追踪值  容差匹配低至 ±0.5%


    Original
    PDF 25ppm/K 2002/95/EC 2011/65/EU 2002/95/ECã 2011/65/EUã JS709A 02-Oct-12

    RB751V-40

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOD-323 Product Group Type No. SD101AWS SD101CWS RB751V-40 BAS70WS 1SS357 RB501V-40 MMDL101 MMBD717WS BAT42WS / BAT43WS BAT54HS / BAT54WS MMDL301 BAS40WS MMDL770 1SS404


    Original
    PDF OD-323 SD101AWS SD101CWS RB751V-40 BAS70WS 1SS357 RB501V-40 MMDL101 MMBD717WS BAT42WS RB751V-40

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-10 Package Weight mg 3800 Product Group Type No. MP1000 MP1010 MP1000G MP1010G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original
    PDF MP-10 MP1000 MP1010 MP1000G MP1010G 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DO-15 Package Weight mg 400 Product Group Type No. SB220 SB2200 SR220 SR2100 SF21 – SF27 HER151 HER158 HER201 HER208 FR151 FR157 FR201 FR207 1N5391 1N5399


    Original
    PDF DO-15 SB220 SB2200 SR220 SR2100 HER151 HER158 HER201 HER208 FR151

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation


    Original
    PDF ARS50AL ARS50JL 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOD-523 Package Weight mg 2 Product Group Type No. RB751S-40 1SS389 1SS388 BAT54X RB520S-30 RB521S-30 1SS387 1SS400 1SS422 BAS16X NSD914X BAS516 BZX584C2V0 BZX584C51


    Original
    PDF OD-523 RB751S-40 1SS389 1SS388 BAT54X RB520S-30 RB521S-30 1SS387 1SS400 1SS422

    GBJ25Q

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBJ-6 Package Weight mg 7000 Product Group Type No. GBJ6A – GBJ6M GBJ8A – GBJ8M GBJ15A GBJ15Q GBJ25A GBJ25Q GBJ35A GBJ35Q Component Material Doped Silicon*


    Original
    PDF GBJ15A GBJ15Q GBJ25A GBJ25Q GBJ35A GBJ35Q 2011/65/EU. GBJ25Q

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation


    Original
    PDF AR50AL AR50JL 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SMB Package Weight mg 93 Product Group Type No. SK12 – SK1200 MBRS230L MBRS2100L SK22 – SK2200 SS22 – SS210 SR32 – SR3200 SS32 – SS310 SR52 – SR5200 ER1A – ER1J


    Original
    PDF SK1200 MBRS230L MBRS2100L SK2200 SS210 SR3200 SS310 SR5200 MURS160 1SMB5913B

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-3P Package Weight mg 5600 Product Group Type No. S16D30C S16D200C S20D30C S20D200C S30D30C S30D200C S40D30C S40D200C S60D30C S60D200C S80D30C S80D200C


    Original
    PDF S16D30C S16D200C S20D30C S20D200C S30D30C S30D200C S40D30C S40D200C S60D30C S60D200C

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-8 Package Weight mg 5400 Product Group Type No. KBPC800 KBPC810 KBPC800G KBPC810G PB1000 PB1010 PB1000G PB1010G Component Die Doped Silicon* Die Attach


    Original
    PDF KBPC800 KBPC810 KBPC800G KBPC810G PB1000 PB1010 PB1000G PB1010G 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C35/C35M Package Weight mg 440 Product Group Type No. C3520, C3524, C3536 C35A – C35K G35160 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation


    Original
    PDF C35/C35M C3520, C3524, C3536 G35160 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-P Package Weight mg 21000 Product Group Type No. KBPC1000P KBPC1012P KBPC1500P KBPC1512P KBPC2500P KBPC2512P KBPC3500P KBPC3512P KBPC4000P KBPC4012P


    Original
    PDF KBPC1000P KBPC1012P KBPC1500P KBPC1512P KBPC2500P KBPC2512P KBPC3500P KBPC3512P KBPC4000P KBPC4012P

    Untitled

    Abstract: No abstract text available
    Text: 1 NOTES: A 2 3 4 5 6 8 7 SPECIFICATIONS: Impedance: 50 OHMS Frequency Range: 0-4 GHz VSWR: 0 - 7 GHz, 1.5 MAX. Working Voltage: 1000 V rms MAX. Insulation Resistance: 5k M Ohms min. 9 10 REVISIONS 11 12 ZONE REV. DESCRIPTION DATE DRAWN BY ECR NUMBER ALL A


    Original
    PDF 5M-1994

    Untitled

    Abstract: No abstract text available
    Text: ACAS 0612 - Professional www.vishay.com Vishay Beyschlag Professional Thin Film Chip Resistor Array FEATURES • Advanced thin film technology • Two pairs or four equal resistor values • TCR down to ± 25 ppm/K • Tolerance down to ± 0.5 % • Pure Sn termination on Ni barrier layer


    Original
    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    1000ppm

    Abstract: FE c04 TBTO
    Text: 書き込み仕様書/依頼書 ご依頼区分: 新規 / リピート FPS №※ 1.ご依頼元 貴社名 ※印はフラッシュサポートグループで記入致します。 発行日 承認 〒 ご住所 部署名 TEL 2.書き込みデバイスマスター情報


    Original
    PDF

    JIG101

    Abstract: MXO45 MXO45HS MXO45HSLV MXO45LV
    Text: PRODUCT CHANGE NOTIFICATION PCN#: PCM-0668 PCN Date: 16 November, 2005 Product Families Affected Crystals: MP Series, ATS Series and ATS-SM Series Oscillators: MXO45, MXO45T, MXO45HS, MXO45HST, MXO45LV, MXO45TLV, MXO45HSLV and MXO45HSTLV Reason For Change


    Original
    PDF PCM-0668 MXO45, MXO45T, MXO45HS, MXO45HST, MXO45LV, MXO45TLV, MXO45HSLV MXO45HSTLV 2002/95/EC, JIG101 MXO45 MXO45HS MXO45LV

    JIG-101

    Abstract: selenium EN5395 Beryllium Compounds Information Enpirion en5395qi Information Enpirion en5396qi
    Text: Material Declaration Data Sheet ENPIRION Date Company Name Company Address Aug 12 2008 Enpirion, Inc 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 908-575-7550 www.enpirion.com EN5395QI, EN5396QI Voltage Mode Synchronous Buck PWM DC-DC Converter Module


    Original
    PDF EN5395QI, EN5396QI 10x12x1 58-pin JIG-101 RoHS-EN5395-5396 58QFN10x12x1 V01-08 JIG-101 selenium EN5395 Beryllium Compounds Information Enpirion en5395qi Information Enpirion en5396qi

    Nitto GE 100

    Abstract: nitto GE 121-990 Co3O4 JIG-101
    Text: Company URL for Additional Information http://www.national.com/quality/green/ National Semiconductor Contact Gerry Fields Title VP Quality Phone 1-408-721-8435 Part Number MSL Rating Peak Body Temp C MaxTime Sec Cycles 1 NA - - Weight (mg) Unit Type LM137WG/883


    Original
    PDF LM137WG/883 6-Sep-2006 Nitto GE 100 nitto GE 121-990 Co3O4 JIG-101

    Untitled

    Abstract: No abstract text available
    Text: 1 2 3 4 5 6 8 7 9 NOTES: ZONE 11 12 REV. DESCRIPTION DATE DRAWN BY ECR NUMBER A INITIAL DRAWING RELEASE 8/21/2012 PFR N/A SPECIFICATIONS: Impedance: 50 OHMS Frequency Range: 0-10 GHz VSWR: 0 - 7 GHz, 1.3 MAX. Working Voltage: 1000 V rms Max Insulation Resistance: 5k M Ohms min.


    Original
    PDF 5M-1994