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    SIDC56D170E Search Results

    SIDC56D170E Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIDC56D170E Infineon Technologies SIDC56D170E, 1700V, 75A Original PDF
    SIDC56D170E6 Infineon Technologies Fast Switching Diode Chip in EMCON-Technology Original PDF
    SIDC56D170E6X1SA1 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 1.7KV 75A WAFER Original PDF

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    SIDC56D170E6

    Abstract: No abstract text available
    Text: Preliminary SIDC56D170E6 Fast switching diode chip in EMCON-Technology FEATURES: • 1700V EMCON technology 200 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC56D170E6 1700V IF 75A A This chip is used for:


    Original     		PDF SIDC56D170E6 Q67050-A4120A001 L4251M, SIDC56D170E6

    chip diode "sawn on foil"

    Abstract: SIDC56D170E6
    Text: Preliminary SIDC56D170E6 Fast switching diode chip in EMCON-Technology FEATURES: • 1700V EMCON technology 200 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC56D170E6 1700V IF 75A A This chip is used for:


    Original     		PDF SIDC56D170E6 Q67050-A4120A001 L4251M, chip diode "sawn on foil" SIDC56D170E6

    Untitled

    Abstract: No abstract text available
    Text: Preliminary SIDC56D170E6 Fast switching diode chip in EMCON-Technology FEATURES: • 1700V EMCON technology 200 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC56D170E6 1700V IF 75A A This chip is used for:


    Original     		PDF SIDC56D170E6 Q67050-A4120sawn 56the L4251M,

    SIDC56D170E6

    Abstract: soft solder die bonding 72008
    Text: SIDC56D170E6 Fast switching diode chip in Emitter Controlled -Technology Features: • 1700V technology, Emitter Controlled • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power modules and discrete


    Original     		PDF SIDC56D170E6 SIDC56 D170E6 L4251N, SIDC56D170E6 soft solder die bonding 72008

    Untitled

    Abstract: No abstract text available
    Text: Preliminary SIDC56D170E6 Fast switching diode chip in EMCON-Technology FEATURES: • 1700V EMCON technology 200 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC56D170E6 1700V IF 75A A This chip is used for:


    Original     		PDF SIDC56D170E6 Q67050-A4120sawn 56the L4251M,

    SIDC56D170E

    Abstract: No abstract text available
    Text: Preliminary SIDC56D170E Fast switching diode chip in EMCON-Technology FEATURES: • 1700V EMCON technology 200 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient Chip Type VCE SIDC56D170E 1700V ICn 75A A This chip is used for:


    Original     		PDF SIDC56D170E 50mm2 4251C, SIDC56D170E