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    SIL-PAD to-247

    Abstract: FIP244 IRFIP450 TO-247 FULLPAK Package UAA 1021 EMHART PIR D 203 S 0S3C IRFIZ44G aluminium pop rivet
    Text: International S R ectifier /IPPLICNriON NOTES Savings tips that add value to y im r dtsijius. PU BU SH e ETeW ^ R E C T I F i B ^ 2 K 'K ^ ^ ^ S T O E E l f , '^ ^ E G U N D 6 T C A l i 0 2 4 5 . 310 ‘322-3331" AN-972B Thermal and Mechanical Considerations


    OCR Scan     		PDF AN-972B T0-220AB, O-247AC 66-U464 I0883) SIL-PAD to-247 FIP244 IRFIP450 TO-247 FULLPAK Package UAA 1021 EMHART PIR D 203 S 0S3C IRFIZ44G aluminium pop rivet

    FIP450

    Abstract: T0447 PAD46ABS FULLPAK FP450
    Text: APPLICATION NOTE 972A Thermal and Mechanical Considerations For FullPak Applications HEXFET is a trademark o f International Rectifier by Peter Wood indicated. The requirem ents for such packages are listed below: Plastic Packages Plastic m olded sem iconductors


    OCR Scan     		PDF O-247AC c384V AN-972A TD-247 O-220 PAD43ABS PAD44ABS PAD46ABS O-247 FIP450 T0447 FULLPAK FP450