JIG101 Search Results
JIG101 Datasheets Context Search
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MC ATAU - PrecisionContextual Info: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h |
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2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision | |
Contextual Info: Skyworks Definition of Lead Pb -Free Products designated as Skyworks Lead (Pb)-Free conform to the regulatory and industry requirements as identified below: • EU RoHS 2 (recast)1 compliant • PFOS2 compliant •R EACH3 compliant – Below threshold for Candidate List of Substances of Very High Concern for Authorization |
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JIG-1014 011/65/EU 006/122/EC SQ04-0073 | |
300044Contextual Info: LM34919 40V, 600 mA Step Down COT Switching Regulator General Description The LM34919 Step Down Switching Regulator features all of the functions needed to implement a low cost, efficient, buck bias regulator capable of supplying 0.6A to the load. This buck |
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LM34919 300044 | |
Contextual Info: Skyworks Definition of Green TM Products designated as Skyworks Green™ conform to the regulatory and industry requirements as identified below: • EU RoHS 2 recast 1 compliant • PFOS2 compliant •R EACH3 compliant – Below threshold for Candidate List of Substances of Very High Concern for Authorization |
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JIG-1014 2011/65/EU 2006/122/EC SQ04-0074 | |
Contextual Info: ACAC 0612, ACAS 0612 - Professional Vishay Beyschlag 专业薄膜芯片电阻阵列 Professional Thin Film Chip Resistor Array 特性 • 先进的薄膜技术 两对或四个相同阻值的电阻 低至 ±25ppm/K 的 TCR 追踪值 容差匹配低至 ±0.5% |
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25ppm/K 2002/95/EC 2011/65/EU 2002/95/ECã 2011/65/EUã JS709A 02-Oct-12 | |
RB751V-40Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOD-323 Product Group Type No. SD101AWS – SD101CWS RB751V-40 BAS70WS 1SS357 RB501V-40 MMDL101 MMBD717WS BAT42WS / BAT43WS BAT54HS / BAT54WS MMDL301 BAS40WS MMDL770 1SS404 |
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OD-323 SD101AWS SD101CWS RB751V-40 BAS70WS 1SS357 RB501V-40 MMDL101 MMBD717WS BAT42WS RB751V-40 | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-10 Package Weight mg 3800 Product Group Type No. MP1000 – MP1010 MP1000G – MP1010G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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MP-10 MP1000 MP1010 MP1000G MP1010G 2011/65/EU. | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DO-15 Package Weight mg 400 Product Group Type No. SB220 – SB2200 SR220 – SR2100 SF21 – SF27 HER151 – HER158 HER201 – HER208 FR151 – FR157 FR201 – FR207 1N5391 – 1N5399 |
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DO-15 SB220 SB2200 SR220 SR2100 HER151 HER158 HER201 HER208 FR151 | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation |
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ARS50AL ARS50JL 2011/65/EU. | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOD-523 Package Weight mg 2 Product Group Type No. RB751S-40 1SS389 1SS388 BAT54X RB520S-30 RB521S-30 1SS387 1SS400 1SS422 BAS16X NSD914X BAS516 BZX584C2V0 – BZX584C51 |
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OD-523 RB751S-40 1SS389 1SS388 BAT54X RB520S-30 RB521S-30 1SS387 1SS400 1SS422 | |
GBJ25QContextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBJ-6 Package Weight mg 7000 Product Group Type No. GBJ6A – GBJ6M GBJ8A – GBJ8M GBJ15A – GBJ15Q GBJ25A – GBJ25Q GBJ35A – GBJ35Q Component Material Doped Silicon* |
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GBJ15A GBJ15Q GBJ25A GBJ25Q GBJ35A GBJ35Q 2011/65/EU. GBJ25Q | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation |
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AR50AL AR50JL 2011/65/EU. | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SMB Package Weight mg 93 Product Group Type No. SK12 – SK1200 MBRS230L – MBRS2100L SK22 – SK2200 SS22 – SS210 SR32 – SR3200 SS32 – SS310 SR52 – SR5200 ER1A – ER1J |
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SK1200 MBRS230L MBRS2100L SK2200 SS210 SR3200 SS310 SR5200 MURS160 1SMB5913B | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-3P Package Weight mg 5600 Product Group Type No. S16D30C – S16D200C S20D30C – S20D200C S30D30C – S30D200C S40D30C – S40D200C S60D30C – S60D200C S80D30C – S80D200C |
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S16D30C S16D200C S20D30C S20D200C S30D30C S30D200C S40D30C S40D200C S60D30C S60D200C | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-8 Package Weight mg 5400 Product Group Type No. KBPC800 – KBPC810 KBPC800G – KBPC810G PB1000 – PB1010 PB1000G – PB1010G Component Die Doped Silicon* Die Attach |
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KBPC800 KBPC810 KBPC800G KBPC810G PB1000 PB1010 PB1000G PB1010G 2011/65/EU. | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C35/C35M Package Weight mg 440 Product Group Type No. C3520, C3524, C3536 C35A – C35K G35160 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation |
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C35/C35M C3520, C3524, C3536 G35160 2011/65/EU. | |
Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-P Package Weight mg 21000 Product Group Type No. KBPC1000P – KBPC1012P KBPC1500P – KBPC1512P KBPC2500P – KBPC2512P KBPC3500P – KBPC3512P KBPC4000P – KBPC4012P |
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KBPC1000P KBPC1012P KBPC1500P KBPC1512P KBPC2500P KBPC2512P KBPC3500P KBPC3512P KBPC4000P KBPC4012P | |
Contextual Info: 1 NOTES: A 2 3 4 5 6 8 7 SPECIFICATIONS: Impedance: 50 OHMS Frequency Range: 0-4 GHz VSWR: 0 - 7 GHz, 1.5 MAX. Working Voltage: 1000 V rms MAX. Insulation Resistance: 5k M Ohms min. 9 10 REVISIONS 11 12 ZONE REV. DESCRIPTION DATE DRAWN BY ECR NUMBER ALL A |
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5M-1994 | |
Contextual Info: ACAS 0612 - Professional www.vishay.com Vishay Beyschlag Professional Thin Film Chip Resistor Array FEATURES • Advanced thin film technology • Two pairs or four equal resistor values • TCR down to ± 25 ppm/K • Tolerance down to ± 0.5 % • Pure Sn termination on Ni barrier layer |
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2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 | |
1000ppm
Abstract: FE c04 TBTO
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JIG101
Abstract: MXO45 MXO45HS MXO45HSLV MXO45LV
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PCM-0668 MXO45, MXO45T, MXO45HS, MXO45HST, MXO45LV, MXO45TLV, MXO45HSLV MXO45HSTLV 2002/95/EC, JIG101 MXO45 MXO45HS MXO45LV | |
JIG-101
Abstract: selenium EN5395 Beryllium Compounds Information Enpirion en5395qi Information Enpirion en5396qi
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EN5395QI, EN5396QI 10x12x1 58-pin JIG-101 RoHS-EN5395-5396 58QFN10x12x1 V01-08 JIG-101 selenium EN5395 Beryllium Compounds Information Enpirion en5395qi Information Enpirion en5396qi | |
Nitto GE 100
Abstract: nitto GE 121-990 Co3O4 JIG-101
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LM137WG/883 6-Sep-2006 Nitto GE 100 nitto GE 121-990 Co3O4 JIG-101 | |
Contextual Info: 1 2 3 4 5 6 8 7 9 NOTES: ZONE 11 12 REV. DESCRIPTION DATE DRAWN BY ECR NUMBER A INITIAL DRAWING RELEASE 8/21/2012 PFR N/A SPECIFICATIONS: Impedance: 50 OHMS Frequency Range: 0-10 GHz VSWR: 0 - 7 GHz, 1.3 MAX. Working Voltage: 1000 V rms Max Insulation Resistance: 5k M Ohms min. |
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5M-1994 |