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    OF BGA STAGGERED PINS Search Results

    OF BGA STAGGERED PINS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    OF BGA STAGGERED PINS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


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    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


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    PCI express PCB footprint

    Abstract: datasheet of BGA Staggered pins "differential via" via antipad pitch Geest UM5000
    Text: DesignCon 2005 Connector footprint optimization enables 10 Gb+ signal transmission Jan De Geest, PhD Winnie Heyvaert Stefaan Sercu, PhD Dana Bergey FCI Communications, Data, Consumer Division FCI ’s-Hertogenbosch BV Victorialaan 1 5213 JG ’s-Hertogenbosch


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    144 QFP body size

    Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
    Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    synopsys Platform Architect

    Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27
    Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    datasheet of BGA Staggered pins

    Abstract: of BGA Staggered pins Samtec Connector Reliability Samtec Cross reference
    Text: HIGH SPEED CONNECTOR OPTIMIZES BANDWIDTH PER SQUARE INCH System allows 1 Terabit of data or 4 GHz per Differential Pair solder joint reliability. This technology is superior to standard BGA/solder ball attachment in that the connectors will only be subjected to extreme heat once - during


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    datasheet of BGA Staggered pins

    Abstract: NEC-V850 VHDL CODE FOR HDLC controller vhdl code for 4 channel dma controller clock tree balancing serdes transceiver 1999 verilog code for i2c vhdl code download for memory in cam vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter
    Text: GS30 0.15-µm CMOS Standard Cell/Gate Array High-Value ASIC ❑ 0.15-µm Leff process 0.18-µm drawn with Shallow Trench Isolation (STI) Inline bond pads Minimum height I/Os Minimum width I/O ❑ 4 and 5 levels of metal ❑ 6 million random logic gates plus 6 million


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    of BGA Staggered pins

    Abstract: of BGA Staggered Pins package C10943X
    Text: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up


    Original     		PDF S272S2-C6-1 S416S2-H6 S480S2-K6-1 S580S2-K6 S672S2-K6-1 C10943X) of BGA Staggered pins of BGA Staggered Pins package C10943X

    verilog code for UART with BIST capability

    Abstract: VHDL CODE FOR HDLC controller ARM dual port SRAM compiler DesignWare SPI vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter Sun Enterprise 250 static SRAM single-port verilog code for 16 bit risc processor verilog code arm processor
    Text: GS30 0.15-µm CMOS Standard Cell/Gate Array Version 0.2 May 16, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    b55qs

    Abstract: CB45000 ultra fine pitch BGA CB55Q CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


    Original     		PDF CB55000 b55qs CB45000 ultra fine pitch BGA CB55Q D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics

    8mm pitch BGA 256 pin 14x14

    Abstract: CB45000 CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


    Original     		PDF CB55000 8mm pitch BGA 256 pin 14x14 CB45000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10

    0.25-um CMOS standard cell library inverter

    Abstract: CMOS GATE ARRAY stmicroelectronics OLIVETTI
    Text: CB55000 Series HCMOS7 Standard Cells FEATURES • ■ ■ ■ ■ ■ 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided


    Original     		PDF CB55000 0.25-um CMOS standard cell library inverter CMOS GATE ARRAY stmicroelectronics OLIVETTI

    LSISS1300

    Abstract: No abstract text available
    Text: Product Brief LSISS1300 Active-Active Multiplexer for SATA and SAS/STP 1.5/3.0 Gb/s An Integrated SATA Active-Active Multiplexer Designed To Connect SATA Hard Drives In Enterprise-Class Disk Array Systems A p p l i c at i o n s a n d F e at u r e s K e y f e at u r e s


    Original     		PDF LSISS1300 500mV 1200mV LSISS1300

    CE61

    Abstract: 032UW 8 bit array multiplier of BGA Staggered Pins package
    Text: CE61 Series Embedded Array ▼ 0.28µm Leff Features 0.28µm Leff 0.35µm drawn Propagation delay of 85 ps Mixed-signal macros–A/D and D/A converters High density diffused RAMs and ROMs Separate core and I/O supply voltages I/Os–5V, 3.3V and 5V tolerant


    Original     		PDF E9/15/19/25/35/45/59/71, F20/30/40/50/60/70/80 E15/19/25/35/45/58/71, F30/40/50/60/70/80 F40/50/60/70/80 E35/45/59/71, F50/60/70/80 E19/25/35/45/59/71 E15/19, F40/50 CE61 032UW 8 bit array multiplier of BGA Staggered Pins package

    Untitled

    Abstract: No abstract text available
    Text: CE61 Series Embedded Array ▼ 0.28µm Leff Features 0.28µm Leff 0.35µm drawn Propagation delay of 85 ps Mixed-signal macros–A/D and D/A converters High density diffused RAMs and ROMs Separate core and I/O supply voltages I/Os–5V, 3.3V and 5V tolerant


    Original     		PDF high9/71, F20/30/40/50/60/70/80 E15/19/25/35/45/58/71, F30/40/50/60/70/80 F40/50/60/70/80 E35/45/59/71, F50/60/70/80 E19/25/35/45/59/71 E15/19, F40/50

    verilog code voltage regulator

    Abstract: verilog code for 32 bit risc processor vhdl code for watchdog timer of ATM fastscan verilog code for 16 bit risc processor NET 1672 analog to digital converter verilog Multi-Channel DMA Controller verilog code arm processor Texas Instruments I2C
    Text: GS30TR 0.15-µm CMOS Standard Cell/Gate Array Version 1.2 May 17, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF GS30TR verilog code voltage regulator verilog code for 32 bit risc processor vhdl code for watchdog timer of ATM fastscan verilog code for 16 bit risc processor NET 1672 analog to digital converter verilog Multi-Channel DMA Controller verilog code arm processor Texas Instruments I2C

    upd4993

    Abstract: f 49055 uPD72103 Z80 PROCESSOR in aerospace 49055 uPD71054 uPD7210 C50T uPD70008 72065B
    Text: CB-C8VX/VM 3-Volt, 0.5-Micron Cell-Based CMOS ASIC NEC Electronics Inc. Preliminary April 1996 Figure 1. BGA Package Examples Description NEC's CB-C8VX/VM CMOS cell-based ASIC family facilitates the design of complete cell-based silicon systems composed of user-defined logic, complex


    Original     		PDF 35-micron A10985EU1V0DS00 upd4993 f 49055 uPD72103 Z80 PROCESSOR in aerospace 49055 uPD71054 uPD7210 C50T uPD70008 72065B

    9513a

    Abstract: PA9513A PA9514A JESD22-A114 JESD22-A115 P82B96 PCA9511A PCA9514A PCA9517 metal detector service manual
    Text: PCA9513A; PCA9514A Hot swappable I2C-bus and SMBus bus buffer Rev. 01 — 11 October 2005 Product data sheet 1. General description The PCA9513A and PCA9514A are hot swappable I2C-bus and SMBus buffers that allow I/O card insertion into a live backplane without corrupting the data and clock buses.


    Original     		PDF PCA9513A; PCA9514A PCA9513A PCA9514A 9513a PA9513A PA9514A JESD22-A114 JESD22-A115 P82B96 PCA9511A PCA9517 metal detector service manual

    NEC-V850

    Abstract: DesignWare SPI vhdl code for watchdog timer of ATM ARM dual port SRAM compiler vhdl coding for analog to digital converter LogicVision verilog for SRAM 512k word 16bit uart verilog lvds synopsys on-chip modeling
    Text: GS30 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 February, 2001 Copyright  Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF SRST145 NEC-V850 DesignWare SPI vhdl code for watchdog timer of ATM ARM dual port SRAM compiler vhdl coding for analog to digital converter LogicVision verilog for SRAM 512k word 16bit uart verilog lvds synopsys on-chip modeling

    DSPG

    Abstract: Samsung Soc processor STD110 ASIC 16C450 16C550 ARM920T ARM940T IEEE1284 STD110 piler
    Text: V S MSUNG STD131 ELECTRONICS STD131 Standard Cell 0.18um System-On-Chip ASIC Dec 2000, V2.0 Features 1.8/2.5/3.3V - Leff= 0.15um, Ldrawn = 0.18um Device - Up to 23 million gates - Power dissipation :24nW/MHz 3.3/5.0V - Gate Delay : 48ps @ 1.8V, 1SL Device


    Original     		PDF STD131 STD131 24nW/MHz ARM920T/ARM940T, DSPG Samsung Soc processor STD110 ASIC 16C450 16C550 ARM920T ARM940T IEEE1284 STD110 piler

    SQ3300

    Abstract: to 252 footprint
    Text: ADVANCED INTERCONNECTIONS, Ball Grid Array Socketing System 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 80 0-424-9850 / 40 1-823-5200 • Fax 40 1-823-8723 •Email advintcorp@ aol.com • Internet http://wvwv.advlntcorp.com BGA Adapter Sockets


    OCR Scan     		PDF 02SSSfl5 SQ3300 to 252 footprint

    SAC305

    Abstract: of component with BGA Staggered Pins IT3D-100S-BGA hirose it3 eutectic 200p35 SAC30S D-100S-B6A 200p35h JT3-200P-20H
    Text: IT3 C o n n e cto r S y s te m G e n e r a l In fo rm a tio n Document Number; ETAD-F0458 Revision 1.5 Section 2 General Hirose's IT3 connector system is designed to provide modular high-speed differential, single-ended and power connections between two parallel boards.


    OCR Scan     		PDF ETAD-F0458 SAC305 of component with BGA Staggered Pins IT3D-100S-BGA hirose it3 eutectic 200p35 SAC30S D-100S-B6A 200p35h JT3-200P-20H

    Untitled

    Abstract: No abstract text available
    Text: p October 1996 Edition 2.0 Z DATASHEET CE61 SERIES 0.35 MICRON HIGH PERFORMANCE/LOW POWER CMOS EMBEDDED ARRA YS CE61 SERIES PRODUCT SUMMARY DESCRIPTION The Fujitsu CE61 is a series of high performance CMOS embedded arrays featuring full support of diffused high-speed


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