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    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 May-96 9612 E2 OMEDATA DD547317AGA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-17479, P-17575 READPOINT


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    DS1000M-25 May-96 DD547317AGA P-17479, P-17575 P-17576 P-17577 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 May-97 9710 E3 OMEDATA DD647404AEB 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19649, P-19698 READPOINT


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    DS1000M-25 May-97 DD647404AEB P-19649, P-19698 P-19699 P-19700 C/100% P-19701 PDF

    DS232A

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Sep-97 9719 B3 OMEDATA DD709202AAD 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20421, P-20497 READPOINT


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    DS232A Sep-97 DD709202AAD P-20421, P-20497 P-20498 P-20499 C/100% P-20500 DS232A PDF

    19143

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Feb-97 9649 E3 OMEDATA DD633534ADA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19036, P-19141 READPOINT


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    DS1000M-25 Feb-97 DD633534ADA P-19036, P-19141 P-19142 P-19143 19143 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-96 9618 E2 OMEDATA DD601044ACA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-17994, P-18042 READPOINT


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    Aug-96 P-17994, P-18042 P-18043 P-18044 C/100% P-18045 DD601044ACA DS1000M-25 PDF

    P19882

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Jun-97 9719 B3 OMEDATA DD709208AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19817, P-19881 READPOINT


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    Jun-97 P-19817, P-19881 P-19882 P-19883 C/100% P-19884 DD709208AAB DS232A P19882 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Dec-96 9639 C2 OMEDATA DD631336AAA 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


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    Dec-96 P-18887 P-18931 P-18932, P-18988 P-18989 P-18990 DD631336AAA DS1620 PDF

    P-20338

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-97 9725 E3 OMEDATA DD710338AEA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20229, P-20338 READPOINT


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    DS1000M-25 Aug-97 DD710338AEA P-20229, P-20338 P-20339 P-20340 P-20338 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Jun-97 9720 C2 OMEDATA DD709222AAC 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


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    Jun-97 P-19953 P-19955 P-19956, P-20006 P-20007 P-20008 DD709222AAC DS1620 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


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    May-97 P-19656 P-19807, P-19831 DD642765ABA1 DS1669 P-19832 P-19833 P-19834 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Aug-97 9725 E3 OMEDATA DD710338AEA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20229, P-20338 READPOINT


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    Aug-97 P-20229, P-20338 P-20339 P-20340 C/100% P-20341 DD710338AEA DS1000M-25 PDF

    DS232A

    Abstract: P-19881
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Jun-97 9719 B3 OMEDATA DD709208AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19817, P-19881 READPOINT


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    DS232A Jun-97 DD709208AAB P-19817, P-19881 P-19882 P-19883 C/100% P-19884 DS232A P-19881 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Nov-96 9642 E3 OMEDATA DD623657AGA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-18586, P-18645 READPOINT


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    DS1000M-25 Nov-96 DD623657AGA P-18586, P-18645 P-18646 P-18647 PDF

    DS1669

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 Nov-96 9642 B3 OMEDATA DD628106AAA 1.2µ OX/NI EEPROM 08 SOIC 200 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


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    DS1669 Nov-96 DD628106AAA P-18594 P-18638, P-18638 P-18733 DS1669 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Sep-97 9719 B3 OMEDATA DD709202AAD 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20421, P-20497 READPOINT


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    Sep-97 P-20421, P-20497 P-20498 P-20499 C/100% P-20500 DD709202AAD DS232A PDF

    P-18733

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 Nov-96 9642 B3 OMEDATA DD628106AAA 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


    Original
    Nov-96 P-18594 P-18638, P-18638 DD628106AAA DS1669 P-18733 P-18734 P-18735 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


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    May-97 P-19656 P-19807, P-19831 DD642765ABA1 DS1669 P-19832 P-19833 P-19834 PDF

    P22243

    Abstract: DS1267E DN7-36 P22154 P21256
    Text: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


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    DS1000M-25 DS1000 DD740614ABA P21467 P21488 P21893 P21964 P21965 P21966 P21967 P22243 DS1267E DN7-36 P22154 P21256 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Mar-97 9702 B3 OMEDATA DD613401AAB 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-19285, P-19338 READPOINT


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    Mar-97 P-19285, P-19338 P-19339 P-19340 C/100% P-19341 DD613401AAB DS232A PDF

    P-20964

    Abstract: 9727
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1000M-25 Nov-97 9727 E3 OMEDATA DD711504ABA 1.2µ NITRIDE 08 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20931, P-20962 READPOINT


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    Nov-97 P-20931, P-20962 P-20963 P-20964 C/100% P-20965 DD711504ABA DS1000M-25 9727 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS232A Dec-96 9639 B3 OMEDATA DD611194ACA 5.0µ OX/NI 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-18738, P-18790 READPOINT


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    Dec-96 P-18738, P-18790 P-18791 P-18792 C/100% P-18793 DD611194ACA DS232A PDF

    ALPHA SOLDER

    Abstract: ALPHA SOLDER datasheet CY7C199-12VC 140C CY7C199 JESD22
    Text: Qualification Report July 1996, QTP# 96162, Version 1.0 LOW ALPHA MOLDING, NON-DIE COAT SRAM PROCESS Omedata, Indonesia PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    CY7C199 28-pin, 300-mil CY7C199) 7C199A CY7C199-VC ALPHA SOLDER ALPHA SOLDER datasheet CY7C199-12VC 140C CY7C199 JESD22 PDF

    hitachi mold cel

    Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
    Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound


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    CEL9200 CEL9200 8361H CY7C109-VC 85C/85 CY7C107-VC hitachi mold cel 9200 hitachi cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H PDF

    7C109A

    Abstract: CY7C109 JESD22
    Text: Qualification Report September 1996, QTP# 96224, Version 1.0 OMEDATA ASSEMBLY 28/32L, 400-MIL SOJ PACKAGE PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    28/32L, 400-MIL CY7C109 32-pin, 7C109A 85C/85 CY7C109-VC 7C109A CY7C109 JESD22 PDF