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    PROBE WAFER Search Results

    PROBE WAFER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    RJP1CS07DWA-00#W0 Renesas Electronics Corporation IGBT 1250V 150A Wafer Visit Renesas Electronics Corporation
    RJP65S08DWA-00#W0 Renesas Electronics Corporation IGBT 650V 200A Wafer Visit Renesas Electronics Corporation
    RJP1CS05DWA-80#W0 Renesas Electronics Corporation IGBT 1250V 75A Wafer Visit Renesas Electronics Corporation
    RJP65S03DWA-80#W0 Renesas Electronics Corporation IGBT 650V 30A Wafer Visit Renesas Electronics Corporation
    RJP1CS01DWA-80#W0 Renesas Electronics Corporation IGBT 1250V 15A Wafer Visit Renesas Electronics Corporation

    PROBE WAFER Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    tsm 1250

    Abstract: No abstract text available
    Text: PA300BEP 300 mm Semi-automatic Backside Emission Probe System DATA SHEET The PA300BEP backside emission probe system is a versatile, high-performance probe system for use with upward-looking observation systems. The PA300BEP offers easy wafer handling, automatic stepping and simple vertical probe card alignment in one


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    PA300BEP PA300BEP PA300BEP-DS-0112 tsm 1250 PDF

    Cascade Microtech

    Abstract: No abstract text available
    Text: High-stable HF wafer contact ideal for automated wafer testing Z Probe High-Frequency Wafer Probe GS/SG 10 GHz A Ground-Signal (GS) coniguration is the most cost-effective RF design as less wafer space is taken up with contact pads. Cascade Microtech’s |Z| Probe in a GS/SG coniguration enables wafer-level testing with the highest accuracy and throughput available while


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    ZProbe10-ss-0310 Cascade Microtech PDF

    Untitled

    Abstract: No abstract text available
    Text: PA300PS-MA 300 mm Semi-Automatic Probe System DATA SHEET The PA300PS-MA is the world’s only analytical probe system for ine-pitch probing of pads down to 30 m x 30 μm, veriication of ball grid arrays and the most universal tool for wafer-level reliability WLR tests with 220 mm or 320 mm Celadon tiles. The semiautomatic probe system employs the powerful ProbeShield technology, enabling accurate low-noise measurements of atto amps


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    PA300PS-MA PA300PS-MA PA300PS-MA-DS-1012 PA300PS-MA. PDF

    Untitled

    Abstract: No abstract text available
    Text: PM300 300 mm Manual Probe System DATA SHEET The PM300 probe system is the ideal solution for engineering tests of 300 mm wafers and substrates. Whatever your application, the versatility of the PM300 meets all requirements from failure analysis FA to device and wafer characterization (DWC) to


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    PM300 PM300 PM300-DS-0212 PDF

    Untitled

    Abstract: No abstract text available
    Text: PM300WLR 300 mm Manual Probe System DATA SHEET The PM300WLR is the world’s only dedicated probe system for wafer-level reliability WLR test of substrates up to 300 mm. The PM300WLR delivers accurate measurement results before the device is packaged, minimizing the time and cost to collect critical


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    PM300WLR PM300WLR PM300WLR-DS-0212 PDF

    piezoelectric transducer 40khz

    Abstract: ultrasonic sensor 40khz pic TC820CPL 40KHZ ULTRASONIC transducers TC820 TC820CKW TC820CLW TC820-based "power factor measurement" schematic PIC Microcontroller 40KHz Ultrasonic Transducer
    Text: TC820 3-3/4 Digit A/D Converter with Frequency Counter and Logic Probe Features General Description • Multiple Analog Measurement System - Digit A/D Converter - Frequency Counter - Logic Probe • Low Noise A/D Converter: - Differential Inputs: 1pA Bias Current


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    TC820 50ppm/ 40-Pin D-81739 B67412SD* DS21476B-page piezoelectric transducer 40khz ultrasonic sensor 40khz pic TC820CPL 40KHZ ULTRASONIC transducers TC820 TC820CKW TC820CLW TC820-based "power factor measurement" schematic PIC Microcontroller 40KHz Ultrasonic Transducer PDF

    Untitled

    Abstract: No abstract text available
    Text: CM300 300 mm semi-/fully-automated probe system DATA SHEET In device and process development, the right solution helps you handle test requirements that change from day to day. That’s why Cascade Microtech developed the CM300, a lexible on-wafer probe system that scales to meet your evolving needs. By capturing the


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    CM300 CM300, CM300 CM300-DS-0713 PDF

    ultrasonic sensor 40khz pic

    Abstract: ULTRASONIC METER PIC 40KHZ ULTRASONIC transducers H bridge converter with dsPIC TC820CPL 40 khz ultrasonic transducer 40KHZ ultrasonic TX pic 3 digit 7 segment LCD driver ultrasonic sensor 40khz sensor 7106 LCD driver
    Text: Obsolete Device TC820 3-3/4 Digit A/D Converter with Frequency Counter and Logic Probe Features General Description • Multiple Analog Measurement System - Digit A/D Converter - Frequency Counter - Logic Probe • Low Noise A/D Converter: - Differential Inputs: 1 pA Bias Current


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    TC820 DS21476C-page ultrasonic sensor 40khz pic ULTRASONIC METER PIC 40KHZ ULTRASONIC transducers H bridge converter with dsPIC TC820CPL 40 khz ultrasonic transducer 40KHZ ultrasonic TX pic 3 digit 7 segment LCD driver ultrasonic sensor 40khz sensor 7106 LCD driver PDF

    16C72

    Abstract: PIC16C72 PIC12C671 PIC12C672 PIC12C67X PIC16C710 PIC16C711 PIC16C715 TB020 intcon
    Text: M TB020 PIC12C67X Emulation Using PIC16C72 PICMASTER Emulator Probe FIGURE 1: Author: Rob Stein VDD 1 GP5/OSC1/CLKIN 2 GP4/OSC2/AN3 GP3/MCLR/VPP 3 PIC12C671 PIC12C672 This technical brief describes how to use the PIC16C72 PICMASTER™ emulator probe for


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    TB020 PIC12C67X PIC16C72 PIC12C671 PIC12C672 PIC12C67X PIC12C67X. DS91020A-page 16C72 PIC12C671 PIC12C672 PIC16C710 PIC16C711 PIC16C715 TB020 intcon PDF

    logic probe

    Abstract: No abstract text available
    Text: Obsolete Device TC820 3-3/4 Digit A/D Converter with Frequency Counter and Logic Probe Features General Description • Multiple Analog Measurement System - Digit A/D Converter - Frequency Counter - Logic Probe • Low Noise A/D Converter: - Differential Inputs: 1 pA Bias Current


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    TC820 DS21476C-page logic probe PDF

    PIC16C72

    Abstract: 16C72 PIC12C671 PIC12C672 PIC12C67X PIC16C710 PIC16C711 PIC16C715 TB020 intcon
    Text: M TB020 PIC12C67X Emulation Using PIC16C72 PICMASTER Emulator Probe FIGURE 1: Author: Rob Stein VDD 1 GP5/OSC1/CLKIN 2 GP4/OSC2/AN3 GP3/MCLR/VPP 3 PIC12C671 PIC12C672 This technical brief describes how to use the PIC16C72 PICMASTER™ emulator probe for


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    TB020 PIC12C67X PIC16C72 PIC12C671 PIC12C672 PIC12C67X PIC12C67X. 16C72 PIC12C671 PIC12C672 PIC16C710 PIC16C711 PIC16C715 TB020 intcon PDF

    Untitled

    Abstract: No abstract text available
    Text: PA200BlueRay 200 mm Semi-Automatic Probe System with BlueRay Technology DATA SHEET The PA200 BlueRay sets a new standard for high-speed accuracy. Its precision ensures smooth probe landing with safe, repeatable electrical contact. In combination with the unique Z-profiling function, even extreme variation in height, such as the case with warped wafers, can be compensated. This test


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    PA200BlueRay PA200 PA200BR-DS-0412 PDF

    Untitled

    Abstract: No abstract text available
    Text: Elite300 300 mm Semi-automatic Probe System DATA SHEET The Elite 300 is essential for characterizing devices at the 32 nm technology node and beyond. This probe systems uses PureLine™ technology to achieve one of the lowest noise levels available on the market. Patented AttoGuard and MicroChamber® technologies signiicantly improve


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    Elite300 Elite-DS-0612 PDF

    Untitled

    Abstract: No abstract text available
    Text: I - 0517J rev. A FD100U06A5B FRED Die in Wafer Form z 600V VF = 1.25V typ. 5" Wafer 100% Tested at Probe c Electrical Characteristics Parameter VFM VFM VRRM IRM trr Description Typical Forward Voltage Typical Forward Voltage Minimum Reverse Breakdown Voltage


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    0517J FD100U06A5B PDF

    Untitled

    Abstract: No abstract text available
    Text: PD - 20988 FD120W06A5B FRED Die in Wafer Form # # 600V VF = 3.2 V max. 5" Wafer 100% Tested at Probe ! Available in Tape and Reel, Chip Pack, and Sawn on Film " (upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


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    FD120W06A5B 350nC PDF

    Untitled

    Abstract: No abstract text available
    Text: PD - 20987 FD120T06A5B FRED Die in Wafer Form # # 600V VF = 1.1 V max. 5" Wafer 100% Tested at Probe ! Available in Tape and Reel, Chip Pack, and Sawn on Film " (upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


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    FD120T06A5B 190ns PDF

    Untitled

    Abstract: No abstract text available
    Text: I - 0517J rev. B FD100U06A5B FRED Die in Wafer Form z 600V VF = 1.25V typ. 5" Wafer 100% Tested at Probe c Electrical Characteristics Parameter VFM VFM VRRM IRM trr Description Typical Forward Voltage Typical Forward Voltage Minimum Reverse Breakdown Voltage


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    0517J FD100U06A5B PDF

    8ETL06

    Abstract: No abstract text available
    Text: PD - 20989 FD100T06A5B FRED Die in Wafer Form # # 600V VF = 1.1 V max. 5" Wafer 100% Tested at Probe ! Available in Tape and Reel , Chip Pack, and Sawn on Film "(upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


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    FD100T06A5B 150ns 8ETL06 PDF

    die-attach

    Abstract: spc data sheet monitor
    Text: Gate Array Design Digital ASIC Plastic Package Commercial Product Flow SPC, QC Monitors Wafer Fabrication SPC, QC Monitors Wafer Probe SPC, QC Monitors Saw and Visual Inspection SPC, QC Monitors Die Attach and Wire Bond QC Monitors Visual Inspection SPC, QC Monitors


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    PDF

    FD100T06A5B

    Abstract: 8ETL06 MIL-HDBK-263 S1025 for IR hexfet die
    Text: PD - 20989 rev.A FD100T06A5B FRED Die in Wafer Form # # 600V VF = 1.1 V max. 5" Wafer 100% Tested at Probe ! Available in Tape and Reel , Chip Pack, and Sawn on Film "(upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


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    FD100T06A5B 150ns 12-Mar-07 FD100T06A5B 8ETL06 MIL-HDBK-263 S1025 for IR hexfet die PDF

    Standard Wafer Eval

    Abstract: Mil-Std-105D MIL-STD-105-D MIL-STD105D GaAs wafer
    Text: PERFORMANCE GRADING AND SCREENING OPTIONS FOR MwT GaAs FETS LEGEND Wafer Evaluation Die Optional Standard Wafer Evaluation Evaluation Sample RF & DC Audit 40 Dice Min. MwT-2M0903 Process Wafer Stabilization Bake 300°C for 5 hours 100% DC Probe Scribe and Break


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    MwT-2M0903) 2M0903) MIL-STD-105D) Standard Wafer Eval Mil-Std-105D MIL-STD-105-D MIL-STD105D GaAs wafer PDF

    FD100W06A5F

    Abstract: MIL-HDBK-263 S1025 8ETX06 FD100W06A5B
    Text: PD - 20990 rev.A FD100W06A5B FRED Die in Wafer Form # # 600V VF = 3.0 V max. 5" Wafer 100% Tested at Probe ! Available in Tape and Reel , Chip Pack, and Sawn on Film "(upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


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    FD100W06A5B 195nC 12-Mar-07 FD100W06A5F MIL-HDBK-263 S1025 8ETX06 FD100W06A5B PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME SOT-223 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Small Outline Transistor SOT-223 SOT-223 is a leadframe based, plastic encapsulated package


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    OT-223 OT-223) OT-223 DS582B PDF

    AT22V10

    Abstract: No abstract text available
    Text: CMOS PLD Testing Non-Windowed OTP PLDs Atmel’s testing of non-windowed OTP PLDs is comprehensive and thorough. It is sufficient to guarantee programmability and performance. The wafer-probe test checks 100% of all memory elements for programmability. Final test of


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    PDF