Untitled
Abstract: No abstract text available
Text: S57C128FB HIGH SPEED 16K x 8 CMOS EPROM K E Y FEA TU R E S • Fast Access Time • EPI Processing — 35 ns — Latch up Im m unity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661 • Standard EPROM Pinout • DIP and Surface Mount Packaging
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WS57C128FB
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Untitled
Abstract: No abstract text available
Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • Standard EPROM Pinout • Very Fast Access Time — 35 ns • DIP and Surface Mount Packaging Available • Low Power Consumption • EPI Processing — Lalch-up Immunity Up to 200 mA GENERAL DESCRIPTION
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WS57C128FB
MIL-STD-883C
MIL-STD-883C
WS57C128FB-35D
S57C128FB-45D
WS57C128FB-45DMB
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Untitled
Abstract: No abstract text available
Text: bSE T > m ^53^0 0002535 soa h u a f S57C128F WAFER SCALE INTEGRATION HIGH SPEED 16Kx 8 CM OS EPROM FO R M A IN T E N A N C E P U R P O S E S ONLY! N O T TO B E USED FO R N E W D ESIG N S. S E E W S57C 128FB FO R N E W VERSIO N! KEY FEATURES • Fast Access Time
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WS57C128F
128FB
S57C128F
MIL-STD-883C
S57C128F-70CM
S57C128F-70D
WS57C128F-70DI
S57C128F-70DM
S57C128F-70DM
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Untitled
Abstract: No abstract text available
Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • Very Fast Access Time • Standard EPROM Pinout — 35 ns DIP and Surface Mount Packaging Available • Low Power Consumption • EPI Processing — Latch-up Immunity Up to 200 mA GENERAL DESCRIPTION
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WS57C128FB
S57C128FB
MIL-STD-883C
MIL-STD-883C
WS57C128FB-35D
S57C128FB-45D
S57C128FB-45DMB
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Untitled
Abstract: No abstract text available
Text: S57C128F HIGH SPEED 16Kx 8 CMOS EPROM FOR M A IN TE N A N C E PU R PO SES ONLY! N O T TO B E USED FOR N EW DESIGNS. SEE W S57C 128FB FOR N EW VERSION! KEY FEATURES • Fast Access Time • EPI Processing — 55 ns — Latch-up Immunity Up to 200 mA • Low Power Consumption
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WS57C128F
128FB
MIL-STD-883C
MIL-STD-883C
S57C128FB
WS57C128F
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Untitled
Abstract: No abstract text available
Text: WAFER SCALE IN TEGRATION 3TE D EB ^ 5 3 ^ 0 ODOQS'IS 4 E l tilAF _ S57C128F ""p - W AFERSCALE IN TE G R A T IO N , IN C. ~2_°l L\ HIGH SPEED 16K x 8 CM OS EPROM KEY FEATURES • Fast A c c e ss Time — • EPI P ro cessin g
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WS57C128F
T-46-13-29
128F-70D
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5.6V TVS
Abstract: No abstract text available
Text: SME ì> • QÜ01E72 5TÖ «lilAF S57C128F WAFER SCALE INTEGRATION ffc>•“ / 5 — I HIGH SPEED 16K x £ CMOS EPflOM • KEY FEATURES • EPI Processing Fast Access Time — 55 ns — Latch-up Im munity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661
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01E72
WS57C128F
S57C128F
WS57C128F-55D
S57C128F-70CMB
S57C128F-70D
WS57C128F-70DI
S57C128F-70DM
5.6V TVS
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57C128FB-70
Abstract: No abstract text available
Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • EPI Processing • Fast Access Time — 35 ns — Latch-up Immunity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661 • Standard EPROM Pinout * DIP and Surface Mount Packaging Available
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WS57C128FB
MIL-STD-883C
MIL-STD-883C
WS57C128FB-35D
S57C128FB-45D
WS57C128FB-45DMB
57C128FB-70
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A12C
Abstract: WS27C128F WS27C128F-90 WS27C128F-90DM WS57C128FB
Text: W S27C 128F M ILITA R Y 16K x 8 C M O S EPRO M FO R M A IN TE N A N C E PU R PO SES ONLY! N O T TO B E USED FOR N E W DESIGNS. S E E W S57C 128FB FO R N E W D ESIG N S! K E Y FEA TU R ES • Fast Access Time • EPI Processing — 90 ns Over Full Mil Temp Range
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WS27C128F
WS57C128FB
WS27C128F
WS27C128F-90DM
MIL-STD-883C
A12C
WS27C128F-90
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