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    SIGC04T60GS Price and Stock

    Infineon Technologies AG SIGC04T60GSX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60GSX1SA1)
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    Avnet Americas SIGC04T60GSX1SA1 Waffle Pack 885
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    Infineon Technologies AG SIGC04T60GSEX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60GSEX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC04T60GSEX1SA1 Waffle Pack 783
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    SIGC04T60GS Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIGC04T60GS Infineon Technologies For drives-, white goods and resonant applications, Trench- and Fieldstop technology low threshold voltage Original PDF

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    Abstract: No abstract text available
    Text: SIGC04T60GS 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC04T60GS VCE ICn 600V 6A This chip is used for:


    Original
    PDF SIGC04T60GS Q67050A4332-A101 L7501D,

    IKP06N60T

    Abstract: SIGC04T60GS
    Text: SIGC04T60GS 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC04T60GS VCE ICn 600V 6A This chip is used for:


    Original
    PDF SIGC04T60GS Q67050A4332-A101 L7501D, IKP06N60T SIGC04T60GS