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    MATERIAL COMPOSITION Search Results

    MATERIAL COMPOSITION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLC32044IFK Rochester Electronics LLC PCM Codec, 1-Func, CMOS, CQCC28, CC-28 Visit Rochester Electronics LLC Buy
    100324QIX Rochester Electronics LLC TTL to ECL Translator, 6 Func, Complementary Output, BIPolar, PQCC28, PLASTIC, CC-28 Visit Rochester Electronics LLC Buy
    UE62B46230S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    UE62B46200S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    XFL2006-823MEC Coilcraft Inc General Purpose Inductor, 82uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808 Visit Coilcraft Inc

    MATERIAL COMPOSITION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    material composition

    Abstract: No abstract text available
    Text: Material Composition Specification SOD-923 Case Pb lead -free plating Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material


    Original
    OD-923 material composition PDF

    E 70 5059

    Abstract: material composition 223-18 74 AG 393 6363
    Text: Material Composition Specification SMDIP Case Pb lead -free plating* Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition


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    HM79S-63470LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g


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    HM78-10150LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide


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    HM79-103R3LF HM79-20220LF HM79-60331LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-10001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-10001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM41-11510LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc


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    HM41-11510LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM31-20050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 2410 2048.5 120.5


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    HM31-20050LF 744ide PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-03501LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-03501LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-15001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-15001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM31-21050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 1870 1589.5 93.5 93.5


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    HM31-21050LF 7440-Oxide PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-01001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-01001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM41-20105LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc


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    HM41-20105LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-06001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-06001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-02502LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-02502LF TB2272 PDF

    methanol

    Abstract: No abstract text available
    Text: 21-Jul-09 HM72A-06R47LFTR summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Tooled Part 2 COIL Wire 3 LEAD Lead Frame Ink 4 MARKING Ink Element Composition CAS No Material Mass Composition g (g) Iron Magnesium Silicon


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    21-Jul-09 HM72A-06R47LFTR 78-93-3ame methanol PDF

    Untitled

    Abstract: No abstract text available
    Text: HM41-10812LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc


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    HM41-10812LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-16001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-16001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM41-12020LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc


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    HM41-12020LF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM54-44R42VLF summary material content, BI Technologies Corporation Index Item Material Name Element Composition CAS No Material Mass mg Composition (mg) 7439-89-6 - 1730 1712.7 10.38 6.92 1 CORE Toroid Core Iron Binder Lubricant 2 WIRE NY UEW-H Copper Polyurethane (PU)


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    HM54-44R42VLF HM54-50R60VLF HM54-60R86VLF PDF

    Untitled

    Abstract: No abstract text available
    Text: HM12-07001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)


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    HM12-07001LF TB2272 PDF

    Untitled

    Abstract: No abstract text available
    Text: HM69-10R025LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE NP2 2 COIL Copper Strip 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Fe2O3 Mn3O4 ZnO 1309-37-1 1317-35-7 1314-13-2


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    HM69-10R025LF HM69-20R050LF HM69-80R30LF PDF

    Untitled

    Abstract: No abstract text available
    Text: BHCL 322522 summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition CAS No Material Mass mg Composition (mg) 11.00 6.490 1.320 0.990 2.200 Ferrite Fe2O3 NiO CuO ZnO 1309-37-1 1313-99-1 1317-38-0 1314-13-2


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: M Series Pin and Socket Connectors Catalog 82003 Revised 8-96 Material Specifications Contacts Material Specifications The material composition and construction of AMP contacts encompass vary­ ing price ranges and performance characteris­ tics. Specific materials and


    OCR Scan
    MIL-M-14, E28476 PDF