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    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X


    Original     		PDF LFBGA267 OT1332-1 sot1332-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA267: plastic low profile fine-pitch ball grid array package; 267 balls A B D SOT1332-1 ball A1 index area A A2 A1 detail X E C e1 e Y W V U T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 13 15 17 19


    Original     		PDF LFBGA267: OT1332-1 sot1332-1