Contextual Info: Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 5.0, 10/2013 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network LIN is a serial communication protocol, designed to support automotive networks in conjunction with

ISO106

Contextual Info: Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 6.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network LIN is a serial communication protocol, designed to support automotive networks in conjunction with

LIN2.1

Abstract: SAEJ2602-2 MC33662 mc33662lef SAEJ2602 33662 mc3366 LIN protocol J2602 LIN21 LIN 2.1
Contextual Info: Analog, Mixed Signal and Power Management MC33662 LIN 2.1 / SAEJ2602-2, LIN Physical Layer Applications MC33662 Simplified Application Diagram • Automotive Market: • Body electronics BCM, gateway, roof, door, lighting, HVAC • Powertrain (EMS, Start&Stop), BMS

ISO-7637-3

Abstract: ISO7637-3 ISO76373
Contextual Info: Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 4.0, 9/2011 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network LIN is a serial communication protocol, designed to support automotive networks in conjunction with

Contextual Info: Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 4.0, 9/2011 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network LIN is a serial communication protocol, designed to support automotive networks in conjunction with

Contextual Info: Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 7.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network LIN is a serial communication protocol, designed to support automotive networks in conjunction with