SOT751 Search Results
SOT751 Datasheets (4)
Part |
ECAD Model |
Manufacturer |
Description |
Curated |
Datasheet Type |
PDF |
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SOT751-1 |
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Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm | Original | |||
SOT751-1 |
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Footprint for reflow soldering SOT751-1 | Original | |||
SOT751-2 |
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Footprint for reflow soldering SOT751-2 | Original | |||
SOT751-2 |
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Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm | Original |
SOT751 Datasheets Context Search
Catalog Datasheet |
Type |
Document Tags |
PDF |
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sot751Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J |
Original |
LFBGA80: OT751-1 sot751 | |
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
LFBGA80 OT751-2 OT751-2 | |
sot751Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A |
Original |
LFBGA80: OT751-2 sot751 | |
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
LFBGA80 OT751-1 OT751-1 | |
Contextual Info: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2 |
Original |
LFBGA80: OT751-2 | |
Contextual Info: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e |
Original |
OT751-1 LFBGA80: | |
Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H |
Original |
OT751-1 LFBGA80: | |
bgb102
Abstract: block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 PCF87852
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Original |
PCF87852 PCF87852 bgb102 block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 |