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    PAC PIN DIAGRAM Search Results

    PAC PIN DIAGRAM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    PAC PIN DIAGRAM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 30A222-00

    DENSE-PAC

    Abstract: SO-DIMM 144-pin
    Text: 16Mx64, 66MHz, SODIMM 30A185-00 C 128 Megabyte SDRAM SODIMM DPSD16MX64RSW5 DESCRIPTION: PIN-OUT DIAGRAM The JEDEC compatible DPSD16MX64RSW5 is a high speed 128 Megabyte CMOS Synchronous DRAM Small Outline DIMM utilizing Dense-Pac’s new and innovative 3-D space saving


    Original     		PDF 16Mx64, 66MHz, 30A185-00 DPSD16MX64RSW5 DPSD16MX64RSW5 DPSD16MXRSW5 DENSE-PAC SO-DIMM 144-pin

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC Programmable Logic DPL22V10A MICROSYSTEMS DESCRIPTION: The Dense-Pac Programmable Logic Module DPL is a 48-pin Pin Grid Array (PGA) designed to support two "22V10" field programmable array logic, 22 input, 10 macrocell output devices (DPL22V10A), including decoupling capacitors, at a


    OCR Scan     		PDF DPL22V10A 48-pin 22V10" DPL22V10A) DPL22V1 24-pin 28-pad 22V10 L22V10

    DPV12832V

    Abstract: 4-00J1 Dense-Pac Microsystems
    Text: DENSE-PAC MICR OSY STEMS 2ÔE D • £75=1415 OOQQIBb ? «] >PC DPV12832V Dense-Pac Microsystems, Inc. ^ 128K X 32 UVEPROM VERSAPAC X 4 ¿ ,- / 3 '2 9 DESCRIPTION: The DPV12832V is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in


    OCR Scan     		PDF DPV12832V DPV12832V 66-pin 200ns 250ns 512KX8, 256KX16 128KX32 30A014-32 4-00J1 Dense-Pac Microsystems

    Untitled

    Abstract: No abstract text available
    Text: v DENSE-PAC 4 Programmable Logic M I C R O S Y S T E M S \ D P L 2 2 V 1 OA DESCRIPTION: The Dense-Pac Programmable Logic M odule DPL is a 48-pin


    OCR Scan     		PDF 48-pin DPL22V10A) L22V10 3OAO41-O0

    40-pin EPROM pinout

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS CDPM 2ÔE D Dense-Pac Microsystems, Inc. • 575^415 OGOQ^Sa 5 WËVPC DPV128X16A ^ H IG H SPEED 128K X 16 U V EP R O M PG A M O D U LE PRELIMINARY DESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPRO M devices in


    OCR Scan     		PDF DPV128X16A DPV128X16A 40-pin 256KX8 250ns StaX16 T-46-13-29 V128X16 120ns 150ns 40-pin EPROM pinout

    Untitled

    Abstract: No abstract text available
    Text: Advance Data Sheet April 1998 microelectronics group Lucent Technologies Bell Labs Innovations A370-Type Analog Uncooled Flat-PAC Laser Module Features • Eight-pin flat-PAC package suitable for CATV applications ■ Frequency range up to 1.5 GHz ■ MQW F-P 1.3 fim laser with single-mode fiber


    OCR Scan     		PDF A370-Type TA-983 370-T DS98-111LWP DS97-317LWP)

    20-PAD

    Abstract: 26LS32 pin diagram
    Text: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are


    OCR Scan     		PDF 20-pad 26LS32 pin diagram

    26LS32 pin diagram

    Abstract: No abstract text available
    Text: DENSE-PAC LOGIPAC M O D U LE 40-PIN PGA LOGIC MODULE M I C R O S Y S T E M S DESCRIPTION: The second Dense-Pac Logic module, the LOGIPAC consists of two logic devices in standard JED EC 20 pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired


    OCR Scan     		PDF 40-PIN AHCT244 26LS32 30A027-00 26LS32 pin diagram

    Untitled

    Abstract: No abstract text available
    Text: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired


    OCR Scan     		PDF DPV32X16A 40-pin 250ns 120ns 150ns 170ns 200ns 250ns 64KXB 32KX16

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit UVEPROM MICROSYSTEMS DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.


    OCR Scan     		PDF DPV256X32V DPV256X32V 66-pin 1024KX8, 512KX 256KX 250ns 120ns 150ns 200ns

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 8 Megabit U VEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV256X32V 66-pin 1024KX8, 512KX 256KX32 250ns 512KX16 30A014-33

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 8 Megabit UVEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.


    OCR Scan     		PDF DPV256X32V DPV256X32V 66-pin 1024KX8, 512KX 256KX32 250ns 125-C

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 0.5 Megabit UVEPROM MICROSYSTEMS DPV32X16A DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of tw o 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.


    OCR Scan     		PDF DPV32X16A DPV32X16A 40-pin 250ns 120ns 150ns 200ns 64KX8 32KX16 00G138S

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 256 Megabyte SDRAM D IM M DPSD32ML64RW5 PIN-OUT DIAGRAM I— DESCRIPTION: The JEDEC compatible DPSD32ML64RW5 is a high speed 256 Megabyte CMOS Synchronous DRAM DIMM, consisting of thirty-two 2Mx8x4 SDRAM devices configured as 16 stacked


    OCR Scan     		PDF DPSD32ML64RW5 3Q\207-00

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA DPV3232VA 66-pin 32Kx32 250ns 128KX8, 64KX16 275R41S

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 2 Megabit UVEPROM MICROSYSTEMS DPV128X16A DESCRIPTION: The D P V 128X 16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV128X16A 40-pin 250ns 120ns 150ns 170ns 200ns QDD1311

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabit CMOS UVEPROM MICROSYSTEMS DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting o f four 128K X 8 CMOS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate w ith matched thermal


    OCR Scan     		PDF DPV12832VA DPV12832VA 66-pin 250nsC 30A014-62 27ST41S 000140b

    0-32k

    Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
    Text: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired


    OCR Scan     		PDF dpv32XI6A DPV32X16A 40pin 250ns l/OO-1/015 30a04902 0-32k CERAMIC PIN GRID ARRAY 120 pins 6A14

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs


    OCR Scan     		PDF DPS3232V DPS3232V 66-pin 128Kx32 256Kx32, 128KX8, 64KX16 32KX32 30A014-10 275T415

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit C M O S D D R SDRAM DPDD16MX8RLBY5 DPDD16MX8RSBY5 DENSE-PAC MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: PIN-OUT DIAGRAM The PL-Sack series is a family of interchangeable memory devices The 128 Megabit Double Data Rate Synchronous D RAM isa member


    OCR Scan     		PDF DPDD16MX8RLBY5 DPDD16MX8RSBY5 DPDD16MX8R3BY5, 53A001-00

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS UVEPROM DPV256S32W DESCRIPTION: PIN-OUT DIAGRAM The DPV256S32W is a 256K x 32 high-speed CMOS UVEPROM module comprised of eight 128K x 8 monolithic CMOS UVEPROM's, an advanced high-speed CM OS decoder, resistor network and


    OCR Scan     		PDF DPV256S32W DPV256S32W Organization10. 30A09400 150ns

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing


    OCR Scan     		PDF DPS512X32ML/DPS512X32MW DPS512X32ML/DPS512X32MW 72-Pin PS512X32MW 30A14Ã 0001fl3M