Untitled
Abstract: No abstract text available
Text: EEPROM AS58LC1001 128K x 8 EEPROM PIN ASSIGNMENT Top View Radiation Tolerant 32-Pin CFP (F & SF), 32-Pin CSOJ (DCJ) AVAILABLE AS MILITARY SPECIFICATIONS z z RDY/BUSY\ A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O 0 I/O 1 I/O 2 Vss Micross Components Space Level
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AS58LC1001
32-Pin
250ns
300ns
20mW/MHz
-40oC
-55oC
125oC
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Untitled
Abstract: No abstract text available
Text: EEPROM AS58LC1001 128K x 8 EEPROM PIN ASSIGNMENT Top View Radiation Tolerant 32-Pin CFP (F & SF), 32-Pin CSOJ (DCJ) AVAILABLE AS MILITARY SPECIFICATIONS z z RDY/BUSY\ A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O 0 I/O 1 I/O 2 Vss Micross Components Space Level
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AS58LC1001
32-Pin
250ns
300ns
20mW/MHz
-40oC
-55oC
125oC
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sst nandrive
Abstract: NAND Flash DIE
Text: SOLID STATE DISK AS3uSSD4GB28MPBG PRELIMINARY microSSDTM 4Gbyte Solid State Disk • • • • • • • • • Extended Temp -20°C to +85°C Operation Industry Standard ATA/IDE Bus Interface – Host Interface: 16-bit access – Supports up to PIO Mode-6
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AS3uSSD4GB28MPBG
16-bit
-55oC
125oC
T12/1410D
sst nandrive
NAND Flash DIE
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Untitled
Abstract: No abstract text available
Text: Counterfeit Components Identification MANUFACTURED PRODUCTS & SERVICES MICROSS OFFERS AN INTELLIGENT SCREENING PROCESS TO ROOT OUT COUNTERFEIT COMPONENTS FROM THE SUPPLY CHAIN. MITIGATE THE RISK OF BUYING GREY MARKET DEVICES BY USING MICROSS’ TEST FLOWS.
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Untitled
Abstract: No abstract text available
Text: SOLID STATE DISK AS3uSSD4GB28MPBG PRELIMINARY microSSDTM 4Gbyte Solid State Disk • • • • • • • • • Extended Temp -20°C to +85°C Operation Industry Standard ATA/IDE Bus Interface – Host Interface: 16-bit access – Supports up to PIO Mode-6
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AS3uSSD4GB28MPBG
16-bit
-55oC
125oC
T12/1410D
AS3uSSD4GB28MPBG
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64MB SRAM
Abstract: MO-47
Text: iPEM 16 MB ASYNC SRAM AS8S512K32PEC THIS PRODUCT IS SUBJECT TO MICROSS PCN-1109 AND REPLACED BY AS8S512K32PECA. 16Mb, 512Kx32 CMOS 5.0V, High Speed Static RAM Integrated Plastic Encapsulated Microcircuit DESCRIPTION FEATURES The AS8S512K32 is a high speed, 5V, 16Mb SRAM. The
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AS8S512K32PEC
PCN-1109
AS8S512K32PECA.
512Kx32
M0-47AE
AS8S512K32
AS8S512K32PECA
AS8S512K32PEC
64MB SRAM
MO-47
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Untitled
Abstract: No abstract text available
Text: SOLID STATE DISK AS3uSSD16GB56MPBG ADVANCED microSSDTM 16Gbyte Solid State Disk FEATURES • • • • • • • • Extended Temp -20°C to +85°C Operation 16 Gbytes of Storage Capacity* Industry Standard ATA/IDE Bus Interface –Host Interface: 16-bit access
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AS3uSSD16GB56MPBG
16Gbyte
16-bit
T12/1410D
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MT46H32M32LFCM-6
Abstract: MICRON Cross Reference AS4MDDR32M32PBG-6/ET AS4MDDR32M32PBG-6
Text: 1Gb MOBILE DDR SRAM AS4MDDR32M32PBG Micross Components Data Sheet Addendum 32Mx32 mobile DDR SDRAM Micross Device part# AS4MDDR32M32PBG-6/ET Base OEM part# MT46H32M32LFCM-6 L IT:A OEM vendor: Micron About this Addendum: Micross Components sources the plastic encapsulated part from the
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AS4MDDR32M32PBG
32Mx32
AS4MDDR32M32PBG-6/ET
MT46H32M32LFCM-6
-46oC
105oC
-40oC
105oC
MICRON Cross Reference
AS4MDDR32M32PBG-6/ET
AS4MDDR32M32PBG-6
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55LD040M
Abstract: pata chips write-verify
Text: SOLID STATE DISK AS3uSSDxGB50S PRELIMINARY microSSDTM 4 & 8 Gbyte Solid State Disk SLC FEATURES • • • • • • • Available in Industrial and Enhanced Temperature Range Versions Storage Capacity* AS3uSSD4GB50S (4Gbytes) AS3uSSD8GB50S (8Gbytes)
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AS3uSSDxGB50S
AS3uSSD4GB50S
AS3uSSD8GB50S
16-bit
50MByte/sec
39MByte/sec
110mAright
T12/1410D
AS3uSSDxGB50S
55LD040M
pata chips
write-verify
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Untitled
Abstract: No abstract text available
Text: SOLID STATE DISK AS3uSSD8GB55MPBG PRELIMINARY microSSDTM 8Gbyte Solid State Disk FEATURES • • • • • • • • Extended Temp -20°C to +85°C Operation 8Gbytes of Storage Capacity* Industry Standard ATA/IDE Bus Interface –Host Interface: 16-bit access
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AS3uSSD8GB55MPBG
16-bit
AS3uSSD8GB55MPBG,
T12/1410D
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Untitled
Abstract: No abstract text available
Text: iPEM 16 Mb ASYNC SRAM AS8SLC512K32PEC THIS PRODUCT IS SUBJECT TO MICROSS PCN-1109 AND REPLACED BY AS8SLC512K32PECA. 16Mb, 512Kx32 CMOS 3.3V, High Speed Static RAM Integrated Plastic Encapsulated Microcircuit FEATURES DESCRIPTION Integrated Real-Time Memory Array Solution
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AS8SLC512K32PEC
PCN-1109
AS8SLC512K32PECA.
512Kx32
M0-47AE
AS8SLC512K32
AS8SLC512K32PECA
AS8SLC512K32PEC
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AS27C256-20JM
Abstract: WF1M32B-100G2UM3 qp7c199 ACT-S512K32N-017P7Q QP7C1009B-20DMB WF1M32B-120G2UM3 IDT71256L25TCB AS5C2008 AS8S512K32Q 57C256F-55
Text: Part Number 1 of 66 Config Device Type Volt Packages Micross Part Number SMD 5962- 57C256F-55 32Kx8 UVEPROM 5V 57C256F-55 32Kx8 UVEPROM 5V 57C256F-70 32Kx8 UVEPROM 5V 57C256F-70 32Kx8 UVEPROM 5V ACT-E128K32C120P7Q 128Kx32 EEPROM 5V ACT-E128K32C140P7Q 128Kx32 EEPROM 5V
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57C256F-55
32Kx8
57C256F-70
ACT-E128K32C120P7Q
128Kx32
ACT-E128K32C140P7Q
AS27C256-20JM
WF1M32B-100G2UM3
qp7c199
ACT-S512K32N-017P7Q
QP7C1009B-20DMB
WF1M32B-120G2UM3
IDT71256L25TCB
AS5C2008
AS8S512K32Q
57C256F-55
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JM7000
Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
Text: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the
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800Mhz
JM7000
ltx credence tester
ltx ts80
teradyne flex tester
credence tester
sic wafer
j937
optocoupler NAND
SiC-JFET
ceramic pin grid array package wire bond
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Untitled
Abstract: No abstract text available
Text: SDRAM AS4SD16M16 DOCUMENT TITLE 36Mb Pipelined Sync SRAM Rev # 1.7 1.8 1.9 AS4SD16M16 Rev. 1.7 3/2/09 History Text update on pg 8 &34, AC Spec update Removed “Consult Factory” pg 1 Update Micross Information Release Date March 2009 Status Release March 2009
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AS4SD16M16
AS4SD16M16
-40oC
-55oC
125oC
A0-A12)
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if8b
Abstract: write-verify
Text: SOLID STATE DISK AS3uSSD16GB56MPBG PRELIMINARY microSSDTM 16Gbyte Solid State Disk FEATURES • • • • • • • • Extended Temp -20°C to +85°C Operation 16 Gbytes of Storage Capacity* Industry Standard ATA/IDE Bus Interface –Host Interface: 16-bit access
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AS3uSSD16GB56MPBG
16Gbyte
16-bit
T12/1410D
AS3uSSD16GB56MPBG
if8b
write-verify
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512MB SRAM
Abstract: TSOP-II 44 issi 8Mx16 SDRAM tsop-ii micross tsopII 16Mx16 ISSI
Text: ISSI & Micross Components announce Agreement to Supply MIL Temp Memory March 2011 March 2011 ISSI & Micross Mi Partnership P t hi for f MIL Temp T Memory M ISSI announces partnership with
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4Mx16,
128Mb,
8Mx16,
256Mb,
16Mx16,
128Kx8
256Kx16,
512Kx8,
512Kx16,
1Mx16,
512MB SRAM
TSOP-II 44
issi 8Mx16 SDRAM
tsop-ii
micross
tsopII
16Mx16
ISSI
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A104
Abstract: AA10 AS3SSD16GB5PBG ata commands 16GB Nand flash dual channel flash chip 8gb silicon power 4GB AB22-AB23
Text: SOLID STATE DISK PRELIMINARY Solid State Disk On Chip SSDoC AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG Not recommended for new designs. Contact Micross Marketing & Sales to discuss availability. The new microSSD is the recommended replacement part. FEATURES
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AS3SSD16GB5PBG
A104
AA10
AS3SSD16GB5PBG
ata commands
16GB Nand flash dual channel
flash chip 8gb
silicon power 4GB
AB22-AB23
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AS4DDR232M72PBG
Abstract: AS4DDR264M72PBG AS4DDR232M72APBG
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG THIS PRODUCT IS SUBJECT TO MICROSS PCN 1027. RECOMMEND AS4DDR232M72APBG AS REPLACEMENT. 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp
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AS4DDR232M72PBG
AS4DDR232M72APBG
32Mx72
AS4DDR232M72PBG
AS4DDR264M72PBG
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7273B
Abstract: No abstract text available
Text: SSRAM AS5SS256K18 256K x 18 SSRAM PIN ASSIGNMENT Top View Synchronous Burst SRAM, Flow-Through 100-pin TQFP SA SA CE\ CE2 NC NC bwB\ BWa\ CE2\ VDD VSS CLK GW\ BWE\ OE\ ADSC\ ADSP\ ADV\ SA SA FEATURES VDD NC VSS DQb DQb VDDQ VSS DQb DQb DQPb NC VSS VDDQ NC
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AS5SS256K18
375mA
225mA
325mA
205mA
250mA
185mA
120mA
AS5SS256K18
7273B
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Untitled
Abstract: No abstract text available
Text: SSRAM AS5SS256K36 256K x 36 SSRAM PIN ASSIGNMENT Top View Flow-Through, Synchronous Burst SRAM 100-pin TQFP (DQ, DQC & DQCR) FEATURES DQPc DQc DQc VDDQ Vss DQc DQc DQc DQc Vss VDDQ DQc DQc Vss VDD NC Vss
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AS5SS256K36
100-pin
325mA
225mA
250mA
200mA
150mA
140mA
130mA
AS5SS256K36
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j108
Abstract: No abstract text available
Text: J108 N-CHANNEL JFET Linear Systems replaces discontinued Siliconix J108 This n-channel JFET is optimised for low noise high performance switching. The part is particularly suitable for use in low noise audio amplifiers. The TO-92 package is well suited for cost sensitive applications
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350mW
j108
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j175 replacement
Abstract: No abstract text available
Text: LSJ175 P-CHANNEL JFET Linear Systems replaces discontinued Siliconix J175 The LSJ175 is a single P-Channel JFET switch This p-channel analog switch is designed to provide low on-resistance and fast switching. When used in combination with the complimentary J/SST111 nchannel family, the LSJ175 simplifies series-shunt
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LSJ175
J/SST111
j175 replacement
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aa117 diode
Abstract: No abstract text available
Text: AA100-AA104 AA107-AA111 AA114-AA118 SCRs .5A, Planar FEATURES • Maximum Gate Trigger Current: 2,20or 200,uA • Tight Gate Trigger Voltage Range:.44 to .6V • Voltage Ratings: to 400V • Specified for dv/dt and Switching Time DESCRIPTION This data sheet describes Microssmi’s AA Series 0.5ASCRs designed for low-current
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AA100-AA104
AA107-AA111
AA114-AA118
AA100
AA107
200pA
AA114
AA161
AA102
AA100
aa117 diode
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4040 cmos
Abstract: transistor 2N 3055 IC 74ls244 ic 2114 diode S3L 7d ls y201 AY-3-1015 ic 74ls245 IC 74LS02 ic 74LS08
Text: Applied Microsystems Corporation 5020 148th Avenue N.E. P.O. Box 568 Redmond, WA 98052 206 882-2000 (800)426-3925 P R E L I M I N A R Y S E R V I C E M A N U A L EM-180/180B Diagnostic Emulator * Document Number 920-10648 ♦Diagnostic Emulator is a trademark of Applied Microssyterns Corp.
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148th
EM-180/180B
EM-180)
EM-180B)
14Install
8W401
RS401
4040 cmos
transistor 2N 3055
IC 74ls244
ic 2114
diode S3L 7d
ls y201
AY-3-1015
ic 74ls245
IC 74LS02
ic 74LS08
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