MSA435
Abstract: PMLL4148 PMLL4148L PMLL4448 MSA461
Text: PMLL4148L; PMLL4448 High-speed switching diodes Rev. 06 — 4 April 2005 Product data sheet 1. Product profile 1.1 General description Single high-speed switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C SMD packages.
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PMLL4148L;
PMLL4448
OD80C
PMLL4148L
OD80C
MSA435
PMLL4148
PMLL4148L
PMLL4448
MSA461
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MSA435
Abstract: BAS32L
Text: BAS32L High-speed switching diode Rev. 04 — 22 March 2005 Product data sheet 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C SMD package.
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BAS32L
OD80C
MSA435
BAS32L
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SOD80 footprint
Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD
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MGK391
MSC422
OT457
SC-74)
MSC423
SOD80 footprint
SOD87 footprint
Soldering guidelines and SMD footprint design
SMD footprint design
SOD106 land pattern
land pattern sot346
SOD110 footprint
SOD87 footprint pcb
MLC745
smd footprint
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SOD80 footprint
Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components
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MSB461
OT163-1)
MLC745
SOD80 footprint
SOD87 footprint
land pattern sot346
SOD110 footprint
SOD106 land pattern
sod110 land
do-41 footprint
MSA435
DO-35 land pattern
how epoxy can contribute to meniscus
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TRANSISTOR SMD CODE PACKAGE SOT89 52 10A
Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
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SOD87 footprint
Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999
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MSD060
OT428.
MSC422
OT457
SC-74)
MSC423
SOD87 footprint
Soldering guidelines and SMD footprint design
sot3391h
SOT-34
MSA460
MSA439
SOT343R footprint
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MSA435
Abstract: SOD80C FOOTPRINT-SOD80C SOD-80C
Text: PDF: 2003 Jan 09 Philips Semiconductors PC board footprint SOD80C FOOTPRINT REFLOW SOLDERING 4.55 4.30 2.30 handbook, full pagewidth solder lands solder resist 2.25 1.70 1.60 occupied area solder paste 0.90 (2x) MSA435 Dimensions in mm. SOD80C FOOTPRINT (WAVE SOLDERING)
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OD80C
MSA435
MSA461
MSA435
SOD80C
FOOTPRINT-SOD80C
SOD-80C
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w2 mark 5 pin mosfet smd
Abstract: Philips SC07 Small-signal Transistors transistor bf 175
Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
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