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    Text: _ I_ Bestickungsplan - contact layout bestickt - assemble Œ-Zane für durchkontaktiertE M e r 0 0.6 «us Com pliant zane fa r th ru hale 0 0l6m b 3 *4 50 max. I—*- S3 % £ CO Y 17.4 19.85 LochbU für Leiterplatte BesiQckungsserte Board hale p atte rn


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