REFLOWING PROFILES LGA Search Results

REFLOWING PROFILES LGA Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
AM79C970AVC-G		Rochester Electronics LLC	Rochester Manufactured 79C970, Ethernet Controller, 144 LQFP Package, Commercial Temp spec.
LUSB3193002		Amphenol Communications Solutions	Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste
R7FS5D57A2A01CLK#AC1		Renesas Electronics Corporation	120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray
R7FS5D57C2A01CLK#AC1		Renesas Electronics Corporation	120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray
UPA2371T1P-E1-A		Renesas Electronics Corporation	Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga

REFLOWING PROFILES LGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
IPC-7527 Abstract: IPC-7525 koki solder paste IPC7527 Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527	PDF
IPC-7527 Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT	PDF
IPC-7527 Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000 Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2	Original		PDF
schroff SPG Abstract: GST18 SATA disk controller SLT3-PAY-2F2U-14 schroff SPG 124 Text: Main Catalog 24th Edition Main Catalog Schroff gmbh, Langenalber Strasse 96–100, D-75334 Straubenhardt WWW.PENTAIREQUIPMENTPROTECTION.COM Equipment Protection Solutions 24th Edition \| October 2012 39601-641 2012 Pentair Equipment Protection 18002_Hauptkatalog_Schroff_Umschlag_AK03_EN.indd 1	Original	D-75334 schroff SPG GST18 SATA disk controller SLT3-PAY-2F2U-14 schroff SPG 124	PDF