Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 May-96 9612 E2 OMEDATA DD547317AGA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-17479, P-17575 READPOINT
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DS1000M-25
May-96
DD547317AGA
P-17479,
P-17575
P-17576
P-17577
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 May-97 9710 E3 OMEDATA DD647404AEB 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19649, P-19698 READPOINT
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DS1000M-25
May-97
DD647404AEB
P-19649,
P-19698
P-19699
P-19700
C/100%
P-19701
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DS232A
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Sep-97 9719 B3 OMEDATA DD709202AAD 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20421, P-20497 READPOINT
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DS232A
Sep-97
DD709202AAD
P-20421,
P-20497
P-20498
P-20499
C/100%
P-20500
DS232A
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19143
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Feb-97 9649 E3 OMEDATA DD633534ADA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19036, P-19141 READPOINT
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DS1000M-25
Feb-97
DD633534ADA
P-19036,
P-19141
P-19142
P-19143
19143
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-96 9618 E2 OMEDATA DD601044ACA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-17994, P-18042 READPOINT
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Aug-96
P-17994,
P-18042
P-18043
P-18044
C/100%
P-18045
DD601044ACA
DS1000M-25
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P19882
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Jun-97 9719 B3 OMEDATA DD709208AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19817, P-19881 READPOINT
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Jun-97
P-19817,
P-19881
P-19882
P-19883
C/100%
P-19884
DD709208AAB
DS232A
P19882
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Dec-96 9639 C2 OMEDATA DD631336AAA 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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Dec-96
P-18887
P-18931
P-18932,
P-18988
P-18989
P-18990
DD631336AAA
DS1620
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P-20338
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-97 9725 E3 OMEDATA DD710338AEA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20229, P-20338 READPOINT
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DS1000M-25
Aug-97
DD710338AEA
P-20229,
P-20338
P-20339
P-20340
P-20338
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Jun-97 9720 C2 OMEDATA DD709222AAC 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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Jun-97
P-19953
P-19955
P-19956,
P-20006
P-20007
P-20008
DD709222AAC
DS1620
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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May-97
P-19656
P-19807,
P-19831
DD642765ABA1
DS1669
P-19832
P-19833
P-19834
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-97 9725 E3 OMEDATA DD710338AEA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20229, P-20338 READPOINT
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Aug-97
P-20229,
P-20338
P-20339
P-20340
C/100%
P-20341
DD710338AEA
DS1000M-25
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DS232A
Abstract: P-19881
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Jun-97 9719 B3 OMEDATA DD709208AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19817, P-19881 READPOINT
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DS232A
Jun-97
DD709208AAB
P-19817,
P-19881
P-19882
P-19883
C/100%
P-19884
DS232A
P-19881
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Nov-96 9642 E3 OMEDATA DD623657AGA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-18586, P-18645 READPOINT
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DS1000M-25
Nov-96
DD623657AGA
P-18586,
P-18645
P-18646
P-18647
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DS1669
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 Nov-96 9642 B3 OMEDATA DD628106AAA 1.2µ OX/NI EEPROM 08 SOIC 200 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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DS1669
Nov-96
DD628106AAA
P-18594
P-18638,
P-18638
P-18733
DS1669
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Sep-97 9719 B3 OMEDATA DD709202AAD 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20421, P-20497 READPOINT
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Sep-97
P-20421,
P-20497
P-20498
P-20499
C/100%
P-20500
DD709202AAD
DS232A
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P-18733
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 Nov-96 9642 B3 OMEDATA DD628106AAA 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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Nov-96
P-18594
P-18638,
P-18638
DD628106AAA
DS1669
P-18733
P-18734
P-18735
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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May-97
P-19656
P-19807,
P-19831
DD642765ABA1
DS1669
P-19832
P-19833
P-19834
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P22243
Abstract: DS1267E DN7-36 P22154 P21256
Text: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1
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DS1000M-25
DS1000
DD740614ABA
P21467
P21488
P21893
P21964
P21965
P21966
P21967
P22243
DS1267E
DN7-36
P22154
P21256
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Mar-97 9702 B3 OMEDATA DD613401AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19285, P-19338 READPOINT
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Mar-97
P-19285,
P-19338
P-19339
P-19340
C/100%
P-19341
DD613401AAB
DS232A
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P-20964
Abstract: 9727
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Nov-97 9727 E3 OMEDATA DD711504ABA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20931, P-20962 READPOINT
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Nov-97
P-20931,
P-20962
P-20963
P-20964
C/100%
P-20965
DD711504ABA
DS1000M-25
9727
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Dec-96 9639 B3 OMEDATA DD611194ACA 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-18738, P-18790 READPOINT
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Dec-96
P-18738,
P-18790
P-18791
P-18792
C/100%
P-18793
DD611194ACA
DS232A
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ALPHA SOLDER
Abstract: ALPHA SOLDER datasheet CY7C199-12VC 140C CY7C199 JESD22
Text: Qualification Report July 1996, QTP# 96162, Version 1.0 LOW ALPHA MOLDING, NON-DIE COAT SRAM PROCESS Omedata, Indonesia PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part
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CY7C199
28-pin,
300-mil
CY7C199)
7C199A
CY7C199-VC
ALPHA SOLDER
ALPHA SOLDER datasheet
CY7C199-12VC
140C
CY7C199
JESD22
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hitachi mold cel
Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound
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CEL9200
CEL9200
8361H
CY7C109-VC
85C/85
CY7C107-VC
hitachi mold cel
9200 hitachi
cel hitachi
cel-9200
cel 9200
Hitachi CEL
9200
140C
8361H
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7C109A
Abstract: CY7C109 JESD22
Text: Qualification Report September 1996, QTP# 96224, Version 1.0 OMEDATA ASSEMBLY 28/32L, 400-MIL SOJ PACKAGE PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part
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28/32L,
400-MIL
CY7C109
32-pin,
7C109A
85C/85
CY7C109-VC
7C109A
CY7C109
JESD22
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