Untitled
Abstract: No abstract text available
Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.
|
Original
|
PDF
|
S8650
S8650
SE-171
KPIN1061E02
|
Untitled
Abstract: No abstract text available
Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.
|
Original
|
PDF
|
S8650
S8650
SE-171
KPIN1061E02
|
scintillator
Abstract: KPIN1061E02 S8650 SE-171
Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.
|
Original
|
PDF
|
S8650
S8650
SE-171
KPIN1061E02
scintillator
KPIN1061E02
|