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    REFLOW SOLDERING PROFILE BGA Search Results

    REFLOW SOLDERING PROFILE BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    REFLOW SOLDERING PROFILE BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    Lead Free reflow soldering profile BGA

    Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
    Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array


    Original     		EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181 PDF

    FBGA-484

    Abstract: BGA313 reflow soldering profile BGA
    Text: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile. Recommended method of attaching QFP prototype sockets to a PCB.


    Original     		PDF

    Soldering Instructions

    Abstract: reflow soldering profile BGA BGA reflow guide BGA PROFILING reflow temperature bga
    Text: Tel: 800 404-0204 www.ironwoodelectronics.com Giga-snaP & BGA Surface Mount Foot Soldering Instructions Target PCBs, which are intended to accept the Ironwood Electronics BGA surface mount emulator foot can vary greatly in size, mass, and thickness. There are also several manufacturing


    Original     		PDF

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786 PDF

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 PDF

    reballing

    Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
    Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.


    Original     		PDF

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


    Original     		AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029 PDF

    Lead Free reflow soldering profile BGA

    Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
    Text: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.


    Original     		XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles PDF

    AN3300

    Abstract: sjt1 J-STD-020B
    Text: Freescale Semiconductor Application Note Document Number: AN3300 Rev. 0, 07/2006 General Soldering Temperature Process Guidelines Solder Joint and Package Temperature for Pb-free BGA in SnPB and Pb-free Solders in IR or Convection Reflow Ovens Freescale Semiconductor’s commitment to quality,


    Original     		AN3300 AN3300 sjt1 J-STD-020B PDF

    spst reed relay

    Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
    Text: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic


    Original     		CH-8197 F-91971 CZ-10400 spst reed relay Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile PDF

    stencil tension

    Abstract: AN1028 AN-1028 BHARAT pcb warpage* in smt reflow
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s iPOWIR BGA Packages Table of Contents Page Introduction . 1


    Original     		AN-1028 stencil tension AN1028 AN-1028 BHARAT pcb warpage* in smt reflow PDF

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U PDF

    HD6417709SBP167BV

    Abstract: reflow soldering profile BGA SH7709S SH3-DSP HD6417706BP133V HD6417727BP160V Hitachi DSA00207
    Text: HITACHI MICROCOMPUTER TECHNICAL UPDATE No. TN-SH7-380A/E DATE 22 November 2001 THEME SH3,SH3-DSP BGA Package usage notice in Reflow Soldering Spec change Supplement of Documents CLASSIFICATION Limitation on Use PRODUCTNAME HD6417706BP133V, HD6417709SBP167BV, HD6417709SBP133BV,HD6417709SBP100BV,


    Original     		TN-SH7-380A/E HD6417706BP133V, HD6417709SBP167BV, HD6417709SBP133BV HD6417709SBP100BV, HD6417729RBP167BV, HD6417729RBP133BV HD6417729RBP100BV, HD6417622BP100V HD6417622BP80V, HD6417709SBP167BV reflow soldering profile BGA SH7709S SH3-DSP HD6417706BP133V HD6417727BP160V Hitachi DSA00207 PDF

    0.65mm pitch BGA

    Abstract: BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout
    Text: Application Report SPRA429A TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		SPRA429A TMS320C6000 C6000 0.65mm pitch BGA BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 TMS320C6202 0.35mm BGA fanout PDF

    Kester 197

    Abstract: No abstract text available
    Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder


    Original     		Sn63Pb37, 10Sep04 Kester 197 PDF

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152 PDF

    BGA reflow guide

    Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
    Text: Application Report SPRA429B TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		SPRA429B TMS320C6000 C6000 BGA reflow guide TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA PDF

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile PDF

    bga 100 PACKAGE footprint

    Abstract: DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3
    Text: Application Note 3118 Replacing a PowerCap Module with a Reflowable BGA Module www.maxim-ic.com INTRODUCTION In order to facilitate conversion of an existing PCB design utilizing a NV SRAM PowerCap Module to the equivalent NV SRAM Single-Piece Reflowable BGA Module, there are a few simple steps required to first verify


    Original     		DS1230YP-70 256kb DS2030Y-70ons/comments/suggestions bga 100 PACKAGE footprint DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3 PDF

    Heraeus paste profile

    Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
    Text: Application Note June 21, 2008 Document No. : AN007-0001, Ver. 1.21 PDF Name: TLynx_Mfgr_Guide.pdf Application Guidelines for Non-Isolated Converters AN07-001: Manufacturing Guidelines for TLynx Series Modules Introduction The TLynxTM series modules are SMT DC/DC nonisolated converters, that feature a pinless interconnect


    Original     		AN007-0001, AN07-001: Heraeus paste profile PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus PDF

    JEDEC J-STD-020d.1

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
    Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		AN-353-2 JEDEC J-STD-020d.1 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA PDF