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    NEC PACKAGE LABEL Search Results

    NEC PACKAGE LABEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    NEC PACKAGE LABEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    smd code marking NEC

    Abstract: TRANSISTOR SMD CODE PACKAGE SOT89 52 10A 38w smd transistor smd mark code 38w SMD 8PIN IC MARKING CODE 251 marking code E1 SMD 5pin 6pin dip SMD mosfet MARKING code T mosfet SMD CODE PACKAGE SOT89 52 10A marking code E2 p SMD Transistor TRANSISTOR SMD MARKING CODE MP
    Text: Power Management Devices Selection Guide > Power MOSFETs > ESD Protection Diodes > Regulators August 2008 www.am.necel.com/powermanagement TABLE OF CONTENTS Contents Low-Voltage Power By Part


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    PDF G18756EU3V0SG00 smd code marking NEC TRANSISTOR SMD CODE PACKAGE SOT89 52 10A 38w smd transistor smd mark code 38w SMD 8PIN IC MARKING CODE 251 marking code E1 SMD 5pin 6pin dip SMD mosfet MARKING code T mosfet SMD CODE PACKAGE SOT89 52 10A marking code E2 p SMD Transistor TRANSISTOR SMD MARKING CODE MP

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


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    PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


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    PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    BGT24MTR11

    Abstract: AZ1045-04F BAR86-02LRH 24GHz Radar BGA628L7 SMV1705 BFR181W ALPHA&OMEGA DATE CODE marking code onsemi Diode 2SC4586
    Text: Selection Guide RF & Protection Devices www.infineon.com/rfandprotectiondevices 2 Contents Selection Guide 4 RF Bipolar Transistors & Active Bias Controller 4 RF Switches 6 RF MMICs 7 RF Diodes 9 RF MOSFET 16 RF Schottky Diodes 18 ESD and EMI Protection Devices and Filters


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    PDF 24GHz BF517 BF770A BF771 BF799 BF799W BFP181 BFP182 BFP182R BFP182W BGT24MTR11 AZ1045-04F BAR86-02LRH 24GHz Radar BGA628L7 SMV1705 BFR181W ALPHA&OMEGA DATE CODE marking code onsemi Diode 2SC4586

    NEC obsolete parts

    Abstract: NEC rambus dram NEC obsolete parts ic NEC RDRAM 1994 synchronous dram nec RDRAM CONCURRENT Rambus ASIC Cell rambus channel direct rdram rambus 1200 concurrent rdram
    Text: ARCHITECTURAL OVERVIEW This document was created with FrameMaker 4.0.2 Document No. 60291  Copyright 1994 NEC Electronics Inc. All rights reserved. No part of this document may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means without the prior written permission


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    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


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    PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    XM0830SJ

    Abstract: smd code marking 162 sot23-5 MARKING V14 SOT23-5 RF Transistor Selection smd code marking rf ft sot23 smd code marking NEC rf transistor sot-363 inf smd marking D3 SOT363 XM0860SH MGA51563
    Text: Selection Guide RF & Protection Devices [ www.infineon.com/rfandprotectiondevices ] 2 Contents Selection Guide 4 RF Bipolar Transistors & Active Bias Controller 4 RF Switches 6 RF MMICs 7 RF Diodes 8 RF MOSFET 16 RF Schottky Diodes 18 ESD and EMI Protection Devices and Filters


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    PDF 24GHz BF517 BF770A BF771 BF775 BF799 BF799W BFP181 BFP181R BFP182 XM0830SJ smd code marking 162 sot23-5 MARKING V14 SOT23-5 RF Transistor Selection smd code marking rf ft sot23 smd code marking NEC rf transistor sot-363 inf smd marking D3 SOT363 XM0860SH MGA51563

    nec lot number on packing label

    Abstract: renesas tape and reel renesas lot number on packing label
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    gaas fet micro-X Package

    Abstract: P1014 NE76184A-T1 t25000 gaas fet micro-X
    Text: User’s Manual TAPE AND REEL SPECIFICATION FOR MICRO-X PACKAGE AND MOLD PACKAGE HJ-FET & GaAs MES FET Document No. P10149EJ6V0UM00 (6th edition) Date Published October 1997 N 1989 Printed in Japan [MEMO] 2 No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF P10149EJ6V0UM00 gaas fet micro-X Package P1014 NE76184A-T1 t25000 gaas fet micro-X

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


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    PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    NEC Relay Date Codes

    Abstract: FET marking codes NEC MARKING codes nec gaas fet marking
    Text: DATA SHEET Solid State Relay OCMOS FET PS7241-2B 8-PIN SOP, 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 2-ch Optical Coupled MOS FET DESCRIPTION The PS7241-2B is a solid state relay containing GaAs LEDs on the light emitting side input side and normally


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    PDF PS7241-2B PS7241-2B PS7241-2B-F3, E72422 NEC Relay Date Codes FET marking codes NEC MARKING codes nec gaas fet marking

    NE3512S02-T1C

    Abstract: No abstract text available
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF PX10614EJ01V0TN NE3512S02-T1C

    date code marking NEC

    Abstract: NEC MARKING CODE code marking NEC LOT CODE NEC marking C2H nec lot number on packing label PC2771T marking 23 C2H marking nec lot number
    Text: Information TAPING SPECIFICATIONS OF 6 PIN MINI MOLD SEMICONDUCTORS FOR HIGH FREQUENCY USE Document No. P11062EJ3V0IF00 3rd edition Date Published March 1998 N CP(K) 1994 Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF P11062EJ3V0IF00 grante588-6130 date code marking NEC NEC MARKING CODE code marking NEC LOT CODE NEC marking C2H nec lot number on packing label PC2771T marking 23 C2H marking nec lot number

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


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    PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    NEC V850 FG2

    Abstract: V850E V850 instruction set V850 PHo3 ID78K0R-QB minicube2 QB-MINI2 v850 fg3 V850E/PG2 ID78K0S-QB ID850QB
    Text: CUSTOMER NOTIFICATION ZUD-CD-09-0063 1/20 April 24, 2009 Yoshinari Ando, Team Manager Development Tool Solution Group Multipurpose Microcomputer Systems Division Microcomputer Operations Unit NEC Electronics Corporation QB-MINI2 Operating Precautions 1. Product


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    PDF ZUD-CD-09-0063 78K0S 78K0R NEC V850 FG2 V850E V850 instruction set V850 PHo3 ID78K0R-QB minicube2 QB-MINI2 v850 fg3 V850E/PG2 ID78K0S-QB ID850QB

    2sc3052ef

    Abstract: 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 TRANSISTOR S1A 64 smd 1N4148 SOD323 semiconductor cross reference toshiba smd marking code transistor
    Text: Small Signal Discretes Selection Guide [ www.infineon.com/smallsignaldiscretes ] 2 Contents Selection Guide 4 RF Bipolar Transistors & Active Bias Controller 4 RF Switches 6 RF MMICs 7 RF Diodes 8 RF MOSFET 16 Schottky Diodes 18 ESD and EMI Protection Devices and Filters


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    PDF 24GHz BF517 B132-H8248-G5-X-7600 2sc3052ef 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 TRANSISTOR S1A 64 smd 1N4148 SOD323 semiconductor cross reference toshiba smd marking code transistor

    nec control code

    Abstract: IE-78001-R-A IE-780034-NS-EM1 IE-78K0-NS-A
    Text: NEC Electronics Europe GmbH LSI & Discrete Business Unit Technical Product Support Exclusively for design purposes! No part of this may be disclosed to a third party without the consent of NEC Electronics Concerned Products: Customer Notification th Date: May 22 , 2002


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    PDF IE-780034-NS-EM1 SBG-T-2411-E SUD-TT-0105-1-E TPS-LE-B-0T022 TPS-LE-B-0T022-1 TPS-LE-B-0T022-2 nec control code IE-78001-R-A IE-780034-NS-EM1 IE-78K0-NS-A

    Untitled

    Abstract: No abstract text available
    Text: TUBE PACKING 1. CONTAINER Rubber stopper 2. INNER BOX L H Label W LABEL PRODUCT NAME, QUANTITY, LOT NUMBER, CLASS CONTAINER Applied Package INNER BOX Tube 8-pin Plastic SOP Quantity pcs Dimension (mm) (WxH×L) Quantity (Tube) Note MAX. 100 Polyethylene bag


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    PDF 14-pin 16-pin PB-98 MM300-04A MM300-2A 18-pin 20-pin SSD-A-H5019-4

    nec package label

    Abstract: MM450-01A
    Text: TUBE PACKING 1. CONTAINER Rubber stopper 2. INNER BOX L H W Label LABEL POSITION TOP OR SIDE OF BOX LABEL PRODUCT NAME, QUANTITY, LOT NUMBER, CLASS CONTAINER Applied Package 28-pin • Plastic SOP 2.55 mm thick Tube MM450-01A LB-067 INNER BOX Quantity (pcs) / Tube


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    PDF 28-pin MM450-01A LB-067 SSD-A-H5461-2 nec package label MM450-01A

    PB-99

    Abstract: No abstract text available
    Text: TUBE PACKING 1. CONTAINER n ctio ire in d 1p Rubber stopper 2. INNER BOX L H Label W LABEL CONTAINER Applied package 24-pin•Plastic SOP 36-pin·Plastic Shrink SOP Tube PRODUCT NAME, QUANTITY, LOT NUMBER, CLASS INNER BOX Quantity Dimension mm Quantity (pcs)


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    PDF 24-pin 36-pin PB-99 MM300-05A SSD-A-H5615-2 PB-99

    nec package label

    Abstract: No abstract text available
    Text: TUBE PACKING 1. CONTAINER n ctio ire in d 1p Rubber stopper 2. INNER BOX L H Label W LABEL PRODUCT NAME, QUANTITY, LOT NUMBER, CLASS CONTAINER Applied package Tube 20-pin•Plastic SSOP INNER BOX Quantity Dimension mm Quantity (pcs) (W x H × L) (tube) MAX. 75


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    PDF 20-pin 24-pin MM300-1A 30-pin 38-pin SSD-A-H5451-3 nec package label

    MM375-04A

    Abstract: No abstract text available
    Text: TUBE PACKING 1. CONTAINER n ctio ire in d 1p Rubber stopper 2. INNER BOX L H Label W LABEL PRODUCT NAME, QUANTITY, LOT NUMBER, CLASS CONTAINER Applied package Tube INNER BOX Quantity Dimension mm Quantity (pcs) (W x H × L) (tube) 16-pin•Plastic SOP MAX. 50


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    PDF 16-pin 24-pin MM375-04A 28-pin MM375-3A 42-pin SSD-A-H5687-5

    UPD6252

    Abstract: IC-7580 toko s102 E2HD 7SI02 RBS 2111 AS15 G IC as15 G D75516 ST 9527
    Text: APPLICATION NOTE ▲ Fanis* N fc L RA75X ASSEMBLER PACKAGE 111 STRUCTURED ASSEMBLER PREPROCESSOR Document No. EEA—12Ö3 0 .0 . No. EE A—803 Date Published April 199IP Printed in Japan APPLICA T/ON NOTE NEC RA75X ASSEMBLER PACKAGE STRUCTURED ASSEMBLER PREPROCESSOR


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    PDF RA75X 199IP UPD6252 IC-7580 toko s102 E2HD 7SI02 RBS 2111 AS15 G IC as15 G D75516 ST 9527

    IEM-5016

    Abstract: No abstract text available
    Text: NEC 9. /iPD75312 A , 75316(A) INSTRUCTION SET (1) O p e ra n d re p r e s e n ta tio n and d e s c rip tio n D escrib e on e o r m o r e o p e ra n d s in th e o p e ra n d fie ld o f each in s tru c tio n a c c o rd in g t o th e o p e ra n d re p r e s e n ta tio n and d e s c rip tio n m e th o d s o f th e i n s tru c tio n (fo r d e ta ils, re fe r to R A 75 X A s s e m b le r Package


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    PDF uPD75312 uPD75316 EEU-730) PC13-Ü IEM-5016