senju m705 solder paste

Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Front Flip Lock Actuator

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

Senju M705

Abstract: M705 solder paste senju m705 solder paste
Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

CL580-3700-8-00

Abstract: M705-221CM5
Contextual Info: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission

Contextual Info: 㩷 Doc. No. DG-097016C ISSUED March 05, 2010 SYSTEM DEVICE DIVISION Υ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION ઀᭽ᦠ SPECIFICATIONS ຠฬ ⴫㕙ታⵝဳ LED Product name Surface Mount LED ᒻฬ GM2BB40BM0C Model No. 㪩㪼㪽㪼 㔚ሶ࠺ࡃࠗࠬ੐ᬺᧄㇱ

Contextual Info: Doc. No. DG-104023 ISSUED May 6, 2010 SYSTEM DEVICE DIVISION Ⅲ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB45BMAC Model No. R e f e re n c 電子デバイス事業本部

Senju

Abstract: senju m705 solder paste M705 solder paste
Contextual Info: 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force

Senju paste 7100

Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Contextual Info: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.

NCP18XH103D0SRB

Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

Solder bar of Senju M705

Abstract: Senju M705 solder bar Senju ESR-250 Senju M705 safety senju M705-221BM5-42-11 senju m705 solder wire solder paste m705 EIAJ C-3 Senju M705 material safety senju m705 solder wire 0.5 mm
Contextual Info: Technical Document LED Specification EC/Opto Group GM2BB50BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5000 K LED Module 52 lm High Color Rendering (85 CRI) suited for lighting applications

M3582

Abstract: M8636 M8628 m865 m7632 M7052 M8632 M7310 m737 M3585
Contextual Info: P art Number .186 MAX. .168 MAX. .550 MAX. Des ign V oltage A mps MS C P L ife Hours F ilament T ype C M7302 C M8636 1.30 1.35 .030 .060 .006 .006 100 500 S -2 C -2R C M8656 C M8637 C M3518 C M3582 2.50 3.00 5.00 5.00 .400 .190 .115 .060 .550 .250 .150 .030

Senju M705

Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

m8636

Abstract: m865
Contextual Info: engineered to light up your design www.vcclite.com 1.800.522.5546 T-1 1/4 Special Midget Flange Base P art Number .186 MAX. .168 MAX. .550 MAX. Des ign V oltage A mps MS C P L ife Hours F ilament T ype C M7302 C M8636 1.30 1.35 .030 .060 .006 .006 100 500

Contextual Info: Reference 改定記録表 Revision Records GM2BB□□QT1B 版 改 定 年 月 日 技術資料番号 改 Edition Revised date 訂 内 Revised contents Spec. No. 容確 和英併記新規制定。 1st 図番：52310005 欄 Signature or name stamp 部 門 長 副 参 事 係 長 担 当

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

senju m705 solder paste

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

1mm 30 pin fpc connector

Abstract: IEC61249-2-21 40 pin connector 1mm FPC FH26-15
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm

FH270

Abstract: 201C DC100V FH12 5FPC LCD 15.6 OZ63-201C-50-9 50FPC
Contextual Info: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。

hrs fh26-51s-0.3shw

Abstract: 201C DC100V M705 CL580-0211-5 02102 SFPC FH26-15 G3232
Contextual Info: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。

GM2BB57

Abstract: gm2bb
Contextual Info: Reference Doc. No. DG-11X011 ISSUED October 11, 2011 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB57QK1C Model No. 電子デバイス事業本部

Solder bar of Senju M705

Contextual Info: Technical Document LED Specification EC/Opto Group GM2BB57BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5700 K LED Module 51 lm High Color Rendering (85 CRI) suited for lighting applications.

eiaj-c3

Contextual Info: Reference Doc. No. DG-11X008A ISSUED October 11, 2011 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB40QK1C Model No. 電子デバイス事業本部

gm2bb

Abstract: M705 solder paste
Contextual Info: Technical Document LED Specification EC/Opto Group GM2BB40QK0C “Double Dome” LED Module for Lighting Applications Product Specification September 2011 CRI CCT Current mA Luminous Flux Efficacy (lm/W) 83 CRI 220 68.5 101 4000 K 150 50 113 Reference Doc. No.