LFBGA Search Results

LFBGA Result Highlights (5)

Part	Manufacturer	Description
UPD70F3134AF1-EN4-A	Renesas Electronics Corporation	32-bit Microcontrollers, LFBGA, /
D6417709SBP100BV	Renesas Electronics Corporation	32-bit Microcontrollers, LFBGA, /
UPD703131BYF1-XXX-EN4-A	Renesas Electronics Corporation	32-bit Microcontrollers, LFBGA, /
UPD703134BYF1-XXX-EN4-A	Renesas Electronics Corporation	32-bit Microcontrollers, LFBGA, /
UPD703132BYF1-XXX-EN4-A	Renesas Electronics Corporation	32-bit Microcontrollers, LFBGA, /

LFBGA Price and Stock

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NXP Semiconductors LFBGAMWA SOCKET MINI GRID 416-PGA 1.0MM
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LFBGAMWA	Box			1	1 $189.25 10 $189.25 100 $189.25 1000 $189.25 10000 $189.25	Buy Now
Avnet Americas	LFBGAMWA	Box			1	1 $188.16875 10 $185.11797 100 $181.68 1000 $181.68 10000 $181.68	Buy Now
Newark	LFBGAMWA	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
NXP Semiconductors	LFBGAMWA					1 $180 10 $180 100 $180 1000 $180 10000 $180	Buy Now
NXP Semiconductors LFBGAMH1A 100 PIN 1.0MM PGA SOCKET SPACER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LFBGAMH1A	Bulk			1	1 $251.34 10 $251.34 100 $251.34 1000 $251.34 10000 $251.34	Buy Now
Avnet Americas	LFBGAMH1A	Box			1	1 $199.1164 10 $198.1005 100 $192.4128 1000 $192.4128 10000 $192.4128	Buy Now
Newark	LFBGAMH1A	Bulk			1	1 $218.79 10 $212.67 100 $200.43 1000 $200.43 10000 $200.43	Buy Now
NXP Semiconductors	LFBGAMH1A					1 $180 10 $180 100 $180 1000 $180 10000 $180	Buy Now
NXP Semiconductors LFBGAMV1A 356 PIN 0.8MM PGA SOCKET SPACER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LFBGAMV1A	Bulk			1	1 $255 10 $255 100 $255 1000 $255 10000 $255	Buy Now
Avnet Americas	LFBGAMV1A	Box			1	1 $250.89165 10 $248.625 100 $244.8 1000 $244.8 10000 $244.8	Buy Now
Newark	LFBGAMV1A	Bulk			1	1 $291.72 10 $283.56 100 $267.24 1000 $267.24 10000 $267.24	Buy Now
NXP Semiconductors	LFBGAMV1A					1 $240 10 $240 100 $240 1000 $240 10000 $240	Buy Now
NXP Semiconductors LFBGADAZA DEVELOPMENT 1.0MM SKT 516-BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LFBGADAZA	Box			1	1 $856.8 10 $856.8 100 $856.8 1000 $856.8 10000 $856.8	Buy Now
Avnet Americas	LFBGADAZA	Box			1	1 $878.1208 10 $863.88385 100 $822.528 1000 $822.528 10000 $822.528	Buy Now
Newark	LFBGADAZA	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
NXP Semiconductors	LFBGADAZA					1 $840 10 $840 100 $840 1000 $840 10000 $840	Buy Now
NXP Semiconductors LFBGAML2A 156 PIN 1.0MM PGA SOCKET SPACER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LFBGAML2A	Bulk			1	1 $131.3 10 $131.3 100 $131.3 1000 $131.3 10000 $131.3	Buy Now
Avnet Americas	LFBGAML2A	Box			1	1 $110.7106 10 $104.4225 100 $94.0032 1000 $94.0032 10000 $94.0032	Buy Now
Mouser Electronics	LFBGAML2A					1 $112.97 10 $112.97 100 $112.97 1000 $112.97 10000 $112.97	Get Quote
Newark	LFBGAML2A	Bulk			1	1 $113.22 10 $107.1 100 $97.92 1000 $97.92 10000 $97.92	Buy Now
NXP Semiconductors	LFBGAML2A					1 $90 10 $90 100 $90 1000 $90 10000 $90	Buy Now

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LFBGA Datasheets (9)

Part	Manufacturer	Description	Datasheet Type	PDF
LFBGA114	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA144	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA40	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA48	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA56	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA64	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA84	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA96	NXP Semiconductors	Footprint for reflow soldering	Original	PDF
LFBGA-H	STATS ChipPAC	Fine Pitch Ball Grid Array	Original	PDF

LFBGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
STA2500D Abstract: 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500 Text: STA2500D Bluetooth V2.1 + EDR "Lisbon" for automotive applications Features • Based on Ericsson technology licensing baseband core (EBC) LFBGA48 (6x6x1.4mm; 0.8mm Pitch) ■ Bluetooth™ specification compliance: V2.1 + EDR (“Lisbon”) – Point-to-point, point-to-multipoint (up to 7	Original	STA2500D LFBGA48 STA2500D 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500	PDF
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	LFBGA208 OT631-2 OT631-2	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area	Original	LFBGA208: OT966-1	PDF
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	LFBGA169 OT1024-2 OT1024-2	PDF
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316	PDF
AD5532-2 Abstract: AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 mm ؋ 12 mm LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Read-Back Capability DSP/Microcontroller Compatible Serial Interface	Original	32-Channel, 14-Bit AD5532* 32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, AD5532-2 AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11	Original	LFBGA141: OT1079-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13	Original	LFBGA169: OT1024-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11	Original	LFBGA72: OT856-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-1 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b M M C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e	Original	LFBGA487: OT1077-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area ∅v ∅w b 1/2 e	Original	LFBGA228: OT821-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C V e U T R P N M L K e2 J H 1/2 e G F E D C	Original	LFBGA216: OT715-1 MO-205	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm A B D SOT893-1 ball A1 index area A E A2 A 1 detail X e1 e V T P M K H F D B C 1/2 e ∅v ∅w b M M y y1 C C A B C U e R N L e2 J 1/2 e G E C	Original	LFBGA240: OT893-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls B D SOT1019-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 3	Original	LFBGA208: OT1019-1	PDF

C3744 Abstract: No abstract text available Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Readback Capability DSP-/Microcontroller-Compatible Serial Interface Output Impedance	Original	32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, 32-Channel, C3744	PDF
sot751 Abstract: No abstract text available Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J	Original	LFBGA80: OT751-1 sot751	PDF
Untitled Abstract: No abstract text available Text: MAS 3587F Short Information MAS 3587F MPEG 1/2 Layer 3 Encoder/Decoder PLQFP64 or LFBGA81 Package The MAS 3587F is a single-chip MPEG layer 3 audio encoder/decoder designed for use in portable memory-based recording/playback applications. The MAS 3587F contains the DSP engine with embedded	Original	3587F PLQFP64 LFBGA81 3587F encoder/de61-517-0 6251-542-1SI Oct/2000	PDF
AD5517 Abstract: AD5517-1 AD5517-2 AD5517-3 Text: PRELIMINARY TECHNICAL DATA a 16-Channel 14-Bit Voltage-Output DAC AD5517-1/AD5517-2/AD5517-3* Preliminary Technical Data FEATURES High Integration: 16-channel DAC in 12x12 mm 2 LFBGA Guaranteed Monotonic Low Power, SPI TM, MICROWIRETM and DSP-Compatible 3-Wire Serial Interface	Original	16-Channel 14-Bit AD5517-1/AD5517-2/AD5517-3* 12x12 AD5517-1) AD5517-2) AD5517-3) -40oC AD5517 AD5517-1 AD5517-2 AD5517-3	PDF
sot894 Abstract: No abstract text available Text: Package outline Philips Semiconductors LFBGA280: plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm B D SOT894-1 A ball A1 index area A E A2 A1 detail X e1 e C 1/2 e ∅v ∅w b M M y1 C C A B C y Y W V e U T R P N M L e2	Original	LFBGA280: OT894-1 sot894	PDF
sot862 Abstract: No abstract text available Text: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D	Original	LFBGA336: OT862-1 sot862	PDF
LFBGA324 Abstract: MO-205 Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U	Original	LFBGA324: OT571-1 MO-205 LFBGA324 MO-205	PDF
MO-205 Abstract: LFBGA180 Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U	Original	LFBGA180: OT697-1 MO-205 MO-205 LFBGA180	PDF
Untitled Abstract: No abstract text available Text: 3.3V CMOS 32-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 96 balls	OCR Scan	32-BIT 250ps MIL-STD-883, 200pF, ALVCH32374: IDT74ALVCH32374 32-bit F96-1	PDF
Untitled Abstract: No abstract text available Text: 3.3V CMOS 36-BIT UNIVERSAL BUS TRANS CEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FEATURES: - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 114 balls	OCR Scan	36-BIT 250ps MIL-STD-883, 200pF, ALVCH32501: IDT74ALVCH32501	PDF

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LFBGA Search Results

LFBGA Result Highlights (5)

LFBGA Price and Stock

NXP Semiconductors LFBGAMWA

NXP Semiconductors LFBGAMH1A

NXP Semiconductors LFBGAMV1A

NXP Semiconductors LFBGADAZA

NXP Semiconductors LFBGAML2A

LFBGA Datasheets (9)

LFBGA Datasheets Context Search

STA2500D

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AD5532-2

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C3744

sot751

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AD5517

sot894

sot862

LFBGA324

MO-205

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