dn729
Abstract: P2254 P22154 P22264 P22328 P2252
Text: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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DS1210S
DS1210
DN738347AAA
P21776
P22233
P22310
P22312
P22230
P22309
P22311
dn729
P2254
P22154
P22264
P22328
P2252
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P22243
Abstract: DS1267E DN7-36 P22154 P21256
Text: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1
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DS1000M-25
DS1000
DD740614ABA
P21467
P21488
P21893
P21964
P21965
P21966
P21967
P22243
DS1267E
DN7-36
P22154
P21256
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P2215
Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS
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DS2250T
P22125
DS1210
DS1210S
P2215
P22102
P22372
P22121
40Pn
B1 9742
P22071
dallas date code ds1230
208mil
P22403
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P21256
Abstract: P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308
Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS
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DS2250T
P22125
DS1000
DS1210
P21256
P22102
P22154
P22149
ds1302 dallas
h 9740
P22021
P21308
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