P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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DS1210S
DN801581AAC
P22330
P22398
P22690
P22728
P22729
P22730
P22731
P2272
P2274
P2147
dl817
P22770
P22522
P22328
dm803
DS2165Q
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DS1620 C2
Abstract: 9814 DS1621 P22328 DS2165Q
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti
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DM821478AIB
DS2502
P23041
DS2153Q
P23108
P22556
DN811539AAB
DN733468AAB
DS2108
DS1620 C2
9814
DS1621
P22328
DS2165Q
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DS87520
Abstract: dm8304 P2271 DS2165Q
Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DL817678ABB
P22755
P22778
J-STD-020
DS87520
DN825394AAB
DS87C520
P23306
dm8304
P2271
DS2165Q
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DS1232L
Abstract: DS1620 C2 ti 9815
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:
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DM821478AIB
DS2502
P23041
DM821478AIB
P23123
DK826585AA
DS1232L
DS1620 C2
ti 9815
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