MO-224
Abstract: JEDEC MO 224 DM-7D4-H2400 SODIMM DDR2 Connector DDR2 layout so-dimm MO224 B2400 socket DDR 0.6mm 200 DM-6D4-B2400 socket DDR
Text: DM-200P CONNECTOR 0.6mm pitch/Socket for DDR/DDR2 S.O.DIMM Specifications ––––––––––––––––––– Socket for DDR/DDR2 S.O.DIMM 200 circuits complying with JEDEC MO-224 . • Easy module inserting/ejecting • 14.0mm height
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Original
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DM-200P
MO-224)
25MAX
DM-6D4-B2400
UL94V-0,
DM-7D4-H2400
UL94V-0
MO-224
JEDEC MO 224
DM-7D4-H2400
SODIMM DDR2 Connector
DDR2 layout so-dimm
MO224
B2400
socket DDR 0.6mm 200
DM-6D4-B2400
socket DDR
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PDF
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Untitled
Abstract: No abstract text available
Text: DM-200P CONNECTOR 0.6mm pitch/Socket for DDR/DDR2 S.O.DIMM Specifications ––––––––––––––––––– Socket for DDR/DDR2 S.O.DIMM 200 circuits complying with JEDEC MO-224 . • Easy module inserting/ejecting • 14.0mm height
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Original
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DM-200P
MO-224)
25MAX
DM-6D4-B2400
UL94V-0,
DM-7D4-H2400
UL94V-0
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PDF
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minidimm
Abstract: 87918-0001 socket DDR 0.6mm 200 244 PIN tba 2003 LR19980 MO-258 238N right angle memory sockets 877830001
Text: 0.6mm .236” Pitch DDR2 miniDIMM Socket 200/244 Circuits FEATURES AND SPECIFICATIONS Molex has expanded the miniDIMM socket family with the Reverse Right Angle, Right Angle and 22.5º Reverse Angle version to be used in wider variety of applications. The miniDIMM memory sockets was designed to accept DDR-2 miniDIMM memory
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Original
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MO-244
MO-258
networki87918-0001
minidimm
87918-0001
socket DDR 0.6mm 200
244 PIN
tba 2003
LR19980
238N
right angle memory sockets
877830001
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PDF
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A4200
Abstract: foxconn dimm socket DDR 0.6mm 200 so-dimm 200 dimm foxconn foxconn 200POS
Text: SPECIFICATIONS DDR SO DIMM Socket AS Series 4.0 mm Height SMT Type 0.6mm [.024”] Pitch 200Pos. Mechanical Contact Retention Force: 0.15kg min. Durability : 25 Cycles Electrical Voltage Rating: 25V Current Rating: 0.3A Contact Resistance: 50mΩ max. Dielectric Withstanding Voltage: 250V AC/1 min.
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Original
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200Pos.
A4200
foxconn dimm
socket DDR 0.6mm 200
so-dimm 200
dimm foxconn
foxconn
200POS
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PDF
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DDR2 SO-DIMM
Abstract: B2400 DDR2 layout so-dimm JEDEC MO 224 MO224 MO-224
Text: DM-200P CONNECTOR 0.6mm pitch/Socket for DDR/DDR2 S.O.DIMM Specifications ––––––––––––––––––– • Current rating: 0.3A AC, DC • Voltage rating: 250V AC, DC • Temperature range: -25˚C to +85˚C including temperature rise in applying
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Original
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DM-200P
MO-224)
DM-6D4-B2400
UL94V-0,
DM-7D4-H2400
UL94V-0
UL94V-0
DDR2 SO-DIMM
B2400
DDR2 layout so-dimm
JEDEC MO 224
MO224
MO-224
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PDF
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SODIMM DDR2 Connector
Abstract: No abstract text available
Text: DM-200P CONNECTOR 0.6mm pitch/Socket for DDR/DDR2 S.O.DIMM Specifications ––––––––––––––––––– • Current rating: 0.3A AC, DC • Voltage rating: 25V AC, DC • Temperature range: -25˚C to +85˚C including temperature rise in applying
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Original
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DM-200P
MO-224)
DM-6D4-B2400
UL94V-0,
DM-7D4-H2400
UL94V-0
SODIMM DDR2 Connector
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PDF
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socket DDR 0.6mm 200
Abstract: DDR drawing
Text: 1 2 3 4 5 6 7 A 8 SPECIFICATIONS Housing Material: Contact Material: Contact Plating: Latch Material: Latch Plating 9 A LCP with 30% G.F. UL94V-0 Brass Gold Plating over Nickel Stainless Steel Tin Over Nickel B B C C D D E F Series Description Date Approved
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Original
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UL94V-0
118XX
118SB
118RB
6mm-5152
DDR-118RB-200-X-6-A-GDX-XX
socket DDR 0.6mm 200
DDR drawing
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PDF
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socket DDR 0.6mm 200
Abstract: DDR drawing
Text: 1 2 3 4 5 6 7 A 8 SPECIFICATIONS Housing Material: Contact Material: Contact Plating: Latch Material: Latch Plating 9 A LCP with 30% G.F. UL94V-0 Brass Gold Plating over Nickel Stainless Steel Tin Over Nickel B B C C D D E F Series Description Date Approved
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Original
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UL94V-0
118XX
118SB
118RB
DDR-118SB-200-X-6-A-GDX-XX
socket DDR 0.6mm 200
DDR drawing
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PDF
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A4200
Abstract: No abstract text available
Text: SPECIFICATIONS DDR SO DIMM Connect ort AS Series 4.0 mm Height SM T Type 0.6mm [.024”] Pitch 200Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 25 Cycles Electrical Voltage Rating: 25V Current Rating: 0.3A Contact Resistance: 50mΩ max.
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Original
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200Pos.
A4200
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PDF
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foxconn dimm
Abstract: No abstract text available
Text: SPECIFICATIONS DDR II SO DIMM Connectort AS Series 4.0 mm Height SM T Type 0.6mm [.024”] Pitch 200Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 25 Cycles Electrical Voltage Rating: 25V Current Rating: 0.3A Contact Resistance: 50mΩ max.
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Original
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200Pos.
foxconn dimm
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PDF
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS DDR II SO DIMM Connectort AS Series 4.0 mm Height SMT Type 0.6mm [.02 4”] Pitch 200 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 25 Cycles Electrical Voltage Rating: 25V Current Rating: 0.3A Contact Resistance: 50mΩ max.
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PDF
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socket DDR 0.6mm 200
Abstract: DDR2 SODIMM
Text: | | | Search Products Documentation Resources My Account Home > Products > By Type > Socket/Card Products 1 - 1565691 Customer Support > Product Feature Selector > Product Details - 1 Product Details Quick Links Memory Sockets Converted to EU RoHS/ELV Compliant
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PDF
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Untitled
Abstract: No abstract text available
Text: | | Searc h Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 292406-5 Product Details Memory Sockets Quick Links Always EU RoHS/ELV Compliant Statement of Compliance
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PDF
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Fast Cycle RAM
Abstract: FCRAM
Text: 0.6mm .0236” Pitch FCRAM *Socket FEATURES AND SPECIFICATIONS Molex introduces FCRAM* memory socket for high performance networking systems. 87901 FCRAM* (Fast Cycle Random Access Memory) is a new technology that evolved from DRAM core architecture, creating memory products with SRAM-like
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1-800-78MOLEX
SNG-058
Fast Cycle RAM
FCRAM
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PDF
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JEDEC MO 224
Abstract: so dimm ddr2 connector MO-224 GS-12-195 DDR2 pcb design MO-237 SODIMM DDR2 Connector so-dimm 200 DDR2 DIMM dimm socket
Text: BOARD TO BOARD CONNECTORS DDR2 MEMORY MODULE SOCKETS DESCRIPTION DDR2 memory module sockets from FCI accept industrystandard FB-DIMM, DIMM, or SO-DIMM assemblies. The sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs and embedded
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Original
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240-position
MO-256.
GS-12-195:
GS-12-364:
MO-224
CDC-DDR2SKT-08/06-E
JEDEC MO 224
so dimm ddr2 connector
MO-224
GS-12-195
DDR2 pcb design
MO-237
SODIMM DDR2 Connector
so-dimm 200
DDR2 DIMM
dimm socket
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PDF
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Untitled
Abstract: No abstract text available
Text: Part Details for P/N: 1376409-1 Products | eCatalog | Brands | Industries | eCommerce | Customer Service | About | Home Current Brand View Home Text Search Alternate Part Search Multiple Part Comparison Alphabetical Search View All Tyco Electronics Brands
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/HTML/222892
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PDF
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DDR3 DIMM
Abstract: 200Pos INNER CARTON LABEL
Text: 107-68838 Packaging Specification 29May09 Rev A DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of DDR3 DIMM ASSY. 订定 DDR3 DIMM ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product
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Original
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29May09
200POS.
335LX230WX26
335LX230WX28
335LX230et
QR-ME-030B
DDR3 DIMM
200Pos
INNER CARTON LABEL
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PDF
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HB54A2568KN-B75B
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 256MB DDR SDRAM S.O.DIMM HB54A2568KN-A75B/B75B/10B 32M words x 64 bits, 2 Banks Description Features The HB54A2568KN is Double Data Rate (DDR) SDRAM Module, mounted 256M bits DDR SDRAM (HM5425161BTT) sealed in TSOP package, and 1
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Original
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256MB
HB54A2568KN-A75B/B75B/10B
HB54A2568KN
HM5425161BTT)
CME0107
E0148H20
HB54A2568KN-B75B
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 512MB DDR SDRAM SO DIMM HB54R5128KN-A75B/B75B/10B 64M words x 64 bits, 2 Banks Features The HB54R5128KN is Double Data Rate (DDR) SDRAM Module, mounted 256M bits DDR SDRAM (HM5425801BTB) sealed in TCP package, and 1 piece of serial EEPROM (2k bits EEPROM) for Presence
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Original
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512MB
HB54R5128KN-A75B/B75B/10B
HB54R5128KN
HM5425801BTB)
M01E0107
E0189H40
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PDF
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HB54R5128KN-10B
Abstract: HB54R5128KN-A75B HB54R5128KN-B75B
Text: DATA SHEET 512MB DDR SDRAM SO DIMM HB54R5128KN-A75B/B75B/10B 64M words x 64 bits, 2 Banks Features The HB54R5128KN is Double Data Rate (DDR) SDRAM Module, mounted 256M bits DDR SDRAM (HM5425801BTB) sealed in TCP package, and 1 piece of serial EEPROM (2k bits EEPROM) for Presence
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Original
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512MB
HB54R5128KN-A75B/B75B/10B
HB54R5128KN
HM5425801BTB)
M01E0107
E0189H40
HB54R5128KN-10B
HB54R5128KN-A75B
HB54R5128KN-B75B
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PDF
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Untitled
Abstract: No abstract text available
Text: Wi5ePjuuer I DDR SO-DIMM Socket 200 Pos. / Bottom Mount 0.6mm Pitch B S 1 34-5220□-50 Features Electrical Spec Memoiy Module Board is retained in the socket by metal latches Easy insertion and withdrawal of Memory Module Board Temperature -2 0 'C to + 8 5 ‘C
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OCR Scan
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50VAC
250VAC
S01CCRLCA9
RVS52
127um
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PDF
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Untitled
Abstract: No abstract text available
Text: Wi5ePjuuer DDR SO-DIMM Socket 200 Pos. / Top Mount 0.6mm Pitch I BS133-5220D-50 Features Electrical Spec Memoiy Module Board is retained in the socket by metal latches Ecsyjreertton ^ w i h M o i Memory Module Board Temperature -20'Cto+85‘C Current: 0.3Amp Max. Voltage : 50VAC Max.
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OCR Scan
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BS133-5220D-50
50VAC
250VAC
127um
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PDF
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Untitled
Abstract: No abstract text available
Text: 4 TH IS DRAWING COPYRIGHT IS U N P U B L IS H E D . 2004 BY ^ C O 2 A RELEASED FOR ALL ELECTRONICS CORPORATION. PUBLICATION RIGHTS NOV ,2004- R EV IS IO N S R E S ER V ED . P LTR 66.8 R 33.4 A A 0.1 REVISED DATE ECR —08 —0291 49 APVD B.W S.Y EXTRACTION
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OCR Scan
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18NOV2008
20EA/TRAY
31MAR2000
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PDF
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DMD-200-RLD9-55
Abstract: sodimm DDR 0.6mm 200 socket DDR 0.6mm 200
Text: REV DESCRIPTION DATE PF Latch 0 5 -0 6 -0 6 ' 71.10 NOTES: MATERIAL: 1. HOUSING: HIGH TEMPERATURE THERMO PLASTIC UL94 V -0, COLOR IVORY 2. CONTACT: COPPER ALLOY 3. LATCH BAR: HIGH TEMPERATURE THERMO PLASTIC UL94 V -0, COLOR BLACK AND IVORY 4. LATCH: STEEL
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OCR Scan
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2002/95/EC
D-200-RLE9-55/Rx
D-200-RSE9-55/Rx
DMD-200-RLD9-55/RX
D-200-RSD9-55/Rx
68FB2GXXZL-C
DMD-200-RLD9-55
sodimm DDR 0.6mm 200
socket DDR 0.6mm 200
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PDF
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