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    PWSSO36

    Abstract: powerso-36 and pcb footprint MO-271 TN0054 jedec MO-271 powerso-20 and pcb footprint PwSSO24 pwsso16 PwSS036 MO-166
    Text: TN0054 Technical note PwSSO packages, an effective solution for power dissipation and miniaturization Introduction This document provides information on the PwSSO, MO-271 JEDEC registered power IC surface mount package family. Following the success of the PowerSO – MO-166 packages, and in reply to the increasing


    Original     		TN0054 MO-271 MO-166 PwSSO24 PwSSO36 powerso-36 and pcb footprint TN0054 jedec MO-271 powerso-20 and pcb footprint pwsso16 PwSS036 PDF