CONDUCTIVE INK
Abstract: C17200
Text: MATERIAL DECLARATION SHEET Model # 3900 Pot/Rotary Switch Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 Materials CAS
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C17200
CONDUCTIVE INK
C17200
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ELPIDA DDR3
Abstract: "DDR3 SDRAM" Elpida EDJ1108BBSE DDR3 DIMM elpida ELPIDA ELPIDA mobile DDR DDR3 DDR3 pins ddr3 tsop ddr3 datasheet
Text: DDR3 SDRAM Feature Comparison of DDR3, DDR2, and DDR SDRAM Items Data rate/pin CLK Freq. Power supply VDD/VDDQ Interface # of Banks Pre-fetch Burst Length Posted CAS, Additive Latency RL,WL ZQ pin /Reset pin DQ Driver impedance (Ron) DQ Driver calibration
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800/1066/1333/1600Mbps
400/533/667/800MHz)
400/533/667/800Mbps
200/266/333/400MHz)
DDR3-1600/1333
EBJ21UE8BASA-AE-E
DDR3-1066)
EBJ21UE8BASA-8C-E
DDR3-800)
EBJ11UE6BASA-AE-E
ELPIDA DDR3
"DDR3 SDRAM"
Elpida EDJ1108BBSE
DDR3 DIMM elpida
ELPIDA
ELPIDA mobile DDR
DDR3
DDR3 pins
ddr3 tsop
ddr3 datasheet
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744051
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # 6637S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Contact Spring Palmet Alloy 0.00095 2 C-Ring Stainless Steel Alloy
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6637S
7440-5num
744051
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steel alloy
Abstract: formaldehyde carbon ink
Text: MATERIAL DECLARATION SHEET Material # 6638S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Hex Nut Stainless Steel Alloy 2 Lock Washer Stainless Steel Alloy
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6638S
steel alloy
formaldehyde
carbon ink
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NORTEL Magellan
Abstract: cisco ds3 SALI-25C lucent internet telephony server 1997 FETEX-150 "network interface cards"
Text: Silicon Solutions Integrating Communications Worldwide communicator From the President O n July 17, TranSwitch Corporation announced financial results for the second quarter ending June 30, 1996. The Company posted record revenues see page 4 and reported
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SONGEN-51E/155F
TXC-21007
SONGEN-155E/155F
TXC-21107
TXC-20047
NORTEL Magellan
cisco ds3
SALI-25C
lucent internet telephony server 1997
FETEX-150
"network interface cards"
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3315Y
Abstract: nicon 3315Y-L
Text: MATERIAL DECLARATION SHEET Material # 3315Y-L Product Line Encoders Posted Date Compliance Date Q4 / 2004 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Copper Wire Copper Alloy 0.439 Materials Copper Diethyl Glyocol Monbutyl Ether
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3315Y-L
3315Y
nicon
3315Y-L
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3545H
Abstract: 3545-H metal oxide grease TUNGSTEN ALLOY SHEET 744051
Text: MATERIAL DECLARATION SHEET Material # 3545H Product Line Precisions Posted Date Compliance Date Ref. 3548 RoHS Compliant No No. Construction element Material group Material weight [g] 1 Shaft Brass Alloy 9.1625 2 C-Ring Stainless Steel Alloy 0.009 3 Bushing
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3545H
3545H
3545-H
metal oxide grease
TUNGSTEN ALLOY SHEET
744051
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diot bridge
Abstract: transistor quang MPC105 MPC106 FB2B
Text: Copyright c Institute of Electrical and Electronics Engineers. Reprinted Freescale Semiconductor, Inc. with permission. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Motorola's
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MPC106
diot bridge
transistor quang
MPC105
FB2B
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conductive plastic pot
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Model # 3900 Pot/ Push momentary Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 2 Bushing Zinc Alloy
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W3H128M72ER-XSBX
Abstract: M2 8gb pinout
Text: White Electronic Designs W3H128M72ER-XSBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES Data rate = 667, 533, 400 Mb/s Posted CAS additive latency: 0, 1, 2, 3 or 4 Package: Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature
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W3H128M72ER-XSBX
W3H128M72ER-XSBX
M2 8gb pinout
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
W3H32M72E-XSBX
2M72E-ESSB
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744051
Abstract: "MATERIAL DECLARATION SHEET"
Text: MATERIAL DECLARATION SHEET Material # 6657S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Housing Molded PBT 6.8 2 Bushing Steel Alloy 1.35 3 Hex Nut Brass Alloy
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6657S
744051
"MATERIAL DECLARATION SHEET"
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Untitled
Abstract: No abstract text available
Text: Copyright c Institute of Electrical and Electronics Engineers. Reprinted Freescale Semiconductor, Inc. with permission. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Motorola's
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protectin11,
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W3H128M72ER-XSBX
Abstract: LDM-1 W3H128M72
Text: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES Data rate = 667, 533, 400 Mb/s Posted CAS additive latency: 0, 1, 2, 3 or 4 Package: Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature
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W3H128M72ER-XNBX
W3H128M72ER-XSBX
LDM-1
W3H128M72
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm
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W3H64M72E-XSBX
W3H64M72E-XSBX
3H64M72E-ESSB
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W3H32M72E
Abstract: fbga90
Text: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
W3H32M72E
fbga90
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W3H32M72E-XSBX
Abstract: calibration definition
Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
W3H32M72E-XSBX
calibration definition
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M64E-XSBX
W3H32M64E-XSBX
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IGCT
Abstract: IGCT thyristor ABB snubber IGCT IGCT 4.5kv IGCT thyristor IGCT thyristor ABB new ABB IGBT inverter PCIM 96 ABB thyristor modules symmetric IGCT
Text: Application Specific IGCTs Eric Carroll, Bjoern Oedegard, Thomas Stiasny, Marco Rossinelli ICPE, October 2001, Seoul, Korea Copyright [2001] IEEE. Reprinted from the International Conference on Power Electronics. This material is posted here with permission of the IEEE. Such permission of the
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ICPE01
IGCT
IGCT thyristor ABB
snubber IGCT
IGCT 4.5kv
IGCT thyristor
IGCT thyristor ABB new
ABB IGBT inverter
PCIM 96
ABB thyristor modules
symmetric IGCT
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IS43DR86400B
Abstract: IS43DR86400B-25DBI IS43DR16320B Theta-J
Text: IS43/46DR86400B, IS43/46DR16320B AUGUST 2012 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5
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IS43/46DR86400B,
IS43/46DR16320B
512Mb
400MHz
cycles/64
84-ball
60-ball
IS43DR86400B
IS43DR86400B-25DBI
IS43DR16320B
Theta-J
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W3H64M72E-XSBX
Abstract: No abstract text available
Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm
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W3H64M72E-XSBX
W3H64M72E-XSBX
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80385
Abstract: pipeline architecture for 80386 82C385 intel 80386 pin diagram intel 80386 block diagram MARKING T174 bus ARCHITECTURE OF 80386 data bus, control bus intel 80386 bus architecture MDS-C385I 82335 intel
Text: 82C385 32kB 32-BIT CACHE CONTROLLER MATRA W B JULY 1989 FEATURES o Compatible with Intel 82335 32-bit Wrtte»thru scheme for updating main cache controller memory, Including posted write Highly integrated and optimized for 386 Bus snooping for maintaining coher
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82C385
32-BIT
80385
pipeline architecture for 80386
82C385
intel 80386 pin diagram
intel 80386 block diagram
MARKING T174
bus ARCHITECTURE OF 80386 data bus, control bus
intel 80386 bus architecture
MDS-C385I
82335 intel
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Untitled
Abstract: No abstract text available
Text: 82434LX PCI, CACHE, AND MEMORY CONTROLLER PCMC • Supports the Full 64-Bit PentiumTM Processor at 60 MHz and 66 MHz ■ Supports Pipelined Addressing Capability of the Pentium Processor ■ High Performance CPU/PCI/Memory Interfaces Via Posted-Write/ReadPrefetch Buffers
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82434LX
64-Bit
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Untitled
Abstract: No abstract text available
Text: Catalog 889409 PRODUCTS FOR DESKTOP PCs Revised 6-98 Input/Output I/O Connectors (Continued) Subminiature 0 Connectors Straight Posted (AMPLIMITE) HD-22 Front Metal-Shell (Continued) Material: Part Numbers Shell Size No. of Pos. PH. Cade Plug With 4-40 Thd.
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HD-22
HD-20
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