PCB Stereo Socket

Abstract: stereo switched socket stereo pcb jack stereo jack socket Cliff stereo socket Cliff jack switched stereo jack mono jack socket stereo plug current rating
Contextual Info: CLIFF 1/4'' S2 Mono & Stereo Jack Sockets S2 / BNB Solder Tag S2 / BNB PC - C Kinked S2 / BBB PC - A Special Nose S2 / BBB PC - C Kinked The CLIFF range of S2 Jack Sockets incorporates our Ni-Ag® Alloy SelfCleaning Contacts for superior performance and reliability. All models have a

XC68341FT16

Abstract: M68000 M68300 MC68341 VT100 71F4
Contextual Info: Freescale Semiconductor, Inc. S0 S2 S4 S0 S2 S4 S0 S2 CLKOUT A31–A2 A1 A0 FC3–FC0 Freescale Semiconductor, Inc. SIZ1 BYTE WORD Parts Not Suitable SIZ0 R/W For Additiona AS68K CSx End-Of-Life Produ DS AS UDS LDS UWE LWE DSACK DTC D15–D8 OP2 D7–D0

lot date code samsung

Abstract: Samsung 925 GLAR94001 DIODE BBC bbc DIODE H Beam SI 1340
Contextual Info: ISSUE NO : 08083789 Rev: 000 DATE OF ISSUE : 2008. 06. 12 SPECIFICATION MODEL : SLTRGB35066B [Approved Rank : VF S , CIE(S1, S2), IV(AAA, AAB, AAC, ABA, ABB, ABC,BAA, BAB, BAC, BBA, BBB, BBC)] RGBW TOP VIEW CUSTOMER : CUSTOMER : DRAWN CHECKED APPROVED SAMSUNG ELECTRO-MECHANICS

MARK S2

Abstract: N2222
Contextual Info: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D22.4A LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D BASE PLANE S2 Q -C- SEATING PLANE A L S1 eA

MARK S2

Contextual Info: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D42.6 LEAD FINISH 42 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D BASE PLANE S2 Q -C- SEATING PLANE A L S1 eA A A

SGS thomson power schottky

Abstract: TDB 1033 8J17
Contextual Info: SbE D • 7TST237 GG3flôflb S2ê ■S û T H _ SCS-THOMSON ttr-n-oi ¡ILJOT «! s G S-THOMSON TS5070 TS5071 PROGRAMMABLE CODEC/FILTER COMBO 2ND GENERATION COM PLETE CODEC AND FILTER SYSTEM IN­ CLUDING : . TRANSM IT AND RECEIVE PCM CHANNEL FILTERS

Contextual Info: S2 Virtex -E 1.8 V Extended Memory Field Programmable Gate Arrays R DS025 v1.0 March 23, 2000 3* Advance Product Specification Features • • • • • • • • • • Fast, Extended Block RAM, 1.8 V FPGA Family - 560 kb and 1,120 kb embedded block RAM

AD7513KH

Abstract: AD7513KN AD7513 AD7513JH AD7513JN
Contextual Info: CMOS Dual SPST Analog Switch ANALOG DEVICES FEATURES " O N " Resistance: 55S2 Break-Before-Make Switching Power Dissipation: 3m W D T L /T T L C M O S Com patible Switch Current: 5 0 m A Replaces D G -200 J-O S 1 Al O OD1 O S2 A 2 0 —I •OD2 r GND " i "

Contextual Info: Si1040X Vishay Siliconix Load Switch with Level-Shift FEATURES PRODUCT SUMMARY VDS2 V 1.8 to 8 RDS(on) () ID (A) 0.625 at VIN = 4.5 V ± 0.43 0.890 at VIN = 2.5 V ± 0.36 1.25 at VIN = 1.8 V ± 0.3 Si1040X 4 2, 3 S2 D2 Q2 • Halogen-free According to IEC 61249-2-21

Contextual Info: Si1040X Vishay Siliconix Load Switch with Level-Shift FEATURES PRODUCT SUMMARY VDS2 V 1.8 to 8 RDS(on) () ID (A) 0.625 at VIN = 4.5 V ± 0.43 0.890 at VIN = 2.5 V ± 0.36 1.25 at VIN = 1.8 V ± 0.3 Si1040X 4 2, 3 S2 D2 Q2 • Halogen-free According to IEC 61249-2-21

Contextual Info: Si1040X Vishay Siliconix Load Switch with Level-Shift FEATURES PRODUCT SUMMARY VDS2 V 1.8 to 8 RDS(on) () ID (A) 0.625 at VIN = 4.5 V ± 0.43 0.890 at VIN = 2.5 V ± 0.36 1.25 at VIN = 1.8 V ± 0.3 Si1040X 4 2, 3 S2 D2 Q2 • Halogen-free According to IEC 61249-2-21

k 2544 MOSFET

Contextual Info: Si1040X Vishay Siliconix Load Switch with Level-Shift FEATURES PRODUCT SUMMARY VDS2 V 1.8 to 8 RDS(on) () ID (A) 0.625 at VIN = 4.5 V ± 0.43 0.890 at VIN = 2.5 V ± 0.36 1.25 at VIN = 1.8 V ± 0.3 Si1040X 4 2, 3 S2 D2 Q2 • Halogen-free According to IEC 61249-2-21

Contextual Info: Si1025X Vishay Siliconix P-Channel 60 V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (min) (V) RDS(on) () VGS(th) (V) ID (mA) - 60 4 at VGS = - 10 V - 1 to - 3.0 - 500 SC-89 1 G1 2 5 G2 D2 3 4 S2 6 BENEFITS D1 S1 • Halogen-free According to IEC 61249-2-21

Contextual Info: Si1040X Vishay Siliconix Load Switch with Level-Shift FEATURES PRODUCT SUMMARY VDS2 V 1.8 to 8 RDS(on) () ID (A) 0.625 at VIN = 4.5 V ± 0.43 0.890 at VIN = 2.5 V ± 0.36 1.25 at VIN = 1.8 V ± 0.3 Si1040X 4 2, 3 S2 D2 Q2 • Halogen-free According to IEC 61249-2-21

cdip2-t16

Abstract: CDIP2-T16 DIMENSIONS
Contextual Info: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D

MARK S2

Abstract: CDIP2-T22
Contextual Info: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D22.4 MIL-STD-1835 CDIP2-T22 (D-7, CONFIGURATION C) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D

CDIP2-T18

Abstract: 2N18 18-LEAD D-6 PACKAGE
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D18.3 MIL-STD-1835 CDIP2-T18 (D-6, CONFIGURATION C) LEAD FINISH c1 -A- 18 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

CDIP2-T28

Abstract: D-10
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C) LEAD FINISH c1 -A- 28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

CDIP2-T20

Abstract: MARK S2 per d203
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D20.3 MIL-STD-1835 CDIP2-T20 (D-8, CONFIGURATION C) LEAD FINISH c1 -A- 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

CDIP4-T24

Abstract: MARK S2 CDIP4-T24 DIMENSIONS
Contextual Info: Ceramic Packages Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D24.3 MIL-STD-1835 CDIP4-T24 (D-9, CONFIGURATION C) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S

MARK S2

Contextual Info: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D40.6 MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D

CDIP2-T40

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D40.6 MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C) LEAD FINISH c1 -A- 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

Braze Dual-In-Line 16 Packages

Abstract: CDIP2-T16
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH c1 -A- 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

CDIP2-T8

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C) LEAD FINISH 8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES