Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    KKK155 Search Results

    KKK155 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ALLOY 52

    Abstract: JJJ142 JJJ245 AAA118 DDD131 DDD338 FFF122 Alumin
    Text: CASE STYLES OUTLINE DIMENSIONS inch mm case no. A AAA118 BBB123 CCC127 B C 1.50 .50 .935 38.10 12.70 23.75 .145 3.69 .040 1.100 1.02 27.94 F G H .19 .400 4.83 10.16 .030 .488 .76 12.40 2.25 1.38 1.24 .50 57.15 35.05 31.50 12.70 .150 3.100 3.81 78.74 7.00


    Original
    PDF AAA118 BBB123 CCC127 DDD131 DDD338 EEE132 FFF122 GGG126 HHH141 ALLOY 52 JJJ142 JJJ245 AAA118 Alumin

    Microcontroller Handbook

    Abstract: power amplifier 3000W with PCB
    Text: Beratung und Vertrieb: SF/2010 IF RF MICROWAVE COMPONENTS GUIDE TM finds the model you need, Instantly. For pricing / availability, complete specifications, data sheets, RoHS compatibility, performance data /curves, pcb layouts, drawings shopping online, see minicircuits.com


    Original
    PDF SF/2010 Microcontroller Handbook power amplifier 3000W with PCB

    XX112

    Abstract: T0-15 T011A BK377 KKK155 RRR137 TT100 WW107 YY101 YY161
    Text: tape and reel packaging for surface mount devices Design-For-Assembly DFA and Design-For-Manufacture (DFM) stand tall alongside CAD/CAM in the quest to optimize profitability, production efficiency and equipment operating usage. Automation of surface-mount assembly by the use of pick-andplace equipment to handle tiny components has been enhanced by


    Original
    PDF 13-inch T-001 T-002 T-003 T-004 T-005 T-006 T-007 T-008 T-009 XX112 T0-15 T011A BK377 KKK155 RRR137 TT100 WW107 YY101 YY161

    ysw-2-50dr

    Abstract: profile wave soldering KKK155 TT100 ysw-2
    Text: Practical Considerations For Attaching Surface-mount Components The photos included illustrate some of these components soldered to circuit boards. What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow


    Original
    PDF TT100, KKK155 200oC 72-inch AG191 275oC. ysw-2-50dr profile wave soldering KKK155 TT100 ysw-2

    uhf linear amplifier module MAV-11

    Abstract: mini circuits 15542 zhl 1042j mini circuits 15542 zem-4300 VCO MCL POS-1060 ups circuit schematic diagram 1000w 15542 ZAPD-2 MINI-CIRCUIT 15542 model no zhl-1-2w mcl sbl-1 MIXER mini circuits 15542 ZFM sim 900A
    Text: IF RF MICROWAVE COMPONENTS GUIDE TM SF/2010 finds the model you need, Instantly. For pricing / availability, complete specifications, data sheets, RoHS compatibility, performance data /curves, pcb layouts, drawings shopping online, see minicircuits.com


    Original
    PDF SF/2010 uhf linear amplifier module MAV-11 mini circuits 15542 zhl 1042j mini circuits 15542 zem-4300 VCO MCL POS-1060 ups circuit schematic diagram 1000w 15542 ZAPD-2 MINI-CIRCUIT 15542 model no zhl-1-2w mcl sbl-1 MIXER mini circuits 15542 ZFM sim 900A

    Untitled

    Abstract: No abstract text available
    Text: SPDT/SP4T GJ Mini-Circuits GaAs, reflective and dc to 5 GHz case style selection see case style outline drawings VSW A VSW FREQ. GHz YSW A YSW INSERTION LOSS, dB ldB COMPRESSION, dBm FREQUENCY BAND A B C * MODEL NO. Typ. Min. Typ. Min. Typ. Min. Typ. Min.


    OCR Scan
    PDF GSWA-2-30DR)

    ITE 8572

    Abstract: 73X BLACK MARKING bu 3150 af SMAD16 SMA marking code LG sno 357 fl29 ll87 ad t004 uu215
    Text: tape and reel packaging for surface mount devices Design-For-Assembly DFA a nd Design-ForM anufacture (DFM) stand tall alongside CAD /C AM in the quest to optimize profit­ ability, production e fficie n cy a nd equipm ent operating usage. A utom ation of surface-m ount assembly


    OCR Scan
    PDF 13-inch ITE 8572 73X BLACK MARKING bu 3150 af SMAD16 SMA marking code LG sno 357 fl29 ll87 ad t004 uu215

    F6 DD52

    Abstract: dd52 ll87 mini circuits mcl-1 LA 4288
    Text: cuse s y es outline dim sni ions m m c D H J K 1 grams. NOTES* A 01 .770 19.56 .800 20.32 .385 9.78 .400 0.16 Ç 10 .400 10 16 .200 5.08 .20 5.08 .14 3.56 .031 .79 5.2 A1,B3,E1,B7 .480 12.19 .500 12.70 .390 9.91 .405 0.29 .5 0 5 '3 .230 5.84 .100 2.54


    OCR Scan
    PDF

    Untitled

    Abstract: No abstract text available
    Text: tape and reel packaging for surface mount devices Reel Design-For-Assembly DFA and Design-ForManufacture (DFM) stand tall alongside CAD/CAM in the quest to optimize profit­ ability, production efficiency and equipment operating usage. Automation of surface-mount assembly


    OCR Scan
    PDF 13-inch T-001 T-002 T-003 T-004 T-005 T-006 T-007

    4503 transformer

    Abstract: YSW2-50DR
    Text: Mini-Circuits/ TECHNICAL SECTION practical considerations for attaching surface-mount components The photos included illustrate some of these components soldered to circuit boards. What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic


    OCR Scan
    PDF KKK155 72-inch AG191 332-46c 800-654-794C 4503 transformer YSW2-50DR

    Untitled

    Abstract: No abstract text available
    Text: tape and reel packaging for surface mount devices Design-For-Assembly DFA a n d Design-For-Manufacture (DFM) stand tall alongside C AD /C AM in the quest to optimize profitabil­ ity, prod uction efficie n cy and e q u ip m e n t o p erating usage. A utom ation o f surface-m ount assembly by th e use o f pick-andp la ce equ ipm ent to handle tiny com ponents has been e n h a n ce d


    OCR Scan
    PDF 13-inch T-004 T-002 VNA-25,

    Untitled

    Abstract: No abstract text available
    Text: Switches GaAs 500 Surface M ountJ Spdt/S p4T WITH TTL Drivers DC to 5 GHz GSWA FREQ. A ft ft GHz ••ft. f1 O L ft E C t T f 1 INSERTION LOSS, dB Id B COMPRESSION, dBm YSWA YSW |geeRF/lF GSWA-4-30DR DC-3 FRDSKJiMCY BAND FRiQ yiN O YftA N !* M W IC Y ftA N D


    OCR Scan
    PDF GSWA-4-30DR YSW-2-50DR YSWA-2-50DR

    YSW-2-50dR

    Abstract: No abstract text available
    Text: Mini-Circuits/TECHNICAL SECTION practical considerations for attaching surface-mount components The photos included illustrate some of these components soldered to circuit boards. What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic


    OCR Scan
    PDF 72-inch AG191 YSW-2-50dR

    iw 1688

    Abstract: Mini-circuits marking code 350 pat ITE 8572 Marking c145 marking VU smb B1404
    Text: C a se S tyles K OUTLINE DIMENSIONS case no. c J K .400 10.16 .200 5.08 .20 5.08 .14 3.56 .031 .79 5.2 A1,B3,E1,B7 .210 5.33 .230 5.84 .100 2.54 .20 5.08 .14 3.56 .020 .51 2.3 A1,B4,E1,B7 .210 5.33 .370 9.40 .400 10.16 .200 5.08 .20 5.08 .14 3.56 .031 .79


    OCR Scan
    PDF

    dual y34

    Abstract: jsiq y344
    Text: C 3 Mini -Circuits' surface mount devices Case Style 1 2 3 4 5 6 7 8 moo 9 IO 11 12 13 Case Style Series Name XX211 M M M 168 AF190 W W 107 RRR137 AF320 BH292 YY101 YY161 BJ293 KK81 Q Q Q 130 X X I12 VNA, MSWT, MSW, MSWA VAM RAM MAR-SM, ERA-SM M AV-SM PAT


    OCR Scan
    PDF AG191 NNN150 KKK155 AT224 AN213 TTT166 TTT167 AH202 BK276 BK343 dual y34 jsiq y344