P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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Original
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DS1210S
DN801581AAC
P22330
P22398
P22690
P22728
P22729
P22730
P22731
P2272
P2274
P2147
dl817
P22770
P22522
P22328
dm803
DS2165Q
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PDF
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dn729
Abstract: P2254 P22154 P22264 P22328 P2252
Text: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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Original
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DS1210S
DS1210
DN738347AAA
P21776
P22233
P22310
P22312
P22230
P22309
P22311
dn729
P2254
P22154
P22264
P22328
P2252
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PDF
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P22328
Abstract: P22157 p22230 mar 9746
Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292
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Original
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DS2153
DS2153Q
P22294
P22292
P22556
DN725561AAB
DN720030AAB
DN733468AAB
P22328
P22157
p22230
mar 9746
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PDF
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DS1620 C2
Abstract: 9814 DS1621 P22328 DS2165Q
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti
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Original
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DM821478AIB
DS2502
P23041
DS2153Q
P23108
P22556
DN811539AAB
DN733468AAB
DS2108
DS1620 C2
9814
DS1621
P22328
DS2165Q
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