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    PACKAGE TRAY 15X15 Search Results

    PACKAGE TRAY 15X15 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE TRAY 15X15 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    fBGA package tray

    Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
    Text: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)


    Original     		PDF FBGA15 15ESP 176-pin 208-pin 273-pin 362-pin 385-pin SSD-A-H7025-3 fBGA package tray JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    Untitled

    Abstract: No abstract text available
    Text: 1575.42MHZ; 15x15x4mm GPS Patch Antenna APAE1575R1540AZDB2F-T Pb RoHS Compliant This product is RoHS compliant Pb in ceramic exempt per RoHS 2002/95/EC Annex (7 . MSL level: Not Applicable FEATURES: • High Gain • Compact Size and Low Profile • Pin type


    Original     		PDF 42MHZ; 15x15x4mm APAE1575R1540AZDB2F-T 2002/95/EC -10dB ISO9001

    APAE1575R1340ABDD6-T

    Abstract: No abstract text available
    Text: 1575.42MHZ; 13 x 13 x 4mm GPS Patch Antenna APAE1575R1340ABDD6-T Pb RoHS Compliant This product is RoHS compliant Pb in ceramic exempt per RoHS 2002/95/EC Annex (7 . MSL level: Not Applicable FEATURES: • High Gain • Compact Size and Low Profile • Pin type


    Original     		PDF 42MHZ; APAE1575R1340ABDD6-T 2002/95/EC -10dB ISO9001 APAE1575R1340ABDD6-T

    sdars radio tuner

    Abstract: LFBGA 289 STA210 CMOS090 CMOS090 STmicroelectronics STA210N LFBGA289 sirius Package tray 15X15 05039E
    Text: STA260 Sirius SDARS channel, service & source decoder Data Brief Features • 2 Satellite and 1 terrestrial signal demodulators and decoders ■ Advanced DSP processor to implement PAC audio decoder ■ Requires a single 17MHz clock reference; all high-speed clock signals are derived using


    Original     		PDF STA260 17MHz 32K/48K/44 32K/48K RS-232 LFBGA289 15x15x1 STA260 sdars radio tuner LFBGA 289 STA210 CMOS090 CMOS090 STmicroelectronics STA210N LFBGA289 sirius Package tray 15X15 05039E

    K4X2G323PD8GD8

    Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
    Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from


    Original     		PDF BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03

    JESD51-9

    Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
    Text: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of


    Original     		PDF

    VFBGA 120

    Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
    Text: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package


    Original     		PDF

    STA210N

    Abstract: No abstract text available
    Text: STA264 Sirius overlay decoder Data Brief Features • De-multiplexes the incoming overlay data stream from the G3 Baseband processor ■ Maximal Ratio Combines the signals from the three streams of data TDM1, TDM2, COFDM ■ Performs diversity combining two demodulated


    Original     		PDF STA264 STA210N

    STA240

    Abstract: STA210N JESD97 STA264 STA264TR sdars radio tuner st 2409 TFBGA249
    Text: STA264 Sirius overlay decoder Data Brief Features • De-multiplexes the incoming overlay data stream from the G3 Baseband processor ■ Maximal Ratio Combines the signals from the three streams of data TDM1, TDM2, COFDM ■ Performs diversity combining two demodulated


    Original     		PDF STA264 TFBGA249 STA240 STA210N JESD97 STA264 STA264TR sdars radio tuner st 2409 TFBGA249

    FGPMMOPA6H

    Abstract: No abstract text available
    Text: GlobalTop Technology Inc. FGPMMOPA6H GPS Standalone Module Data Sheet Data Sheet Revision: V0A The FGPMMOPA6H is a 4th generation stand-alone GPS module with lightning fast TTFF, ultra high sensitivity -165dBm , and low power consumption in a small form factor (16*16*4.7mm)


    Original     		PDF -165dBm) FGPMMOPA6H

    AVX 0603 MTBF

    Abstract: JSTD-033
    Text: X3117P 17A DC-DC POL Data Sheet 10.8V to 13.2V Input • 1.2V to 5.0V Output Member of the Family Benefits • One part for different input and output voltage ranges • Reduces complete solution board area • Reduces discrete parts count by 90% • Two phase 1.2 MHz power train reduces voltage


    Original     		PDF X3117P 15x15mm 100mA, 20Vac, 15Ohm, 12Ohm, 47Ohm, 330Ohm, 91Ohm, 360Ohm, AVX 0603 MTBF JSTD-033

    S29WS256P

    Abstract: S29WS-P S73WS-P
    Text: S73WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Mobile SDRAM on Shared Bus S73WS-P based MCP Products Cover Sheet Data Sheet Advance Information Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S73WS-P S29WS256P S29WS-P

    S71WS512PD0

    Abstract: S29WS512P S29WS-P S71WS512PC0 S71WS512PC0HF3 S71WS512PD0HF3 S71WS-P
    Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet Advance Information S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S71WS-P S71WS512PD0 S29WS512P S29WS-P S71WS512PC0 S71WS512PC0HF3 S71WS512PD0HF3

    Untitled

    Abstract: No abstract text available
    Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet Advance Information S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S71WS-P

    66 ball nor flash

    Abstract: S71WS-P BGA Package 14x14 S71WS128PC0 S71WS512PD0 spansion top marking S29WS128P S29WS256P S29WS512P S29WS-P
    Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S71WS-P 66 ball nor flash BGA Package 14x14 S71WS128PC0 S71WS512PD0 spansion top marking S29WS128P S29WS256P S29WS512P S29WS-P

    B104

    Abstract: J-STD-002 J-STD-020A J-STD-033 schematic diagram dc converter 10 vdc to 10 mVdc C3225X7R1E475M
    Text: X3117P 17A DC-DC POL Data Sheet 10.8V to 13.2V Input • 1.2V to 5.0V Output Member of the Family Benefits • One part for different input and output voltage ranges • Reduces complete solution board area • Reduces discrete parts count by 90% • Two phase 1.2 MHz power train reduces voltage


    Original     		PDF X3117P 100mA, 20Vac, 15Ohm, 12Ohm, 47Ohm, 330Ohm, 91Ohm, 360Ohm, 150Ohm, B104 J-STD-002 J-STD-020A J-STD-033 schematic diagram dc converter 10 vdc to 10 mVdc C3225X7R1E475M

    SCHEMATIC DIAGRAM POWER SUPPLY 12v 10A

    Abstract: No abstract text available
    Text: X3117P 17A DC-DC POL Data Sheet 10.8V to 13.2V Input • 1.2V to 5.0V Output Member of the Family Benefits • One part for different input and output voltage ranges • Reduces complete solution board area • Reduces discrete parts count by 90% • Two phase 1.2 MHz power train reduces voltage


    Original     		PDF X3117P 15x15mm 100mA, 20Vac, 15Ohm, 12Ohm, 47Ohm, 330Ohm, 91Ohm, 360Ohm, SCHEMATIC DIAGRAM POWER SUPPLY 12v 10A

    S71WS128PB0

    Abstract: S71WS256PC0HH3YR0 S71WS512PD0HF3 H-EE 32 S71WS512PD0HH3 S71WS256 TRAY FBGA 11X13
    Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S71WS-P S71WS128PB0 S71WS256PC0HH3YR0 S71WS512PD0HF3 H-EE 32 S71WS512PD0HH3 S71WS256 TRAY FBGA 11X13

    TRAY 15X15

    Abstract: bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515
    Text: I AMSUN ELECTRONICS KS8664B_ CDMA/AMPS Dual Mode Modem Processor DATA SHEET Ordering July, Information Dev ice Package KS8664B 196PBGA KS8664BQ 176TQFP 1999 CDMA Team System LSI/Semiconductor SAMSUNG Electronics Co., LTD. [\D r\D ^ Uí KÍ I— o


    OCR Scan     		PDF KS8664B_ KS8664B KS8664BQ 196PBGA 176TQFP SCom3200 15X15 15X15 BGA--1515 AD4567 TRAY 15X15 bga Shipping Trays tray jedec BGA ad456 176TQFP Package tray 15X15 MPSU 140 tray bga 23 AD4567 BGA-1515

    DAEWON tray drawing

    Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
    Text: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I


    OCR Scan     		PDF P7-246-000) 15X15 -30VS MSC17011 P7-139- MSC-1707 DAEWON tray drawing TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032