LCB1206-601
Abstract: LCB1812H-121 LCB1206-260 LCB-0805 LCB0805-400 LCB0603 LCB0603-121 LCB0805H-110 LCB1210
Text: LCB Multi-Layer Chip Beads Length Width Thickness LCB0603, LCB0805, LCB1206, LCB1210, LCB1806, LCB1812 APPLICATIONS To eliminate EMI/RFI attenuation and suppression on electr onic pr oducts Small VCRs , video cameras, hand-held TVs , DAT digital audio tape
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LCB0603,
LCB0805,
LCB1206,
LCB1210,
LCB1806,
LCB1812
CurrentCB0805-301
LCB1206-190
LCB1206-260
LCB1206-310
LCB1206-601
LCB1812H-121
LCB1206-260
LCB-0805
LCB0805-400
LCB0603
LCB0603-121
LCB0805H-110
LCB1210
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1806H
Abstract: LCB1210
Text: Multi-Layer I D Chip Beads L V-x D Terminal H h- LCB0805. LCB1206, LCB1210, LCB1806, LCB1812 APPLICATIONS • To eliminate EMI/RFI attenuation and suppression on electronic products ■ Small VCRs, video cameras, hand-held TVs, DAT digital audio tape ■ Communication devices
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LCB0805.
LCB1206,
LCB1210,
LCB1806,
LCB1812
LCB0603.
LCB1210
0805H
1806H
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lcm1812
Abstract: No abstract text available
Text: ESISI G E N E R A L CH A R A CTER ISTIC S Unlike other surface m ount components, chip inductors are relatively new to the market. Standards have yet to be estab lished. Designs vary from manufacturer to manufacturer. Soldering techniques and equipment also vary. At ISI we believe it
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LCB0805,
LCB1806
lcm1812
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LCB1210
Abstract: LCB0805/B
Text: aisi LCB M ULTI-LAYER CH IP BEA D S LC B 0 8 0 5 . L C B 1 2 0 6 . L C B 1 2 1 0 L C B 1 8 0 6 & LC B 1 8 12 FEA TU R ES •High inherent Q. ■Greater impedance per unit volume. ■Lower DC resistance reduces assembly time. ■Can be mounted with surface mounting
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LCB0805/B
HP4191A
HP419IA
LCBI210/A
206/A
HP419
1806/A
LCB1812/A
LCB1210
LCB0805/B
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