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    S1025

    Abstract: SC180 SC180.5. Series
    Text: Bulletin I0504J rev. H 03/07 SC180.5. Series SCHOTTKY DIE 180 x 150 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS).


    Original     		PDF I0504J SC180. S1025 SC180R015x5x SC180S020x5x SC180S030x5x 12-Mar-07 SC180 SC180.5. Series

    B1000

    Abstract: S1025 SC180
    Text: Bulletin I0504J rev. B 10/00 SC180.5. Series SCHOTTKY DIE 150 x 180 mils a 0.35 ± 0.01 0.14 ± 0.0004 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). A d b C D Ø 40 (1.57) 3. DIMENSIONS AND TOLERANCES:


    Original     		PDF I0504J SC180. S1025 B1000 SC180

    Untitled

    Abstract: No abstract text available
    Text: Bulletin I0504J rev. E 03/03 SC180.5. Series 157 4040(157) Wafer flat alligned with side bflat of alligned the die with Wafer side b of the die a 0.25 ± 0.01 (10 ± 0.4) c a 0.25 ± 0.01 c (10 ± 0.4) b d C D D d b A C A NOTES: Ø Ø 1. ALL DIMENSIONS ARE SHOWN IN


    Original     		PDF I0504J SC180. S1025

    Untitled

    Abstract: No abstract text available
    Text: Bulletin I0504J rev. H 03/07 SC180.5. Series SCHOTTKY DIE 180 x 150 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c A d b C D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). Ø Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS).


    Original     		PDF I0504J SC180. S1025 SC180R015x5x SC180S020x5x SC180S030x5x SC180S045x5x SC180S060x5x SC180H045x5x SC180H100x5x

    SC180

    Abstract: No abstract text available
    Text: Bulletin I0504J rev. C 05/01 SC180.5. Series SCHOTTKY DIE 150 x 180 mils a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). A d b C D Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 4.57 + 0, - 0.01


    Original     		PDF I0504J SC180. S1025 SC180

    Untitled

    Abstract: No abstract text available
    Text: Bulletin I0504J rev. F 04/03 SC180.5. Series 157 4040(157) Wafer flat alligned with side bflat of alligned the die with Wafer side b of the die a 0.25 ± 0.01 (10 ± 0.4) c a 0.25 ± 0.01 c (10 ± 0.4) b d C D D d b A C A NOTES: Ø Ø 1. ALL DIMENSIONS ARE SHOWN IN


    Original     		PDF I0504J SC180. S1025