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    JEDEC MO 224

    Abstract: LBGA224 MO-192 sot809
    Text: PDF: 2003 May 23 Philips Semiconductors Package outline SOT809-1 LBGA224: plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm A B D ball A1 index area A E A2 A1 detail X C e1 e 1/2 ∅v M b e ∅w M y1 C C A B C y T R P e N M L K


    Original
    OT809-1 LBGA224: MO-192 JEDEC MO 224 LBGA224 MO-192 sot809 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline SOT809-1 LBGA224: plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm A B D ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C T R P e N M L K J H G F E D C B A ball A1 index area e2


    Original
    OT809-1 LBGA224: MO-192 PDF