VBH48A
Abstract: VPC176A PQFP 176 pqfp144 VQZ120A PLASTIC FLAT PACKAGE VBG48A VEF44A VEJ44A VGB52A
Text: Plastic Quad Flat Package PQFP 32 Lead Molded Plastic Quad Flat Package NS Package Number VBE32A 2000 National Semiconductor Corporation MS101167 www.national.com Plastic Quad Flat Package (PQFP) May 1999 Plastic Quad Flat Package (PQFP) 44 Lead (10mm x 10mm) Molded Plastic Quad Flat Package, EIAJ
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VBE32A
MS101167
VEF44A
VEJ44A
VEK44A
VGZ44A
VBH48A
VPC176A
PQFP 176
pqfp144
VQZ120A
PLASTIC FLAT PACKAGE
VBG48A
VEF44A
VEJ44A
VGB52A
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TQFP 144 PACKAGE
Abstract: transistor A144 A101 TQFP 32 PACKAGE a101 transistor TQFP Package 44 lead A101 Package A144 transistor data sheet A64 Package pdf A101 datasheet
Text: Package Diagram Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 1 Package Diagram 44-Lead Thin Plastic Quad Flat Pack A44 64-Pin Thin Quad Flat Pack A64 2 Package Diagram 64-Lead Thin Plastic Quad Flat Pack A65 3 Package Diagram 80-Pin Thin Plastic Quad Flat Pack A80
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32-Lead
44-Lead
64-Pin
64-Lead
80-Pin
100-Pin
144-Pin
160-Pin
100-Lead
TQFP 144 PACKAGE
transistor A144
A101
TQFP 32 PACKAGE
a101 transistor
TQFP Package 44 lead
A101 Package
A144 transistor data sheet
A64 Package
pdf A101 datasheet
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VLB128A
Abstract: VNH128A VNG144B Thin Quad flat package
Text: Thin Quad Flat Package TQFP 64 Lead Molded Thin Quad Flat Package NS Package Number VEV64A 1999 National Semiconductor Corporation MS101176 www.national.com Thin Quad Flat Package (TQFP) May 1999 64 Lead Molded Thin Quad Flat Package NS Package Number VJK64A
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VEV64A
MS101176
VJK64A
VLB128A
VNH128A
VNG144B
VLB128A
VNH128A
VNG144B
Thin Quad flat package
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A101
Abstract: A144
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
A101
A144
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transistor A144
Abstract: A101 TQFP 144 PACKAGE 51-85050-A 85049 A144 plastic quad flat pack
Text: Package Diagram Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagram 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
transistor A144
A101
TQFP 144 PACKAGE
51-85050-A
85049
A144
plastic quad flat pack
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plastic quad flat pack
Abstract: No abstract text available
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65
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32-Lead
51-85063-B
44-Lead
51-85064-B
64-Pin
1-85051-A
64-Lead
51-85046-B
80-Pin
51-85065-B
plastic quad flat pack
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XC68307
Abstract: xpc821 XC68HC901 XC68EC060 XC68040 XC68330FC XC68060 SPAK821 mc68340rp MC68230
Text: SG167/D REV 20 µ MOTOROLA Embedded Systems FACT SHEET 3rd QUARTER 1996 FC = Plastic Quad Gull Wing FE = Ceramic Quad (Gull Wing) FG = Plastic Quad Flat Pack (PQFP) FN = Plastic Quad Pack (PLCC) FT = Plastic Flat Pack (28 x 28 mm) FU = Plastic Quad Flat Pack (14 x 14 mm)
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SG167/D
MC68341EST
MC68341
M68349CPU
M68349
M68349IDP
MPC821ADS
MPC821
MPC821ADS-PC
XC68307
xpc821
XC68HC901
XC68EC060
XC68040
XC68330FC
XC68060
SPAK821
mc68340rp
MC68230
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A48A
Abstract: A101 120-PIN 7x7x1.4 160-PIN plastic quad flat pack 10X10X1.4 tqfp 44
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.4 mm A32.14 51-85088-*B 1 Package Diagrams 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 44-Lead Thin Plastic Quad Flat Pack 10 x 10 x 1.0 mm A44SB
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32-Lead
51-85063-B
44-Lead
51-85064-B
A44SB
48-Lead
52-Lead
A48A
A101
120-PIN
7x7x1.4
160-PIN
plastic quad flat pack
10X10X1.4 tqfp 44
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A64 Package
Abstract: No abstract text available
Text: 3.14 Package Diagrams 64-Pin Thin Quad Flat Pack A64 3-148 Package Diagrams 100-Pin Plastic Thin Quad Flat Pack TQFP A100 3-149 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 3-150
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64-Pin
100-Pin
64-Lead
A64 Package
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Untitled
Abstract: No abstract text available
Text: 3.14 Package Diagrams 64-Pin Thin Quad Flat Pack A64 3-142 Package Diagrams 100-Pin Plastic Thin Quad Flat Pack TQFP A100 3-143 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 3-144
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64-Pin
100-Pin
64-Lead
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MO-220-WGGD-1
Abstract: Technical Brief TB389 TB389
Text: Plastic Packages for Integrated Circuits Thin Quad Flat No-Lead Plastic Package TQFN Thin Micro Lead FramePlastic Package (TMLFP) L20.4x4A 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I) MILLIMETERS SYMBOL MIN NOMINAL
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MO-220WGGD-1
TB389.
MO-220-WGGD-1
Technical Brief TB389
TB389
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CERQUAD
Abstract: G3 Package ROMless 80C51
Text: Philips Semiconductors Ordering Information XA PRODUCTS Example: P51XA G3 7 K B A Philips 80C51 eXtended Architecture Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Flat Pack (TQFP) FA = Hermetic Cerdip (window)
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P51XA
80C51
16MHz
20MHz
24MHz
30MHz
CERQUAD
G3 Package
ROMless
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Untitled
Abstract: No abstract text available
Text: G2T & G2U PACKAGE CONFIGURATIONS G2T 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP G2U 68 LEAD, CERAMIC QUAD FLAT PACK, ALL LINEAR DIMENSIONS ARE MILLIMETERS AND January 2004 Rev. 1 1 White Electronic Designs Corporation • 602 437-1520 • www.whiteedc.com
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TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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MO-220VHHB
P30mm
TB389.
TB389
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L56.8x8A 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VLLD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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MO-220VLLD-2
TB389.
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3NE8
Abstract: MO-220-vhhd-2 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x5B 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHD-2 ISSUE C MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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MO-220VHHD-2
TB389.
3NE8
MO-220-vhhd-2
TB389
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land pattern for QFN 7x7
Abstract: MO-220-VKKD-1 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L44.7x7 44 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKD-1 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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MO-220VKKD-1
TB389.
land pattern for QFN 7x7
MO-220-VKKD-1
TB389
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TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6B 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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MO-220VJJB
-30mm
TB389.
TB389
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MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4C 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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MO-220VGGD-2
TB389.
MO-220-VGGD-2
TB389
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Technical Brief TB389
Abstract: MO-220VJJC TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L28.6x6 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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MO-220VJJC
-30mm
TB389.
Technical Brief TB389
TB389
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MO-220-VJJD-2
Abstract: TB389 tip 410
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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MO-220VJJD-2
TB389.
MO-220-VJJD-2
TB389
tip 410
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Untitled
Abstract: No abstract text available
Text: Quad Flat Package / MQUAD Pages 41-54,57-68 (Plastic Quad Flat Package / Thin Quad Flat Package) (Pages 41-54) (Bumped Quad Flat Package) (Pages 55-56, 69-70) (Plastic Lead Chip Carrier) (Pages 71-76) (Leadless Chip Carrier) (Page 77) (Tape Carrier Package / Tape Automated Bonding) (Pages 78-82)
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LCC1
Abstract: No abstract text available
Text: - SELECTOR GUIDE DISCRETE BI-POLAR DEVICES Description Ceramic Surface Mount Quad Ceramic Flat Pack Ceramic Surface Mount Ceramic Surface Mount Quad Ceramic Flat Pack Ceramic Surface Mount Quad Ceramic Flat Pack Ceramic Surface Mount Ceramic Surface Mount
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50min
5/20m
LCC1
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BL-5C
Abstract: lm 4658 IZB33 CA28
Text: 3.3 VOLT CMOS SyncFlFO1 512x36,1,024x36 and 2,048 x 36 Integrated Device Technology, Inc. • Available in 132-pin plastic quad flat package PQFP or space-saving 120-pin thin quad flat package (TQFP) • Pin and functionally compatible versions of the 5V
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PDF
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512x36
024x36
IDT72V3631
IDT72V3641
IDT72V3651
IDT72V3651
PN120-1)
PQ132-1)
BL-5C
lm 4658
IZB33
CA28
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