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    MCP ELECTRONICS Search Results

    MCP ELECTRONICS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650-12P Murata Manufacturing Co Ltd AC/DC 650W, 6”X4” U-CHANNEL, 12V O/P Visit Murata Manufacturing Co Ltd
    ECASD61C107M012KA0 Murata Manufacturing Co Ltd 7343 (7343M)/100μF±20%/16Vdc/12mOhm Visit Murata Manufacturing Co Ltd
    ECASD61A157M010KA0 Murata Manufacturing Co Ltd 7343 (7343M)/150μF±20%/10Vdc/10mOhm Visit Murata Manufacturing Co Ltd
    DLW21SH670HQ2L Murata Manufacturing Co Ltd CMC SMD 67ohm 320mA POWRTRN Visit Murata Manufacturing Co Ltd
    DLW21SH900HQ2L Murata Manufacturing Co Ltd CMC SMD 90ohm 280mA POWRTRN Visit Murata Manufacturing Co Ltd
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    MCP ELECTRONICS Price and Stock

    Phoenix Contact FK-MCP 1 5/16-STF-3 81

    PCB connector - nominal current: 8 A - rated voltage (III/2): 160 V - nominal cross section: 1.5 mm² - number of positions: 16 - pitch: 3.81 mm - connection method: Push-in spring connection - color: green - contact surface: Tin
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FK-MCP 1 5/16-STF-3 81 94
    • 1 $30.96
    • 10 $28.36
    • 100 $24.2
    • 1000 $23.18
    • 10000 $23.18
    		Buy Now

    Phoenix Contact FK-MCP 1 5/ 8-ST-3 81-LR

    PCB connector - nominal current: 8 A - rated voltage (III/2): 160 V - nominal cross section: 1.5 mm² - number of positions: 8 - pitch: 3.81 mm - connection method: Push-in spring connection - color: green - contact surface: Tin
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FK-MCP 1 5/ 8-ST-3 81-LR 50
    • 1 -
    • 10 $16.15
    • 100 $12.87
    • 1000 $12.22
    • 10000 $12.22
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    Phoenix Contact FK-MCP 1 5/20-ST-3 81

    PCB connector - nominal current: 8 A - rated voltage (III/2): 160 V - nominal cross section: 1.5 mm² - number of positions: 20 - pitch: 3.81 mm - connection method: Push-in spring connection - color: green - contact surface: Tin
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FK-MCP 1 5/20-ST-3 81 32
    • 1 $58.18
    • 10 $37.19
    • 100 $34.08
    • 1000 $34.08
    • 10000 $34.08
    		Buy Now

    Phoenix Contact FK-MCP 1 5/10-ST-3 81-LR

    PCB connector - nominal current: 8 A - rated voltage (III/2): 160 V - nominal cross section: 1.5 mm² - number of positions: 10 - pitch: 3.81 mm - connection method: Push-in spring connection - color: green - contact surface: Tin
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FK-MCP 1 5/10-ST-3 81-LR
    • 1 -
    • 10 -
    • 100 $16.33
    • 1000 $16.33
    • 10000 $16.33
    		Buy Now

    Phoenix Contact FK-MCP 1 5/ 6-ST-3 81-LR

    PCB connector - nominal current: 8 A - rated voltage (III/2): 160 V - nominal cross section: 1.5 mm² - number of positions: 6 - pitch: 3.81 mm - connection method: Push-in spring connection - color: green - contact surface: Tin
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com FK-MCP 1 5/ 6-ST-3 81-LR
    • 1 -
    • 10 $12.91
    • 100 $10.26
    • 1000 $9.58
    • 10000 $9.58
    		Buy Now
    Find more MCP ELECTRONICS price and stock on Findchips.com

    MCP ELECTRONICS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MICRON mcp

    Abstract: microchannel plate MCP Electronics MCP3301
    Text: MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP MCP P MCP3301 Matched Microchannel Plate Set Standard Resistance Microchannel Plate for Detectors Maximize Your Instrument’s Performance With Our Optimum Five Micron Pore


    Original     		MCP3301 MCP3301 10-micron 02-S-0323 519B-0203 MICRON mcp microchannel plate MCP Electronics PDF

    PBT-GF10

    Abstract: TYCO PBT-GF20 AMP PBT gf30 connector Tyco PBT-GF10 AMP PBT-GF20 1355036 Product Specification 108-18716 PBTGF10 APPLICATION SPECIFICATION 114-18052 734533-1
    Text: Section Catalog 1307998-2. AMP MCP Interconnection System AMP MCP 1.5K Contact System Revised 12-2009. Main Catalog 1654400-1 Chapter 3 – Issued 3-2010. Introduction AMP MCP offers High Reliability for Long Term Use The AMP MCP Multiple Contact Point Connector System


    Original     		PDF

    AMP PBT gf30 connector

    Abstract: Tyco PBT-GF10 TYCO PBT-GF20 PBT-GF20 PBT-GF10 tyco mcp 2.8 receptacle 1355328-1 PBT 20 GF Tyco 1355052 AMP PBT-GF20
    Text: Section Catalog 1307998-2. AMP MCP Interconnection System AMP MCP 1.5K Contact System Revised 12-2009. Main Catalog 1654400-1 Chapter 3 – Issued 3-2010. Introduction AMP MCP offers High Reliability for Long Term Use The AMP MCP Multiple Contact Point Connector System


    Original     		PDF

    963530-1

    Abstract: 1718705-1
    Text: tifca Electronics AMP MCP Interconnection System Catalog 1307998-1 A M P MCP 1.5K Contact System Issued 07-05 Single W ire Seals and Cavity Plugs Single Wire Seals and Cavity Plugs for AMP MCP 1.5K Contact System Cavity Diameter 3.6 mm 32 Insulation Diameter


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: tijca AM P MCP Interconnection System Catalog 1307998-1 Issued 07-05 AMP MCP 1.5K Contact System Electronics Tab Contacts Tabs 1.6 x 0.6 mm with Steel Top Spring, Mates with AMP MCP 1.5K Contact System Extraction Tool: Part No. 539960-1 Product Specification:


    OCR Scan     		969029b x-1528068-x x-1528261-x PDF

    Flash MCp nand DRAM 107-ball

    Abstract: SAMSUNG MCP nand sdram mcp KAG00H008M-FGG2 UtRAM Density
    Text: Advance Prelimanary MCP MEMORY KAG00H008M-FGG2 MCP Specification of 256Mb NAND*2 and 256Mb Mobile SDRAM -1- Revision 0.1 September 2003 Advance Prelimanary MCP MEMORY KAG00H008M-FGG2 Document Title Multi-Chip Package MEMORY 256M Bit 32Mx8 Nand Flash*2 / 256M Bit(4Mx16x4Banks) Mobile SDRAM


    Original     		KAG00H008M-FGG2 256Mb 32Mx8) 4Mx16x4Banks) 128Mb 107-Ball 80x13 Flash MCp nand DRAM 107-ball SAMSUNG MCP nand sdram mcp KAG00H008M-FGG2 UtRAM Density PDF

    SAMSUNG MCP

    Abstract: Flash MCp nand DRAM 107-ball K5D5657DCM-F015 SAMSUNG 256Mb mcp Qualification Reliability dq15d samsung mcp 107-ball
    Text: Preliminary MCP MEMORY K5D5657DCM-F015 MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM -1- Revision 0.0 June 2003 Preliminary MCP MEMORY K5D5657DCM-F015 Document Title Multi-Chip Package MEMORY 256M Bit 32Mx8 Nand Flash / 256M Bit(4Mx16x4Banks) Mobile SDRAM


    Original     		K5D5657DCM-F015 256Mb 32Mx8) 4Mx16x4Banks) 107-Ball SAMSUNG MCP Flash MCp nand DRAM 107-ball K5D5657DCM-F015 SAMSUNG 256Mb mcp Qualification Reliability dq15d samsung mcp 107-ball PDF

    SAMSUNG MCP

    Abstract: KAG00E007M-FGGV UtRAM Density samsung nor nand ddr mcp samsung mcp 107-ball Flash MCp nand DRAM 107-ball
    Text: Advance Preliminary MCP MEMORY KAG00E007M-FGGV MCP Specification of 256Mb NAND*2 and 256Mb Mobile SDRAM -1- Revision 0.6 September 2003 Advance Preliminary MCP MEMORY KAG00E007M-FGGV Document Title Multi-Chip Package MEMORY 256M Bit 16Mx16 Nand Flash*2 / 256M Bit(4Mx16x4Banks) Mobile SDRAM


    Original     		KAG00E007M-FGGV 256Mb 16Mx16) 4Mx16x4Banks) 107-Ball 80x13 SAMSUNG MCP KAG00E007M-FGGV UtRAM Density samsung nor nand ddr mcp samsung mcp 107-ball Flash MCp nand DRAM 107-ball PDF

    Flash MCp nand DRAM 107-ball

    Abstract: dq15d SAMSUNG MCP 130 MCP NAND DDR 512M nand mcp SAMSUNG MCp nand ddr KAG00J007M-FGG2 UtRAM Density nand mcp samsung ka
    Text: Advance Preliminary MCP MEMORY KAG00J007M-FGG2 MCP Specification of 256Mb NAND*2 and 256Mb Mobile SDRAM -1- Revision 0.6 October 2003 Advance Preliminary MCP MEMORY KAG00J007M-FGG2 Document Title Multi-Chip Package MEMORY 256M Bit 32Mx8 Nand Flash*2 / 256M Bit(4Mx16x4Banks) Mobile SDRAM


    Original     		KAG00J007M-FGG2 256Mb 32Mx8) 4Mx16x4Banks) 107-Ball 80x13 Flash MCp nand DRAM 107-ball dq15d SAMSUNG MCP 130 MCP NAND DDR 512M nand mcp SAMSUNG MCp nand ddr KAG00J007M-FGG2 UtRAM Density nand mcp samsung ka PDF

    Samsung MCP

    Abstract: MCP NAND K5D5657ACM K5D5657ACM-F015 MCP 256M nand samsung mobile DDR
    Text: Advance Preliminary MCP MEMORY K5D5657ACM-F015 MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM -1- Revision 0.1 September 2003 Advance Preliminary MCP MEMORY K5D5657ACM-F015 Document Title Multi-Chip Package MEMORY 256M Bit 32Mx8 Nand Flash / 256M Bit(4Mx16x4Banks) Mobile SDRAM


    Original     		K5D5657ACM-F015 256Mb 32Mx8) 4Mx16x4Banks) 128Mb 107-Ball 80x13 Samsung MCP MCP NAND K5D5657ACM K5D5657ACM-F015 MCP 256M nand samsung mobile DDR PDF

    tyco mcp

    Abstract: 963294-1 Sealing Plug 1307998-2 tyco mcp 5 963293-1 "amp mcp"
    Text: Section Catalog 1307998-2. Revised 12-2009. AMP MCP Interconnection System AMP MCP 2.8K Contact System Main Catalog 1654400-1 Chapter 3 – Issued 3-2010. Single Wire Seals and Sealing Plugs Single Wire Seals and Sealing Plugs for AMP MCP 2.8K Contact System


    Original     		PDF

    114-18051

    Abstract: 1355364 108-18063 tyco mcp 2063533-1 tyco mcp 2.8 contact x-1528001-x 114180 11418051 1654400
    Text: Section Catalog 1307998-2. Revised 12-2009. AMP MCP Interconnection System AMP MCP 2.8K Contact System Main Catalog 1654400-1 Chapter 3 – Issued 3-2010. Tab Contacts Tabs 2.8 x 0.8 mm, with Modified Steel Top Spring, Mates with AMP MCP 2.8/ 2.8K Contact System


    Original     		x-1528025-x x-1528101-x x-1528026-x 114-18051 1355364 108-18063 tyco mcp 2063533-1 tyco mcp 2.8 contact x-1528001-x 114180 11418051 1654400 PDF

    Untitled

    Abstract: No abstract text available
    Text: AMP MCP Multiple Contact Point System AMP MCP 1.5K Contact System Electronics Catalog 889780 Issued 04-03 Receptacle Contacts Technical Features Contact Material: CuNiSi Top Spring: Stainless Steel Contact Finish: Tin plated, selective silver plated, selective gold plated


    OCR Scan     		x-541677-x x-541678-x PDF

    Untitled

    Abstract: No abstract text available
    Text: FILTERS TECHNOLOGY OF TOMORROW TWO TERMINAL STRUCTURE MULTILAYER FERRITE POWER BEADS CZP MCP 1 2 3 4 5 Solder plating Diffusion barrier (Ni) Silver metallisation Ferrite Electrode IDENTIFICATION TYPE COATING COLOR MARKING CZP Black None Old Part No. MCP


    Original     		nicke20 D-25578 PDF

    cohesive

    Abstract: No abstract text available
    Text: Fujitsu offers the widest range of multichip module MCM and multichip package (MCP) technology available in the industry today. MCM is a completely custom solution that creates a specialized module. MCP offers multiple chips in a standard package and form factor.


    Original     		PDF

    SAMSUNG MCP

    Abstract: 1g nand mcp KBE00S003M-D411 KBE00S003M Flash MCp nand DRAM 107-ball MCP NOR FLASH SDRAM samsung "nor flash" sensing MCP MEMORY UtRAM Density MCP 1Gb nand 512mb dram 130
    Text: KBE00S003M-D411 MCP MEMORY MCP Specification 1Gb NAND*2 + 256Mb Mobile SDRAM*2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		KBE00S003M-D411 256Mb 107-Ball 80x13 SAMSUNG MCP 1g nand mcp KBE00S003M-D411 KBE00S003M Flash MCp nand DRAM 107-ball MCP NOR FLASH SDRAM samsung "nor flash" sensing MCP MEMORY UtRAM Density MCP 1Gb nand 512mb dram 130 PDF

    TYCO PBT-GF20

    Abstract: AMP PBT-GF20 PBT-GF30 Tyco PBT-GF30 tyco mcp 2.8 housing tyco mcp PBT-GF20 1-1579007-1 tyco mcp 2.8 receptacle PBT-GF-30
    Text: Section Catalog 1307998-2. Revised 12-2009. AMP MCP Interconnection System AMP MCP 2.8 Housings and Connectors Main Catalog 1654400-1 Chapter 3 – Issued 3-2010. Sealed 2.8 mm Tab Housings Technical Features No. of Positions: 15 Positions 48.7 Housing Material:


    Original     		PBT-GF20 PBT-GF30 TYCO PBT-GF20 AMP PBT-GF20 PBT-GF30 Tyco PBT-GF30 tyco mcp 2.8 housing tyco mcp PBT-GF20 1-1579007-1 tyco mcp 2.8 receptacle PBT-GF-30 PDF

    MCP 1Gb nand 512mb dram 130

    Abstract: SAMSUNG MCP MCP 67 MV- A2 137FBGA KBE00S009M KBE00S009M-D411 UtRAM Density
    Text: KBE00S009M-D411 MCP MEMORY MCP Specification 1Gb NAND*2 + 256Mb Mobile SDRAM*2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		KBE00S009M-D411 256Mb 137-Ball 80x14 MCP 1Gb nand 512mb dram 130 SAMSUNG MCP MCP 67 MV- A2 137FBGA KBE00S009M KBE00S009M-D411 UtRAM Density PDF

    Untitled

    Abstract: No abstract text available
    Text: MS46H64M32L2SB-XX *PRELIMINARY 2Gb LPDDR 2 x 32Mx32 FEATURES  Package: GENERAL DESCRIPTION • 152 Plastic Ball Grid Array (PBGA), 14 x 14 mm Microsemi MS46H64M32L2SB package-on-package (PoP) MCP product combines two Mobile LPDRAM devices in a single MCP.


    Original     		MS46H64M32L2SB-XX 32Mx32) MS46H64M32L2SB 268M-bit PDF

    nand flash 512M

    Abstract: K5D1G K5D1G13KCM-D075 4Mx32x4banks SAMSUNG MCP 14X14mm K5D1G13 SAMSUNG 512Mb NAND Flash Qualification Report
    Text: Target MCP MEMORY K5D1G13KCM-D075 MCP Specification 1Gb NAND Flash + 512Mb Mobile SDRAM INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		K5D1G13KCM-D075 512Mb 119-Ball nand flash 512M K5D1G K5D1G13KCM-D075 4Mx32x4banks SAMSUNG MCP 14X14mm K5D1G13 SAMSUNG 512Mb NAND Flash Qualification Report PDF

    Untitled

    Abstract: No abstract text available
    Text: FILTERS TECHNOLOGY OF TOMORROW TWO TERMINAL STRUCTURE MULTILAYER FERRITE POWER BEADS CZP MCP 1 2 3 4 5 Solder plating Diffusion barrier (Ni) Silver metallisation Ferrite Electrode IDENTIFICATION TYPE COATING COLOR MARKING CZP Black None Old Part No. MCP


    Original     		Anti-leachi20 D-25578 PDF

    MT29C4G48MAZAPAKQ-5

    Abstract: MT29C4G96MAZAPCJG-5 MT29C4G96M MT29C4G96MAZAPCJG-5IT MT29C4G48mazapakq MT29F8G16 lpddr2 mcp lpddr2 nand mcp MT29C8G96 samsung* lpddr2* pop package
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,


    Original     		168-Ball MT29C4G48MAYAPAKQ-5 MT29C4G48MAZAPAKQ-5 MT29C4G48MAZAPAKQ-6 MT29C4G96MAZAPCJG-5 MT29C4G96MAZAPCJG-6 MT29C8G96MAZAPDJV-5 MT29C8G96MAZAPDJV-6 09005aef83ba4387 MT29C4G96M MT29C4G96MAZAPCJG-5IT MT29C4G48mazapakq MT29F8G16 lpddr2 mcp lpddr2 nand mcp MT29C8G96 samsung* lpddr2* pop package PDF

    9006

    Abstract: mixier circuits HS350 ldmos nec
    Text: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8220T5A Tx AND Rx MCP IC FOR 1.9 GHz PHS DESCRIPTION The µPC8220T5A is MCP Multi Chip Packaging IC consisted of silicon germanium (SiGe) bipolar process and LDMOS designed for use as transmitting and receiving for 1.9 GHz PHS.


    Original     		PC8220T5A PC8220T5A 16-pin 9006 mixier circuits HS350 ldmos nec PDF

    MT29F4G08ABA

    Abstract: MT29C4G48 ELPIDA LPDDR2 POP MT29C4G48MAZBAAKQ-5
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPŒ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,


    Original     		168-Ball MT29C4G48MAYBAAKQ-5 MT29C4G48MAZBAAKQ-5 MT29C4G96MAYBACJG-5 MT29C4G96MAZBACJG-5 MT29C8G96MAYBADJV-5 MT29C8G96MAZBADJV-5 MT29F4G08ABA MT29C4G48 ELPIDA LPDDR2 POP PDF