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    FG900 Price and Stock

    AMD XC7Z045-2FFG900I

    IC SOC CORTEX-A9 800MHZ 900FCBGA
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    DigiKey XC7Z045-2FFG900I Tray 32 1
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    AMD XC7Z100-2FFG900I

    IC SOC CORTEX-A9 800MHZ 900FCBGA
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    AMD XC7K410T-2FFG900I

    IC FPGA 500 I/O 900FCBGA
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    AMD XC7K325T-2FFG900C

    IC FPGA 500 I/O 900FCBGA
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    DigiKey XC7K325T-2FFG900C Tray 9 1
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    AMD XC7K410T-1FFG900C

    IC FPGA 500 I/O 900FCBGA
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    DigiKey XC7K410T-1FFG900C Tray 7 1
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    Mouser Electronics XC7K410T-1FFG900C 5
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    FG900 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    FG900

    Abstract: No abstract text available
    Text: R Fine Pitch BGA FG900 Package PK038 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    FG900) PK038 FG900 PDF

    FGG900

    Abstract: FG900 UG112 MS-034
    Text: Fine-Pitch BGA FG900/FGG900 Package PK038 (v1.4) November 12, 2009 X-Ref Target - Figure 1 PK038_01_110309 2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries.


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    FG900/FGG900) PK038 UG112, MS-034. FGG900 FG900 UG112 MS-034 PDF

    PK500

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for Spartan -3 FG900 Cu Wire Package PK500 (v1.1) March 19, 2012 Average Weight: 3.949 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3


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    FG900 PK500 PK500 PDF

    FG900

    Abstract: PK038
    Text: R Fine-Pitch BGA FG900 Package PK038 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    FG900) PK038 FG900 PK038 PDF

    SPARTAN-3 XC3S400 PQ208

    Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
    Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,


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    DS099-1 XC3S50CP132, XC3S2000FG456, XC3S4000FG676 DS099-1, DS099-2, DS099-3, DS099-4, DS313, DS314-1, SPARTAN-3 XC3S400 PQ208 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XILINX SPARTAN VQG100 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    XCF00S

    Abstract: spartan 3a FGG900 DS099 XCN07010
    Text: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.


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    ds313 DS313 XCN07010, SSTL18 XCF00S spartan 3a FGG900 DS099 XCN07010 PDF

    SPARTAN-3

    Abstract: DS099 XCF00S FGG900
    Text: ds313.fm Page 1 Thursday, September 15, 2005 11:39 AM Spartan-3L Low Power FPGA Family R DS313 v1.1 September 15, 2005 Preliminary Product Specification Introduction Spartan -3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members


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    ds313 DS313 SSTL18 SPARTAN-3 DS099 XCF00S FGG900 PDF

    XAPP133

    Abstract: vhdl code for lvds driver d flip-flop PCI33 PQ240 TQ144 BG352 BG432 CS144 HQ240
    Text: Application Note: Virtex Series R Using the Virtex SelectI/O Resource XAPP133 v2.6 November 5, 2002 Summary The Virtex FPGA series includes a highly configurable, high-performance SelectI/O™ resource to provide support for a wide variety of I/O standards. The SelectI/O resource is a


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    XAPP133 XAPP133 vhdl code for lvds driver d flip-flop PCI33 PQ240 TQ144 BG352 BG432 CS144 HQ240 PDF

    SPARTAN-3 XC3S400 PQ208

    Abstract: XC3S400 PQ208 xc3s2000 fg676 XC3S200 PQ208
    Text: Spartan-3 1.2V FPGA Family: Introduction and Ordering Information R DS099-1 v1.1 April 24, 2003 Advance Product Specification Introduction The 1.2V Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.


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    DS099-1 XC3S5000 FG1156 1156-ball XC3S50. DS099-1, DS099-2, DS099-3, DS099-4, SPARTAN-3 XC3S400 PQ208 XC3S400 PQ208 xc3s2000 fg676 XC3S200 PQ208 PDF

    Untitled

    Abstract: No abstract text available
    Text: 89 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics Product Specification DS162 v3.0 October 17, 2011 Spartan-6 FPGA Electrical Characteristics Spartan -6 LX and LXT FPGAs are available in various speed grades, with -3 having the highest performance. The DC and


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    DS162 PDF

    sis 968

    Abstract: vhdl code for complex multiplication and addition 200E 300E 400E 600E PCI33 3 bit right left shift register verilog vHDL prog
    Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-2 v2.3 November 9, 2001 Preliminary Product Specification Architectural Description Virtex-E Array The Virtex-E user-programmable gate array, shown in Figure 1, comprises two major configurable elements: configurable logic blocks (CLBs) and input/output blocks (IOBs).


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    DS022-2 XCV2600E XCV3200E DS022-1, DS022-2, DS022-3, DS022-4, sis 968 vhdl code for complex multiplication and addition 200E 300E 400E 600E PCI33 3 bit right left shift register verilog vHDL prog PDF

    diode T25-4

    Abstract: IC AN214 N345 pioneer amplifier an214 XCV1600E ac3 amplifier circuit diagram AN214 amplifier horizontal driver transistor D155 K235 XCV300E-6PQ240C
    Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.2 November 9, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels)


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    DS022-1 32/64-bit, 66-MHz FG1156 XCV3200E DS022-1, DS022-2, DS022-4 DS022-3, diode T25-4 IC AN214 N345 pioneer amplifier an214 XCV1600E ac3 amplifier circuit diagram AN214 amplifier horizontal driver transistor D155 K235 XCV300E-6PQ240C PDF

    Field Programmable Gate Arrays

    Abstract: DS022-1 XCV1000E XCV100E MB 300E FPGA Virtex 6 pin configuration XCV1600E XCV2000E XCV200E XCV300E
    Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.3 July 17, 2002 Production Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels)


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    DS022-1 32/64-bit, 66-MHz DS022-1, DS022-2, DS022-3, DS022-4, Field Programmable Gate Arrays DS022-1 XCV1000E XCV100E MB 300E FPGA Virtex 6 pin configuration XCV1600E XCV2000E XCV200E XCV300E PDF

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100 PDF

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


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    Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package PDF

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 PDF

    Routability

    Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
    Text: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.


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    XAPP157 FG1156 Routability XAPP157 FG676 BGA 23 x 23 array FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball PDF

    FPGA Virtex 6

    Abstract: aj4 diode IO-L93N v1-3 F1 AB29 AG29 ak27 diode PCI33 XAPP235 XCV200
    Text: Application Note: Virtex-E Families R Virtex Package Compatibility Guide XAPP235 v1.3 June 20, 2000 Summary This package compatibility guide describes the pinouts and established guidelines for package compatibility between the Virtex family and the Virtex-E and Virtex-E Extended Memory


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    XAPP235 FG900 XCV1000E XCV812E XCV1000E L264N L264P L279N L279P FPGA Virtex 6 aj4 diode IO-L93N v1-3 F1 AB29 AG29 ak27 diode PCI33 XAPP235 XCV200 PDF

    QF32

    Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
    Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)


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    TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176 PDF

    SPARTAN-3 XC3S400 PQ208

    Abstract: AFG320 SPARTAN-3 XC3S400 microblaze XAPP462 XC3S200 PQ208 pin diagram xc3s400 pinout TQG144
    Text: Spartan-3 FPGA Family: Complete Data Sheet R DS099 July 13, 2004 Advance Product Specification This document includes all four modules of the Spartan -3 FPGA data sheet. Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics


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    DS099 DS099-1 DS099-3 DS099-4 DS099-1, DS099-2, DS099-3, DS099-4, SPARTAN-3 XC3S400 PQ208 AFG320 SPARTAN-3 XC3S400 microblaze XAPP462 XC3S200 PQ208 pin diagram xc3s400 pinout TQG144 PDF

    GSR 10,8

    Abstract: DLL5 BG432 ic 404 BB112 equivalent
    Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.0 April 2, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 Kb to 4 Mb system gates - 130 MHz internal performance (four LUT levels)


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    DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-4 GSR 10,8 DLL5 BG432 ic 404 BB112 equivalent PDF

    XC6SLX45

    Abstract: XC6SLX150 Xilinx Spartan-6 LX9 XC6SLX75 xc6slx150t XC6SLX25CSG324 XC6SLX4 xc6slx16 XC6SLX4 2 CSG225 I XC6SLX25-CSG324
    Text: 80 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics DS162 v2.1 May 20, 2011 Preliminary Product Specification Spartan-6 FPGA Electrical Characteristics Spartan -6 LX FPGAs are available in -3, -3N, -2, and -1L speed grades, with -3 having the highest performance.


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    DS162 XC6SLX45 XC6SLX150 Xilinx Spartan-6 LX9 XC6SLX75 xc6slx150t XC6SLX25CSG324 XC6SLX4 xc6slx16 XC6SLX4 2 CSG225 I XC6SLX25-CSG324 PDF

    xc6slx16

    Abstract: XC6SLX45 XC6SLX25 XC6SLX150 XC6SLX9 XC6SLX16 Spartan-6 LX45 efuse XC6SLX150T SPARTAN 6 DS162 CSG324
    Text: 69 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics DS162 v1.3 February 22, 2010 Advance Product Specification Spartan-6 FPGA Electrical Characteristics Spartan -6 LX FPGAs are available in -3, -2, and -1L speed grades, with -3 having the highest performance. Spartan-6 LXT


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    DS162 xc6slx16 XC6SLX45 XC6SLX25 XC6SLX150 XC6SLX9 XC6SLX16 Spartan-6 LX45 efuse XC6SLX150T SPARTAN 6 DS162 CSG324 PDF