Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP52 package SOT379-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP52
OT379-2
OT379-2
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sot379
Abstract: No abstract text available
Text: PDF: 1999 Nov 03 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp
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QFP52:
OT379-2
OT379-2
MS-022
sot379
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Untitled
Abstract: No abstract text available
Text: Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM bp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM θ Lp D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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QFP52:
OT379-1
135E04
MS-022
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Untitled
Abstract: No abstract text available
Text: Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM bp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM θ Lp D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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QFP52:
OT379-2
MS-022
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qfp52
Abstract: QFP52-S1
Text: PACKAGE DIMENSIONS QFP52-S1 12.0 ±0.4 0 ~10ﾟ 10.0 ±0.3 26 52 14 10.0 ± 0.3 40 12.0 ± 0.4 27 39 13 0.32 ± 0.06 +0.07 0.13-0.04 1.00 ± 0.05 0.65 0.15 M 1.20MAX 1 0.6 ±0.2 0.10 0.1 ± 0.05 Mold Base UNIT : mm GD-Q05201G-1 Ver.2005-11-24
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QFP52-S1
20MAX
GD-Q05201G-1
qfp52
QFP52-S1
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QFP-52
Abstract: QFP52 MS-022
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM
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QFP52:
OT379-1
135E04
MS-022
QFP-52
QFP52
MS-022
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QFP52-A2
Abstract: QFP52
Text: パッケージ外形図 QFP52-A2 13 .2 ±0. 2 0 ～10 ° 10.0 ±0. 2 27 26 52 14 10.0 ± 0. 2 40 1 1 3.2 ± 0.2 39 0. 3 ±0 .1 1.1 TYP 0.13 0. 8 ± 0 .2 13 M 2. 0 ± 0 .2 +0. 1 0 .15 -0. 05 2. 45MA X 0. 65 0.1 11 .6 ±0. 2 + 0.15 0 .1 - 0.10 Mol d Ba se GD-Q05201T-0
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QFP52-A2
GD-Q05201T-0
QFP52-A2
QFP52
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QFP52-S1
Abstract: No abstract text available
Text: パッケージ外形図 QFP52-S1 12.0 ±0.4 0 ~10ﾟ 10.0 ±0.3 52 14 1 +0.07 0.13 -0.04 1.00 ± 0.05 0.65 13 0.32 ± 0.06 0.1 ± 0.05 0.10 Ver.2005-11-24 M ﾓ-ﾙﾄﾞ 底 面 0.6 ±0.2 GD-Q05201G-1 0.15 1.20MAX 26 10.0 ± 0.3 40 12.0 ± 0.4 27 39 単位 : mm
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QFP52-S1
GD-Q05201G-1
20MAX
QFP52-S1
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JRC 2355
Abstract: FMM4024KW QFP52 PLL 2400 MHZ
Text: FMM4024KW 1.0625Gbps FIBRE CHANNEL REPEATER IC FEATURES • 1.0625Gbps Repeater IC for FIBRE CHANNEL Hubs/Disk Arrays • Low Power Consumption: 0.5W • Single Power Supply Voltage: +3.3V • LVTTL and PECL Interface • Thermally Enhanced, QFP52 Mold Package with Heat Sink
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FMM4024KW
0625Gbps
QFP52
FMM4024
FCSI0597M200
JRC 2355
FMM4024KW
PLL 2400 MHZ
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QFP52
Abstract: MS-022 sot379
Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2.0 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM
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QFP52:
OT379-1
135E04
MS-022
QFP52
MS-022
sot379
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MS022
Abstract: MS-022 QFP52
Text: PDF: 2000 Jan 26 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2.0 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM
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QFP52:
OT379-2
MS-022
MS022
MS-022
QFP52
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QFP52-A2
Abstract: QFP52
Text: PACKAGE DIMENSIONS QFP52-A2 13 .2 ±0. 2 0 ～10 ° 10.0 ±0. 2 27 26 52 14 10.0 ± 0. 2 40 1 1 3.2 ± 0.2 39 0. 3 ±0 .1 1.1 TYP 0.13 0. 8 ± 0 .2 13 M 2. 0 ± 0 .2 +0. 1 0 .15 -0. 05 2. 45MA X 0. 65 0.1 11 .6 ±0. 2 + 0.15 0 .1 - 0.10 Mol d Ba se GD-Q05201T-0
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QFP52-A2
GD-Q05201T-0
QFP52-A2
QFP52
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MS-022
Abstract: QFP52
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp
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QFP52:
OT379-2
MS-022
MS-022
QFP52
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QFP52
Abstract: No abstract text available
Text: PDF: 1999 Nov 03 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp
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QFP52:
OT379-1
OT379-1
MO-QFP52:
MO-108
QFP52
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NJU3427
Abstract: NJU3427 E NJU3427F IC NJU3427F dr26 QFP52-A2 DR31 DR25 Diode Datasheet DR34 DR35
Text: Preliminary NJU3427 36 Outputs VFD Controller/Driver Package GENERAL DESCRIPTION The NJU3427 is a 36-output VFD Vacuum Fluorescent Display controller/driver. The NJU3427 consists of high-voltage driving circuit, Timing/ Segment driver select circuit, display data RAM
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NJU3427
NJU3427
36-output
NJU3427FA2
NJU3427FH2
20-Seg
x16-Timing
28-Seg
NJU3427 E
NJU3427F
IC NJU3427F
dr26
QFP52-A2
DR31
DR25 Diode Datasheet
DR34
DR35
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LQFP64. footprint
Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
LQFP64. footprint
dual infrared transistor
TQFP80 footprint
QFP package weight
diode databook package outline
SMD Packages
TQFP100 footprint
LQFP32
LQFP48
LQFP64
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SIEMENS AVR GENERATOR
Abstract: philips dect Siemens metro brazil 80CL51 philips rf manual 80C51 PCD5032 PCD5093 PCD5093H PCD5096
Text: INTEGRATED CIRCUITS DATA SHEET PCD5093 DECT baseband controller Objective specification File under Integrated Circuits, IC17 1997 Jul 21 Philips Semiconductors Objective specification DECT baseband controller PCD5093 CONTENTS 1 FEATURES 1.1 DSP software features
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PCD5093
SCA55
437027/00/01/pp16
SIEMENS AVR GENERATOR
philips dect
Siemens metro brazil
80CL51
philips rf manual
80C51
PCD5032
PCD5093
PCD5093H
PCD5096
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vcd player block diagram
Abstract: block diagram of VCD block diagram of VCD and its functions colour tv power supply system ic SAA7185 circuits video player circuit diagram CCIR601 CCIR656 DR14 QFP100
Text: INTEGRATED CIRCUITS DATA SHEET SAA2510 Video CD VCD decoder Preliminary specification File under Integrated Circuits, IC02 1996 May 21 Philips Semiconductors Preliminary specification Video CD (VCD) decoder SAA2510 FEATURES (With standard microcode loaded)
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SAA2510
SCDS48
537021/1200/01/pp28
vcd player block diagram
block diagram of VCD
block diagram of VCD and its functions
colour tv power supply system ic
SAA7185 circuits
video player circuit diagram
CCIR601
CCIR656
DR14
QFP100
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PLL 2400 MHZ
Abstract: No abstract text available
Text: FMM4024KW 1.0625Gbps FIBRE CHANNEL REPEATER 1C FEATURES • 1.0625Gbps Repeater IC for FIBRE CHANNEL Hubs/Disk Arrays • Low Power Consumption: 0.5W • Single Power Supply Voltage: +3.3V • LVTTL and PECL Interface • Thermally Enhanced, QFP52 Mold Package with Heat Sink
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FMM4024KW
0625Gbps
QFP52
FMM4024
FCSI0597M200
PLL 2400 MHZ
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Untitled
Abstract: No abstract text available
Text: QFP52-P-1010-0.65
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QFP52-P-1010-0
65QFP52-P-1010-0
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Untitled
Abstract: No abstract text available
Text: QFP52—P—1010—0.65 Unii;: nn o i +i i_n ci OJ LO 0 n. ft±n. ? OJ LO O o o o Feb.2007
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QFP52-P-1010-0
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Untitled
Abstract: No abstract text available
Text: QFP52—P—1010—0.65 Unii;: nn Feb,2007
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QFP52-P-1010-0
2007QFP52-P-1010-0
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SFE10.52MJA10
Abstract: 8745H
Text: Philips Semiconductors Preliminary specification Satellite sound receiver with l2C-bus control TDA8745 FEATURES • On-chip frequency synthesizer and mixer: - tuning range 4 to 9.77 M Hz - reference oscillator 4 M H z using a crystal or 4 MHz frequency source
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TDA8745
711Dfl2ti
0101E00
SFE10.52MJA10
8745H
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TK10420
Abstract: TK10486 TK10485M FM IF detector for cordless phones OPA 37U TK10487M TK16202U 130mvrms TK10485 10483z
Text: TOKO AMERICA INC 54E D ^Ob7b3S 0001=133 bbT • TAI TOKO INTEGRATED CIRCUITS ib ib ICs for Communications Equipment ic Operating voltage V Package 9 .5 - 1 0 .5 U-6 • • Surface Taping Mounting equip. Circuits and functions Production 3 < Video equip.
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80dBft
100mV
TK10420
TK10486
TK10485M
FM IF detector for cordless phones
OPA 37U
TK10487M
TK16202U
130mvrms
TK10485
10483z
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