SOT751 Search Results

SOT751 Datasheets (4)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT751-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm		Original	PDF
SOT751-1		NXP Semiconductors	Footprint for reflow soldering SOT751-1		Original	PDF
SOT751-2		NXP Semiconductors	Footprint for reflow soldering SOT751-2		Original	PDF
SOT751-2		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm		Original	PDF

SOT751 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
sot751 Abstract: No abstract text available Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J	Original	LFBGA80: OT751-1 sot751	PDF
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	LFBGA80 OT751-2 OT751-2	PDF
sot751 Abstract: No abstract text available Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A	Original	LFBGA80: OT751-2 sot751	PDF
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	LFBGA80 OT751-1 OT751-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2	Original	LFBGA80: OT751-2	PDF
Untitled Abstract: No abstract text available Text: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e	Original	OT751-1 LFBGA80:	PDF
Untitled Abstract: No abstract text available Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H	Original	OT751-1 LFBGA80:	PDF
bgb102 Abstract: block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 PCF87852 Text: PCF87852 Bluetooth baseband controller Rev. 01 — 23 April 2004 Preliminary data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth system	Original	PCF87852 PCF87852 bgb102 block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101	PDF