ARM 7TDMI 32 BIT MICROPROCESSOR
Abstract: ARM 7TDMI MICROPROCESSOR PC MOTHERBOARD CIRCUIT diagram D2618 how to build a motherboard latest computer motherboard circuit diagram MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT MANUAL ARM dui 0029 D2912
Text: Integrator/CM7TDMI User Guide Copyright 1999-2001 ARM Limited. All rights reserved. ARM DUI 0126B Integrator/CM7TDMI User Guide Copyright © 1999-2001 ARM Limited. All rights reserved. Release Information Description Issue Change 8 September1999 A New document.
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0126B
September1999
ARM 7TDMI 32 BIT MICROPROCESSOR
ARM 7TDMI MICROPROCESSOR
PC MOTHERBOARD CIRCUIT diagram
D2618
how to build a motherboard
latest computer motherboard circuit diagram
MOTHERBOARD CIRCUIT diagram
PC MOTHERBOARD CIRCUIT MANUAL
ARM dui 0029
D2912
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qimonda HYS72T
Abstract: HYS72T128300EP-3S-B2
Text: March 2008 HYS72T[64/128]3x0EP–25F–B2 HYS72T[64/128]3x0EP–3S–B2 240-Pin VLP Registered DDR2 SDRAM Modules RDIMM SDRAM RoHS Compliant Internet Data Sheet Rev. 1.10 Internet Data Sheet HYS72T[64/128]3x0EP–[25F/3S]–B2 VLP Registered DDR2 SDRAM Modules
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HYS72T
240-Pin
25F/3S]
HYS72T128320EP-
25F/3S
qimonda HYS72T
HYS72T128300EP-3S-B2
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PC200
Abstract: DQ2880
Text: . Preliminary IBM16M64644HGA IBM16M32644HGA IBM16M64734HGA IBM16M32734HGA 32/64Mx64/72 1 or 2 Bank Registered DDR SDRAM Module Features • 184-Pin Registered 8-Byte Dual In-Line Memory Module • 32M/64Mx72 and x64 Double Data Rate DDR SDRAM DIMM (32M X 8 SDRAMS)
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IBM16M64644HGA
IBM16M32644HGA
IBM16M64734HGA
IBM16M32734HGA
32/64Mx64/72
184-Pin
32M/64Mx72
PC200
PC266B
100MHz
PC200
DQ2880
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IBM0625404GT3B
Abstract: IBM06254K4GT3B IBM0625804GT3B PC200 IBM0625804GT3B-8E
Text: IBM0625404GT3B IBM06254K4GT3B IBM0625804GT3B 256Mb Double Data Rate Synchronous DRAM Advance Rev 0.2 Features CAS Latency and Frequency CAS Latency 2 2.5 Maximum Operating Frequency MHz * PC266A (-75E) PC266B (-8E) PC200 (-10H) 133 143 125 133 100 125 * Values are nominal (exact tCK should be used).
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IBM0625404GT3B
IBM06254K4GT3B
IBM0625804GT3B
256Mb
PC266A
PC266B
PC200
29L0011
E36997
IBM0625404GT3B
IBM0625804GT3B
PC200
IBM0625804GT3B-8E
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HYS72T128000EP-3S-B2
Abstract: PC2-6400P-555-12-L0 PC2-6400P-555-12-F0 HYS72T128000EP-2 HYS72T128000EP-3 2GB PC2-5300P-555-12-H0 PC2-6400P-555-12-H0 HYS72T256220EP HYS72T128020EP-25F-B2
Text: June 2008 HYS72T[64/128/256]xx0EP–[2.5/25F]–B2 HYS72T[64/128/256]xx0EP–[3/3S]–B2 HYS72T[64/128/256]xx0EP–3.7–B2 240-Pin Registered DDR2 SDRAM Modules RDIMM SDRAM EU RoHS Compliant Internet Data Sheet Rev. 1.02 Internet Data Sheet HYS72T[64/128/256]xx0EP–[2.5/25F/3/3S/3.7]–B2
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HYS72T
5/25F]
240-Pin
5/25F/3/3S/3
HYS72T128000EP-3S-B2
PC2-6400P-555-12-L0
PC2-6400P-555-12-F0
HYS72T128000EP-2
HYS72T128000EP-3
2GB PC2-5300P-555-12-H0
PC2-6400P-555-12-H0
HYS72T256220EP
HYS72T128020EP-25F-B2
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29L0011
Abstract: No abstract text available
Text: IBM0625164GT3B IBM0625404GT3B IBM06254B4GT3B IBM0625804GT3B 256Mb Double Data Rate Synchronous DRAM Advance Features CAS Latency and Frequency CAS Latency 2 2.5 Maximum Operating Frequency MHz * PC266A PC266B PC200 133 125 100 143 133 125 * Values are nominal (exact tCK should be used).
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IBM0625164GT3B
IBM0625404GT3B
IBM06254B4GT3B
IBM0625804GT3B
256Mb
PC266A
PC266B
PC200
29L0011
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MAX1454
Abstract: PC2-6400P-555-12-L0 PC2-6400P-555-12-F0
Text: January 2008 HYS72T[64/128/256]xx0EP–[2.5/25F]–B2 HYS72T[64/128/256]xx0EP–[3/3S]–B2 HYS72T[64/128/256]xx0EP–3.7–B2 240-Pin Registered DDR2 SDRAM Modules RDIMM SDRAM RoHS Compliant Internet Data Sheet Rev. 1.01 Internet Data Sheet HYS72T[64/128/256]xx0EP–[2.5/25F/3/3S/3.7]–B2
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HYS72T
5/25F]
240-Pin
5/25F/3/3S/3
MAX1454
PC2-6400P-555-12-L0
PC2-6400P-555-12-F0
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TSB12LV23
Abstract: P1394a irmc 1394 SCHEMATIC DIAGRAM AD27 AD29 AD30 TSB12LV22
Text: TSB12LV23 OHCIĆLynx PCIĆBased IEEE 1394 Host Controller Data Manual 1999 Buss Solutions SLLS328A IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information
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TSB12LV23
SLLS328A
TSB12LV23
P1394a irmc
1394 SCHEMATIC DIAGRAM
AD27
AD29
AD30
TSB12LV22
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DDR200
Abstract: DDR266A DDR266B IBMN612404GT3B IBMN612804GT3B IBMN62540 IBMN62580 128MB PC266
Text: IBMN612404GT3B IBMN612804GT3B 128Mb Double Data Rate Synchronous DRAM Preliminary Features CAS Latency and Frequency CAS Latency 2 2.5 Maximum Operating Frequency MHz * DDR266A (7N) DDR266B (75N) DDR200 (8N) 133 143 100 133 100 125 * Values are nominal (exact tCK should be used).
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IBMN612404GT3B
IBMN612804GT3B
128Mb
DDR266A
DDR266B
DDR200
06K0566
F39350B
DDR200
DDR266A
DDR266B
IBMN612404GT3B
IBMN612804GT3B
IBMN62540
IBMN62580
128MB PC266
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DDR200
Abstract: DDR266A DDR266B IBMN62540 IBMN625404GT3B IBMN62580 IBMN625804GT3B
Text: IBMN625404GT3B IBMN625804GT3B 256Mb Double Data Rate Synchronous DRAM Preliminary Features CAS Latency and Frequency CAS Latency Maximum Operating Frequency MHz * DDR266A (7N) DDR266B (75N) DDR200 (8N) 133 143 100 133 100 125 2 2.5 * Values are nominal (exact tCK should be used).
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IBMN625404GT3B
IBMN625804GT3B
256Mb
DDR266A
DDR266B
DDR200
29L0011
E36997B
DDR200
DDR266A
DDR266B
IBMN62540
IBMN625404GT3B
IBMN62580
IBMN625804GT3B
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Untitled
Abstract: No abstract text available
Text: IBMN625404GT3B IBMN625804GT3B 256Mb Double Data Rate Synchronous DRAM Preliminary Features CAS Latency and Frequency CAS Latency Maximum Operating Frequency MHz * DDR266A (7N) DDR266B (75N) DDR200 (8N) 133 143 100 133 100 125 2 2.5 * Values are nominal (exact tCK should be used).
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IBMN625404GT3B
IBMN625804GT3B
256Mb
DDR266A
DDR266B
DDR200
29L0011
E36997A
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d 9329
Abstract: MARKING Scw SOT23 gus-ss cel-9220 cel9220 scw marking code sot 23 PFC-W0805LF SCW-SC3LF WCA0804 PWC2512L
Text: Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series • Reliable, no internal cavity • High resistor density - .025” lead spacing • Standard JEDEC 16, 20, and 24 pin packages • Ultra-stable TaNSil resistors on silicon substrates
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environment-57-5
CEL9220
30248E-05
2562E-05
d 9329
MARKING Scw SOT23
gus-ss
cel-9220
cel9220
scw marking code sot 23
PFC-W0805LF
SCW-SC3LF
WCA0804
PWC2512L
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posted CAS jedec 1999
Abstract: No abstract text available
Text: PRELIMINARY 64Mb: x4, x8 DDR SDRAM DOUBLE DATA RATE DDR SDRAM MT46V16M4 - 4 Meg x 4 x 4 banks MT46V8M8 - 2 Meg x 8 x 4 banks For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V
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64Mx4x8DDR
posted CAS jedec 1999
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x86 series
Abstract: n439 10h13 stpcc0166 schematics IBM 1161 STPCD01 117CP
Text: STPC CLIENT PC Compatible Embeded Microprocessor • POWERFUL X86 PROCESSOR • 64-BIT 66MHz BUS INTERFACE • • 64-BIT DRAM CONTROLLER SVGA GRAPHICS CONTROLLER • • UMA ARCHITECTURE VIDEO SCALER • VIDEO OUTPUT PORT • VIDEO INPUT PORT • •
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64-BIT
66MHz
135MHz
PBGA388
x86 series
n439
10h13
stpcc0166
schematics IBM 1161
STPCD01
117CP
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uses of water level controller using timer 555 ic
Abstract: ha 13108 pal cvbs frame synchronizer x86 series sparkle 7404n STPCC0166BTC3 stpcc0166 60800 91211
Text: STPC CONSUMER PC Compatible Embeded Microprocessor PRELIMINARY DATA • POWERFUL X86 PROCESSOR ■ 64-BIT BUS ARCHITECTURE ■ 64-BIT DRAM CONTROLLER ■ SVGA GRAPHICS CONTROLLER ■ UMA ARCHITECTURE ■ VIDEO SCALER ■ DIGITAL PAL/NTSC ENCODER ■ VIDEO INPUT PORT
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64-BIT
135MHz
PBGA388
uses of water level controller using timer 555 ic
ha 13108
pal cvbs frame synchronizer
x86 series
sparkle
7404n
STPCC0166BTC3
stpcc0166
60800
91211
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AA01 ti
Abstract: TMS 3529 0j22 0g07
Text: IBM Dual Bridge and Memory Controller Databook Revision 01 - July 13, 2000 Copyright and Disclaimer Copyright International Business Machines Corporation 1999. All Rights Reserved Printed in the United States of America July 2000 The following are trademarks of International Business Machines Corporation in the United States, or other countries, or both.
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dbamc01
IBM25CPC710AB3A100
AA01 ti
TMS 3529
0j22
0g07
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IBM "embedded dram"
Abstract: m5m4v4169 Intel 1103 DRAM Nintendo64 IBM98 toshiba fet databook dynamic memory controler MOSYS eDRAM "1t-sram" MoSys
Text: ABSTRACT MODERN DRAM ARCHITECTURES by Brian Thomas Davis Co-Chair: Assistant Professor Bruce Jacob Co-Chair: Professor Trevor Mudge Dynamic Random Access Memories DRAM are the dominant solid-state memory devices used for primary memories in the ubiquitous microprocessor systems of
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conn95]
64-Mbit
Woo00]
EE380
class/ee380/
Wulf95]
Xanalys00]
Yabu99]
IBM "embedded dram"
m5m4v4169
Intel 1103 DRAM
Nintendo64
IBM98
toshiba fet databook
dynamic memory controler
MOSYS eDRAM
"1t-sram"
MoSys
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0y10
Abstract: 0K-10 0y22 0Y06 0n25 137 0H14
Text: â IBM Dual Bridge and Memory Controller Databook â Copyright and Disclaimer Copyright International Business Machines Corporation 1999. All Rights Reserved Printed in the United States of America September 1999 The following are trademarks of International Business Machines Corporation in the United States, or other countries, or both.
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IBM25CPC710AB3A100
0y10
0K-10
0y22
0Y06
0n25
137 0H14
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IBM host bridge CPC710
Abstract: 137 0H14 0w08 0Y06 CPC710 timing CPC710
Text: IBM Dual Bridge and Memory Controller CPC710-100 Databook Version 1.0 December 17, 1999 Copyright and Disclaimer Copyright International Business Machines Corporation 1999. All Rights Reserved Printed in the United States of America November 1999
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CPC710-100
-66MHz
CPC710
IBM host bridge CPC710
137 0H14
0w08
0Y06
CPC710 timing
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SPRU031
Abstract: 10X40 TMS320VC33 74as1004 mpsd TMS320VC33, instruction set
Text: TMS320VC33 DIGITAL SIGNAL PROCESSOR SPRS087E - FEBRUARY 1999 - REVISED JANUARY 2004 D High-Performance Floating-Point Digital D D D D D D D D D D Signal Processor DSP : - TMS320VC33-150 - 13-ns Instruction Cycle Time - 150 Million Floating-Point Operations
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TMS320VC33
SPRS087E
TMS320VC33-150
13-ns
TMS320VC33-120
17-ns
32-Bit
32-Bit
16-/32-Bit
32-/40-Bit
SPRU031
10X40
74as1004 mpsd
TMS320VC33, instruction set
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Untitled
Abstract: No abstract text available
Text: TMS320VC33 DIGITAL SIGNAL PROCESSOR SPRS087E - FEBRUARY 1999 - REVISED JANUARY 2004 D High-Performance Floating-Point Digital D D D D D D D D D D Signal Processor DSP : - TMS320VC33-150 - 13-ns Instruction Cycle Time - 150 Million Floating-Point Operations
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TMS320VC33
SPRS087E
TMS320VC33-150
13-ns
TMS320VC33-120
17-ns
32-Bit
32-Bit
16-/32-Bit
32-/40-Bit
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TMS320VC33
Abstract: 74F175 74LVT240 TMS320C31 TMS320VC33-120 TMS320VC33-150 VC33 10X40 TMS320VC33PGEA12 74as1004 mpsd
Text: TMS320VC33 DIGITAL SIGNAL PROCESSOR SPRS087E − FEBRUARY 1999 − REVISED JANUARY 2004 D High-Performance Floating-Point Digital D D D D D D D D D D Signal Processor DSP : − TMS320VC33-150 − 13-ns Instruction Cycle Time − 150 Million Floating-Point Operations
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TMS320VC33
SPRS087E
TMS320VC33-150
13-ns
TMS320VC33-120
17-ns
32-Bit
32-Bit
40-Bit
TMS320VC33
74F175
74LVT240
TMS320C31
TMS320VC33-120
TMS320VC33-150
VC33
10X40
TMS320VC33PGEA12
74as1004 mpsd
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Untitled
Abstract: No abstract text available
Text: TMS320VC33 DIGITAL SIGNAL PROCESSOR SPRS087E - FEBRUARY 1999 - REVISED JANUARY 2004 D High-Performance Floating-Point Digital D D D D D D D D D D Signal Processor DSP : - TMS320VC33-150 - 13-ns Instruction Cycle Time - 150 Million Floating-Point Operations
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TMS320VC33
SPRS087E
TMS320VC33-150
13-ns
TMS320VC33-120
17-ns
32-Bit
32-Bit
16-/32-Bit
32-/40-Bit
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MCDM(R)-06T
Abstract: micron power resistor Marking mos MZK 105 aeks PC200
Text: PRELIM INARY DOUBLE DATA RATE DDR SDRAM MT46V16M4 4 Meg x 4 x 4 banks MT46V8M8 - 2 Meg x 8 x 4 banks For the latest data sheet revisions, please refer to the Micron W e b site: mvw.mkrors.iom/miii/mstx"?:! FEATURES PIN ASSIGNM ENT (TOP VIEW ) • Vdd = +2.5V +0.2V, V d d Q = +2.5V +0.2V
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OCR Scan
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MT46V16M4
MT46V8M8
66-PIN
64Mx4x8DDR
MCDM(R)-06T
micron power resistor Marking mos
MZK 105
aeks
PC200
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