Untitled
Abstract: No abstract text available
Text: SERIES 9000 EQUIPMENT Aeronautical and Maritime Radiocommunication Systems VHF DATA RADIO COMMUNICATION SYSTEMS EM9000 | RE9000 EM9000 TRANSMITTER Wide band 118-136.975 MHz Output power up to 50 W for AM and D8PSK Compliant New Mask for D8PSK,
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EM9000
RE9000
EM9000
RE9000
BNS9008:
PGM9000:
PCR9008:
REST26154:
CPV900,
CONV-VOIP9000:
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-05
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-02
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-04
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Untitled
Abstract: No abstract text available
Text: Adapter TSOP I RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-04
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-03
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bajo
Abstract: No abstract text available
Text: Multiadaptador SMD-TSOP I/II RE900 - epóxido FR4 1,50 mm, por dos lados 35 µm CU pth - Lado de soldadura y de componetes con una superficie quimica de níquel/oro (Ni/Au) y una mascára de inhibidora dela soldadura - distancia entre las zonas terminales:
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RE900
RE900-01
RE900-02
RE900-03
RE900-04
RE900-05
RE900-06
bajo
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Untitled
Abstract: No abstract text available
Text: Adapter TSOP II RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-06
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gerber
Abstract: No abstract text available
Text: Adapter TSOP II RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-05
gerber
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enamelled copper wire swg table
Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Text: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .
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element-14
127mm
210x297mm)
420x297mm)
33MTR
enamelled copper wire swg table
RS-274-D
for all smd components
F585-34
BS4520
BS4584 PART 3
MELF 3514 dimensions
jigs and fixtures mini project
BS4584 102.5
cuzn40pb2
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-01
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Untitled
Abstract: No abstract text available
Text: Adapter TSOP I RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-03
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RE900-02
Abstract: No abstract text available
Text: Multiadaptateur pour CMS TSOP I/II RE900 - fibre de verre FR4 époxyde 1,50 mm, double face 35 µm CU entièrement metallisées - côte soudure et composants avec une surface de nickel/d´or chimique (Ni/Au) et pourvus d`un masque d´arrêt de soudure - distances entre les terminales:
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RE900
RE90019
RE900-01
RE900-02
RE900-03
RE900-04
RE900-05
RE900-06
RE900-02
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gerber
Abstract: No abstract text available
Text: Adapter TSOP I RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-02
gerber
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from TSOP Type II
Abstract: No abstract text available
Text: Multiadapter - SMD TSOP I/II RE900 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil); 0.80 mm (30 mil); 1.27 mm (50 mil)
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RE900
RE900-01
RE900-02
RE900-03
RE900-04
RE900-05
RE900-06
from TSOP Type II
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RE900
Abstract: No abstract text available
Text: SMD-TSOP I/II Multiadapter RE900 - Epoxyd FR4 1,50 mm, zweiseitig 35 µm CU durchkontaktiert - Löt- und Komponentenseite mit einer Oberfläche aus chem. Nickel/Gold (NI/AU) sowie Lötstopmaske - Pitch Abstände: 0,40 mm (15.7 mil); 0,50 mm (19.7 mil) 0,65 mm (26.5 mil); 0,80 mm (30 mil); 1,27 mm (50 mil)
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RE900
RE900-01
RE900-02
RE900-03
RE900-04
RE900-05
RE900-06
RE900
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Untitled
Abstract: No abstract text available
Text: Adapter TSOP I RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of
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RE900-01
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