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    84-1LMI

    Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
    Text: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		PDF 400-mil S320CR 84-1LMI Gold1021-ZSC CY7C1021-ZSC 84-1LMI Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity

    CEL9200

    Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
    Text: Cypress Semiconductor Qualification Report QTP# 97416 VERSION 1.0 June, 1998 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V 64K x 16 Static RAM CY7C1019V 128K x 8 Static RAM Cypress Semiconductor, Inc. 1 Meg SRAM - R42D Technology - Fab 4 Device: CY7C1021V/CY7C1019V 7C1321D/7C1319D


    Original     		PDF CY7C1021V CY7C1019V CY7C1021V/CY7C1019V 7C1321D/7C1319D) 44-pin CY7C1021) 32-pin CY7C1019) CEL9200 CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy