transistor b 1238
Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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28F160
Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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A7647
Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package
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Untitled
Abstract: No abstract text available
Text: CD54HC190, CD74HC190 CD54HC191, CD74HC191, CD54HCT191, CD74HCT191 SYNCHRONOUS UP/DOWN COUNTERS WITH DOWN/UP MODE CONTROL SCHS275E − MARCH 2002 − REVISED OCTOBER 2003 CD54HC190, 191; CD54HCT191 . . . F PACKAGE CD74HC190 . . . E, NS, OR PW PACKAGE CD74HC191, CD74HCT191 . . . E OR M PACKAGE
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CD54HC190,
CD74HC190
CD54HC191,
CD74HC191,
CD54HCT191,
CD74HCT191
SCHS275E
CD54HCT191
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M676
Abstract: GPLY6928 M676-N2Q1-24
Text: Hyper Mini TOPLED Hyper Bright LED Lead Pb Free Product - RoHS Compliant LG M676, LP M676 Besondere Merkmale Features • • package: white SMT package, colorless clear resin • feature of the device: small package for applications where small space is required
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3000/Rolle,
12000/Rolle,
D-93055
M676
GPLY6928
M676-N2Q1-24
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M676
Abstract: No abstract text available
Text: Hyper Mini TOPLED Hyper Bright LED Lead Pb Free Product - RoHS Compliant LG M676, LP M676 Besondere Merkmale Features • • package: white SMT package, colorless clear resin • feature of the device: small package for applications where small space is required
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3000/reel,
120ns
M676
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footprint jedec MS-026 TQFP
Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES
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7700D
Abstract: No abstract text available
Text: SUPER BRIGHT PLCC-2 PACKAGE m il SURFACE MOUNT LED LAMP PACKAGE DIM ENSIONS SUPER BRIGHT ORANGE QTLP670C0.7700D FEATURES Non-diffused package excellent for back-lighting and coupling to light pipe Low package profile AllnG aP technology W ide viewing angle of 120°
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QTLP670C0
7700D
EIA-535
00010A
7700D
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OPB875
Abstract: QP8870 OPB871 L1052 m745 800LA OPB867 OPB876 OPB 800
Text: Slotted Optical Switches Types OPB 86O, OPB87Û Series Package N Package L Package P Package T Features Absolute Maximum Ratings Ta = 25°C unless otherwise noted • 0.125" wide gap • Choice of aperture • Choice of opaque or IR transmissive shell material
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OPB860
OPB870
OPB875
QP8870
OPB871
L1052
m745
800LA
OPB867
OPB876
OPB 800
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plcc4 led bicolor
Abstract: 3528 plcc-4
Text: PLCC-4 BI-COLOR PACKAGE BÆRLIGHT SURFACE MOUNT LED LAMP PACKAGE DIM ENSIO NS HER / PURE GREEN Q TLP670C-25 FEATURES • Non-diffused package excellent for back-lighting and coupling to light pipe • Low package profile • W ide viewing angle of 120°
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TLP670C-25
EIA-535
00040A
QTLP670C-25
plcc4 led bicolor
3528 plcc-4
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OPB875
Abstract: OPB371 OPB871 QPB870 Sensor OPB 86
Text: 0 . O P IE K Product Bulletin O P B 86O May 1993 Slotted Optical Switches Types O P B 86O, OPB87Û Series Package N Package P Package L Package T Features Absolute Maximum Ratings Ta = 25°C unless otherwise noted • 0.125" wide gap • Choice of aperture
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OPB860,
OPB870
Texas75006
OPB875
OPB371
OPB871
QPB870
Sensor OPB 86
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DL-LS1027
Abstract: No abstract text available
Text: Red Laser Diode DL-LS1027 CTentativjO> Features • • • • • • Tolerance : ±0.2 Unit : mm Package Wavelength : 660 nm Typ. High output p o w e r: 70mW at 70°C (pulse) Low threshold cu rren t: Ith = 45 mA (Typ.) Small package : 0 5.6mm TE mode
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DL-LS1027
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Analog devices branding codes d6b
Abstract: No abstract text available
Text: +2.5 V to +5.5 V, Dual Rail-To-Rail, ANALOG DEVICES Voltage Output 8/10/12-Bit DACs AD5302/12/22 Prelim Technical Information FEATURES AD5302: Two 8-B it DACs in One Package AD5312: Two 10-Bit DACs in One Package AD5322: Two 12-Bit DACs in One Package 10-Pin microSOIC Package
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8/10/12-Bit
AD5302/12/22
AD5302:
AD5312:
10-Bit
AD5322:
12-Bit
10-Pin
200nA@
AD5302BRM
Analog devices branding codes d6b
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Untitled
Abstract: No abstract text available
Text: +2.5 V to +5.5 V, Dual Rail-To-Rail, Voltage Output 8/10/12-Bit DACs AD5303/13/23 Preliminary Technical Data ANALOG DEVICES FEATURES AD5303: Tw o 8-Bit DACs in One Package AD5313: Tw o 10-Bit DACs in One Package AD5323: Tw o 12-Bit DACs in One Package 16-Pin TSSOP Package
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8/10/12-Bit
AD5303/13/23
AD5303:
AD5313:
10-Bit
AD5323:
12-Bit
16-Pin
200nA@
100ki2
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7535
Abstract: 7534PC 7535PC D 7520 C ua 7524 5534DM 5535DM 5535FM 7534DC 5534D
Text: FAIRCHILD LINEAR INTEGRATED CIRCUITS • 5520/7520 SERIES 7534/7535 SENSE AMPLIFIERS CONNECTION D IA G R A M 16-LEA D DIP TOP VIEW PACKAGE OU TLIN ES 6B 9B PACKAGE CODES D P CONNECTION D IA G R A M 16-LEAD FLATPAK PACKAGE O U TLIN E 4L PACKAGE CODE F STRO BE B
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16-LEAD
5534F
5535FM
5534DM
5535DM
7534DC
7635DC
7534PC
7535PC
7535
7534PC
7535PC
D 7520 C
ua 7524
5534DM
5535DM
5535FM
7534DC
5534D
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Untitled
Abstract: No abstract text available
Text: ANALOG DEVICES + 2 .5 V to +5.5 V, Dual Rail-To-Rail, Voltage Output 8/10/12-Bit DACs AD5302/12/22 Prelim inary Technical Data FEATURES AD5302: Tw o 8-Bit DACs in One Package AD5312: Tw o 10-Bit DACs in One Package AD5322: Tw o 12-Bit DACs in One Package 10-Pin m icroSOIC Package
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8/10/12-Bit
AD5302/12/22
AD5302:
AD5312:
10-Bit
AD5322:
12-Bit
10-Pin
200nA@
ti12BRM
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TTL 7414
Abstract: IC sn7414
Text: TYPES SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS _ REVISED DECEMBER 1983 SN 5414, SN 54LS14 . . . J OR W PACKAGE S N 7414 . . . J OR N PACKAGE SN 74LS 14 . . . D, J OR N PACKAGE | • Operation from Very Slow Edges
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SN5414,
SN54LS14,
SN7414,
SN74LS14
54LS14
TTL 7414
IC sn7414
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54ACT11533
Abstract: 74ACT11533 ACT11373 D2957 TI008 624bd
Text: 54ACT11533, 74ACT11533 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS TI0086— 02957, JULY 1907— REVISED MARCH 1990 • Inputs are TTL-Voltage Compatible 54ACT11533 . . . JT PACKAGE 74ACT11533 . . . DW OR NT PACKAGE • 8-Latches in a Single Package
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54ACT11533,
74ACT11533
TI0086â
500-mA
300-mil
54act11s33
54ACT11533
74ACT11533
ACT11373
D2957
TI008
624bd
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74132N
Abstract: IC TS 74132
Text: TYPES SN74132, SN74LS132, SN74S132 SN54132, SN54LS132, SN54S132 QUADRUPLE 2-INPUT POSITIVE-NAND SCHMITT TRIGGERS REVISED DECEMBER 1983 | • Operation from Very Slow Edges SN54132, SN54LS132, S N 548132. J PACKAGE SN 74132. N PACKAGE SN74LS132, SN74S132 . D OR N PACKAGE
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SN74132,
SN74LS132,
SN74S132
SN54132,
SN54LS132,
SN54S132
300-m
SN74S132
74132N
IC TS 74132
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Untitled
Abstract: No abstract text available
Text: rrz SGS-THOMSON T74LS11 TRIPLE 3-INPUT AND GATE DESCRIPTION The T74LS11 is a high speed TRIPLE 3-INPUT AND GATE fabricated in LOW POWER SCHOTTKY technology. D1 B1 Plastic Package (Ceramic Package) M1 C1 (Micro Package) (Plastic Chip Carrier) ORDER CODES :
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T74LS11
T74LS11
T74LS11C
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ac11373
Abstract: 74AC11533 54AC11533 74AC D2957 TI008 2dzl
Text: 54AC11533, 74AC11533 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS TI0085— D2957, JULY 1967— REVISED JANÜAHY 1990 54AC11533 . . . JT PACKAGE 74AC 11533 . . . DW OR NT PACKAGE 8-Lalches in a Single Package 3-State Bus-Driving Inverting Outputs
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54AC11533,
TI0085â
D2957,
300-mil
54ac11533
ac11373
74AC11533
54AC11533
74AC
D2957
TI008
2dzl
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Untitled
Abstract: No abstract text available
Text: OM65Û5SA OM65Q6SA INSULATED GATE BIPOLAR TRANSISTOR IGBT IN A HERMETIC TO-254AA PACKAGE 500 Volt, 15 And 20 Amp, N-Channel IGBT In A Hermetic Metal Package FEATURES Isolated Hermetic Metal Package High Input Impedance Low On-Voltage High Current Capability
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OM65Q6SA
O-254AA
MIL-S-19500,
OM65Q5SA
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lateral mosfet audio amplifier
Abstract: OM6009SA OM6011SA OM6109SA OM6110SA OM6111SA OM6112SA
Text: OM6009SA OM6011SA OM6109SA OM6111SA OM601 OSA QM6012SA OM6110SA OM6112SA POWER MOSFETS IN HERMETIC ISOLATED TO-254AA PACKAGE 100V Thru 500V, Up To 22 Amp, N-Channel MOSFET In Hermetic Metal Package, With Optional Zener Gate Clamp Protection FEATURES • Isolated Hermetic Metal Package
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OM6009SA
OM6011SA
OM6109SA
OM6111SA
OM601
QM6012SA
OM6110SA
OM6112SA
O-254AA
MIL-S-19500,
lateral mosfet audio amplifier
OM6112SA
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D 7520 C
Abstract: 75234PC 66234 ua 7524 55234DM 55234FM 55235DM 55235FM 75234DC 75235DC
Text: FAIRCHILD LINEAR INTEGRATED CIRCUITS » 5520/7520 SERIES 7 5 2 3 4 /7 5 2 3 5 SENSE AMPLIFIERS CONNECTION D IA G R A M 16-LEAD FLA TP A K PACKAGE O U TLIN E 4 L PACKAGE CODE F CONNECTION D IA G R A M 16-LEAD DIP TOP VIEW PACKAGE OU TLIN ES 6 8 9B PACKAGE CODES D P
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16-LEAD
55234FM
55235FM
55234DM
55235DM
75234DC
75235DC
75234PC
75235PC
D 7520 C
66234
ua 7524
55234FM
55235FM
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