Untitled
Abstract: No abstract text available
Text: LCC Series - Large Size Multilayer Ceramic Chip Capacitors Holy Stone Multilayer Ceramic Chip Capacitors [ Large Size Ceramic Chip Capacitors ] LCC Series Features Applications Voltage Multipliers Power Supplies DC-DC Converters Surge protection Industrial control circuits
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100pF
50Vdc
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FT27C256R
Abstract: AT27C256 CDIL28
Text: Features • Fast Read Access Time • Low-Power CMOS Operation • • • • • • • – 100 µA max. Standby – 20 mA max. Active at 5 MHz JEDEC Standard Packages – 28-Lead 600-mil Ceramic – 32-Lead Ceramic LCC +Ceramic Custom 5V ± 10% Supply
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28-Lead
600-mil
32-Lead
Mil-Std-883C
FT27C256R
FT27C256R
144-bit
AT27C256
CDIL28
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Untitled
Abstract: No abstract text available
Text: FTS88130 128Kx8 High Speed SRAM FEATURES Advanced CMOS Technology Fast tOE Automatic Power Down Packages —32-Pin 300 mil DIP and SOJ —32-Pin 400 mil SOJ —32-Pin 600 mil Ceramic DIP —32-Pin 400 mil Ceramic DIP —32-Pin Solder Seal Flatpack —32-Pin LCC 400 x 820 mil [Two-Sided]
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128Kx8
FTS88130
--32-Pin
FT88130
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Capacitor 0.01 uF
Abstract: No abstract text available
Text: HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable / Disable function. Reflow capable. • APPLICATIONS:
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10ppm
20ppm
25ppm
30ppm
35ppm
50ppm
Capacitor 0.01 uF
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Untitled
Abstract: No abstract text available
Text: 5.0 Vdc HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL and ASL1 7.0 x 5.08 x 1.8 mm FEATURES: • • • • Leadless chip carrier LCC , Low profile. HCMOS and TTL compatible. Tristate Enable /Disable function. Reflow capable.
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10ppm
20ppm
25ppm
30ppm
35ppm
50ppm
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit U VEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV256X32V
66-pin
1024KX8,
512KX
256KX32
250ns
512KX16
30A014-33
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit UVEPROM MICROSYSTEMS DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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OCR Scan
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DPV256X32V
DPV256X32V
66-pin
1024KX8,
512KX
256KX
250ns
120ns
150ns
200ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit UVEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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OCR Scan
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PDF
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DPV256X32V
DPV256X32V
66-pin
1024KX8,
512KX
256KX32
250ns
125-C
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12 SQ 045 JF
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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PDF
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DPV3232VA
DPV3232VA
66-pin
250ns
128KX8,
64KX16
32KX32
E75R415
12 SQ 045 JF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 0.5 Megabit UVEPROM MICROSYSTEMS DPV32X16A DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of tw o 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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OCR Scan
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DPV32X16A
DPV32X16A
40-pin
250ns
120ns
150ns
200ns
64KX8
32KX16
00G138S
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV3232VA
DPV3232VA
66-pin
32Kx32
250ns
128KX8,
64KX16
275R41S
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs
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DPS3232V
DPS3232V
66-pin
128Kx32
256Kx32,
128KX8,
64KX16
32KX32
30A014-10
275T415
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 2 Megabit UVEPROM MICROSYSTEMS DPV128X16A DESCRIPTION: The D P V 128X 16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV128X16A
40-pin
250ns
120ns
150ns
170ns
200ns
QDD1311
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Untitled
Abstract: No abstract text available
Text: □PM DPV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV3232VA
DPV3232VA
66-pin
250ns
128KXS,
64KX16
32KX32
30A014-60
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Untitled
Abstract: No abstract text available
Text: □PM * r ~ T DPV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV3232VA
DPV3232VA
66-pin
120ns
150ns
170ns
200ns
250ns
DPV12832V
128KX8,
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A143
Abstract: A140 A141 DPV3232V "32K x 32" SRAM
Text: DPV3232V Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTIO N : The DPV3232V is a 66-pin Pin Grid Array PGA consisting o f four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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DPV3232V
DPV3232V
66-pin
250ns
Voltage30
I/025
I/029
I/026
I/028
I/027
A143
A140
A141
"32K x 32" SRAM
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Untitled
Abstract: No abstract text available
Text: DPV12832VA □PM Dense-Pac Microsystems, Inc. ^ HIGH SPEED 128K X 32 UVEPROM VERSAPAC DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV12832VA
DPV12832VA
66-pin
250ns
I/017
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Untitled
Abstract: No abstract text available
Text: DPS8X16A Dense-Pac Microsystems, Inc. HIGH SPEED 8K X 16 CMOS SRAM PCA MODULE O PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin Grid Array PGA consisting of two 8K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPS8X16A
DPS8X16A
40-pin
150ns
30A05000
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Untitled
Abstract: No abstract text available
Text: DPV12832VA H IGH SPEED 128K X 32 UVEPRO M VERSAPAC Microsystems, Inc. 0 DESCRIPTION: The D PV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV12832VA
DPV12832VA
66-pin
512KX8,
250ns
120ns
150ns
170ns
200ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit CMOS UVEPROM DPV12832VA M I C R O S Y S T E M S DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X8 CMOS UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal
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DPV12832VA
66-pin
256KX
250ns
30A014-62
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20-PAD
Abstract: 26LS32 pin diagram
Text: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are
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PDF
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20-pad
26LS32 pin diagram
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs
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DPS3232V
66-pin
128Kx32
256Kx32,
DPS3232V
12SKX8.
64KX16
30A014-10
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV3232VA
66-pin
250ns
170ns
200ns
250ns
30A014-60
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Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs
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DPS3232V-35I-TI
DPS3232V-35I-TI
66-pin
128KX8,
30A014-15
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